April 30 @ 9:00 am - 10:00 am CDT

Investigate New Test Methods for Copper Foil Adhesion Project Call

Investigate New Test Methods for Copper Foil Adhesion Project Call

April 30 @ 10:00 am - 11:00 am CDT

Thin Dielectric Skew Project

Project Meeting

April 30 @ 11:00 am - 12:00 pm CDT

Sequential Lamination Meeting

Meeting

April 30 @ 3:00 pm - 4:00 pm CDT

Cu Outer Trace Adhesion

Talk about a phase 2