Name: SIR Testing meeting
Start: 2023-11-01T09:00:00-05:00
End: 2023-11-01T10:00:00-05:00

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No events scheduled for October 29, 2023.

11:00 am

October 30, 2023 @ 11:00 am - 12:00 pm

Karl Training

2:00 pm

October 31, 2023 @ 2:00 pm - 3:00 pm

Photonic Soldering 2

9:00 pm

October 31, 2023 @ 9:00 pm - 10:00 pm

High Speed Hybrid PWB Project Call

10:00 pm

October 31, 2023 @ 10:00 pm - 11:00 pm

Meeting with Co-Tech on May2024 MM and New Projects

9:00 am

November 1, 2023 @ 9:00 am - 10:00 am

SIR Testing meeting

10:00 am

November 1, 2023 @ 10:00 am - 11:00 am

ECM-3 Meeting

9:00 pm

November 1, 2023 @ 9:00 pm - 10:00 pm

Chin Yee Chemical and HDP Introductory Meeting

11:00 am

November 2, 2023 @ 11:00 am - 12:00 pm

HDP Backdrill Transition Project

12:00 pm

November 2, 2023 @ 12:00 pm - 1:00 pm

Microvia Rel

9:00 am

November 3, 2023 @ 9:00 am - 10:00 am

Effects Of Plating Thickness on CTF at IST Phase 2 Project Call

No events scheduled for November 4, 2023.

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11:00 am - 12:00 pm

Karl Training

October 30, 2023 @ 11:00 am - 12:00 pm

Photonic Soldering 2

October 31, 2023 @ 2:00 pm - 3:00 pm

Photonic Soldering 2

Progress on drop testng and ATC debugging

9:00 pm - 10:00 pm

High Speed Hybrid PWB Project Call

October 31, 2023 @ 9:00 pm - 10:00 pm

High Speed Hybrid PWB Project Call

10:00 pm - 11:00 pm

Meeting with Co-Tech on May2024 MM and New Projects

October 31, 2023 @ 10:00 pm - 11:00 pm

Meeting with Co-Tech on May2024 MM and New Projects

9:00 am - 10:00 am

SIR Testing meeting

November 1, 2023 @ 9:00 am - 10:00 am

ECM-3 Meeting

November 1, 2023 @ 10:00 am - 11:00 am

Chin Yee Chemical and HDP Introductory Meeting

November 1, 2023 @ 9:00 pm - 10:00 pm

Chin Yee Chemical and HDP Introductory Meeting

11:00 am - 12:00 pm

HDP Backdrill Transition Project

November 2, 2023 @ 11:00 am - 12:00 pm

HDP Backdrill Transition Project

Periodic Project Call

12:00 pm - 1:00 pm

Microvia Rel

November 2, 2023 @ 12:00 pm - 1:00 pm

Effects Of Plating Thickness on CTF at IST Phase 2 Project Call

November 3, 2023 @ 9:00 am - 10:00 am

Effects Of Plating Thickness on CTF at IST Phase 2 Project Call

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The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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