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2021-02
February 7
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February 13
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No events scheduled for February 7, 2021.
10:00 am
February 8, 2021 @ 10:00 am
-
11:00 am
Damaged Materials Discussion
2:00 pm
February 9, 2021 @ 2:00 pm
-
3:00 pm
PCB Feature Miniaturization
12:00 pm
February 10, 2021 @ 12:00 pm
-
1:00 pm
Low Ag Alloy Solderpaste BGA Feb 10, 2021 meeting
WebEx
10:00 am
February 11, 2021 @ 10:00 am
-
11:00 am
DISC2A
1:00 pm
February 11, 2021 @ 1:00 pm
-
2:00 pm
Cu Peel Strength Phase 2 Feb 11, 2021 meeting
WebEx
8:00 am
February 12, 2021 @ 8:30 am
-
9:30 am
NPL QFN Discussion
No events scheduled for February 13, 2021.
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11:00 pm
12:00 am
10:00 am
-
11:00 am
Damaged Materials Discussion
February 8, 2021 @ 10:00 am
-
11:00 am
Damaged Materials Discussion
Discussion
2:00 pm
-
3:00 pm
PCB Feature Miniaturization
February 9, 2021 @ 2:00 pm
-
3:00 pm
PCB Feature Miniaturization
Status of contracts 2.6.27 possible tester? Design progress
12:00 pm
-
1:00 pm
Low Ag Alloy Solderpaste BGA Feb 10, 2021 meeting
February 10, 2021 @ 12:00 pm
-
1:00 pm
Low Ag Alloy Solderpaste BGA Feb 10, 2021 meeting
Low Ag Alloy Solderpaste BGA Feb 10, 2021 meeting
10:00 am
-
11:00 am
DISC2A
February 11, 2021 @ 10:00 am
-
11:00 am
DISC2A
Status of negotiations with IMEC. Thilo and Jason samples to Hua? If so, any results from Hua?
1:00 pm
-
2:00 pm
Cu Peel Strength Phase 2 Feb 11, 2021 meeting
February 11, 2021 @ 1:00 pm
-
2:00 pm
Cu Peel Strength Phase 2 Feb 11, 2021 meeting
Continue defining the project
8:30 am
-
9:30 am
NPL QFN Discussion
February 12, 2021 @ 8:30 am
-
9:30 am
NPL QFN Discussion
Discuss update on NPL status
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