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2024-10
October 27
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November 2
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No events scheduled for October 27, 2024.
10:00 am
October 28 @ 10:00 am
-
11:00 am
Final Finish Layer Deposits for High Frequency
8:00 am
October 29 @ 8:00 am
-
9:00 am
Recurring
Weekly Staff Call
Virtual
10:00 am
October 30 @ 10:00 am
-
11:00 am
SIR Testing meeting
11:00 am
October 30 @ 11:00 am
-
12:00 pm
Inner Layer Copper Balancing – Phase 2
3:00 pm
October 30 @ 3:00 pm
-
4:00 pm
Cu Outer Trace Adhesion
9:00 am
October 31 @ 9:00 am
-
10:00 am
ECM-3 Meeting
6:00 pm
October 31 @ 6:00 pm
-
7:00 pm
Porosity Testing
No events scheduled for November 1, 2024.
No events scheduled for November 2, 2024.
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10:00 am
-
11:00 am
Final Finish Layer Deposits for High Frequency
October 28 @ 10:00 am
-
11:00 am
Final Finish Layer Deposits for High Frequency
Final Finish Layer Deposits for High Frequency
8:00 am
-
9:00 am
Recurring
Weekly Staff Call
October 29 @ 8:00 am
-
9:00 am
Recurring
Weekly Staff Call
Weekly Call to discuss progress on operations
10:00 am
-
11:00 am
SIR Testing meeting
October 30 @ 10:00 am
-
11:00 am
SIR Testing meeting
Meeting
11:00 am
-
12:00 pm
Inner Layer Copper Balancing – Phase 2
October 30 @ 11:00 am
-
12:00 pm
Inner Layer Copper Balancing – Phase 2
Inner Layer Cu Balancing – Phase 2 project meeting
3:00 pm
-
4:00 pm
Cu Outer Trace Adhesion
October 30 @ 3:00 pm
-
4:00 pm
Cu Outer Trace Adhesion
Hopefully had both a CAD source and PCB manufacturer onboard before the meeting or by the end of the meeting.
9:00 am
-
10:00 am
ECM-3 Meeting
October 31 @ 9:00 am
-
10:00 am
ECM-3 Meeting
Meeting
6:00 pm
-
7:00 pm
Porosity Testing
October 31 @ 6:00 pm
-
7:00 pm
Porosity Testing
Where are we on pilot runs
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