Name: Sequential Lamination
Start: 2023-10-04T10:00:00-05:00
End: 2023-10-04T11:00:00-05:00

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7 events found.

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No events scheduled for October 1, 2023.

10:00 am

October 2, 2023 @ 10:00 am - 11:00 am

Final Finish Layer Deposits for High Frequency

11:00 am

October 3, 2023 @ 11:00 am - 12:00 pm

Copper Surface Roughness Model

9:00 am

October 4, 2023 @ 9:00 am - 10:00 am

Microvia Rel

10:00 am

October 4, 2023 @ 10:00 am - 11:00 am

Sequential Lamination

10:00 am

October 5, 2023 @ 10:00 am - 11:00 am

ECM-3 Meeting

No events scheduled for October 6, 2023.

No events scheduled for October 7, 2023.

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10:00 am - 11:00 am

Final Finish Layer Deposits for High Frequency

October 2, 2023 @ 10:00 am - 11:00 am

Final Finish Layer Deposits for High Frequency

Final Finish Layer Deposits for High Frequemcy

11:00 am - 12:00 pm

Copper Surface Roughness Model

October 3, 2023 @ 11:00 am - 12:00 pm

Copper Surface Roughness Model

Surface roughness modeling of copper surface treatments as a prelude to SI.

9:00 am - 10:00 am

Microvia Rel

October 4, 2023 @ 9:00 am - 10:00 am

Microvia Rel

Updates from Jason and Kevin Work on presentation for Members' Meeting

10:00 am - 11:00 am

Sequential Lamination

October 4, 2023 @ 10:00 am - 11:00 am

ECM-3 Meeting

October 5, 2023 @ 10:00 am - 11:00 am

ECM-3 Meeting

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The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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