April 23 @ 10:00 am - 11:00 am CDT PCB Flatness at Lg Package Attach April 23 @ 10:00 am - 11:00 am CDT PCB Flatness at Lg Package Attach Meeting
April 23 @ 4:00 pm - 5:00 pm CDT Glass Substrate Reliability Analysis April 23 @ 4:00 pm - 5:00 pm CDT Glass Substrate Reliability Analysis Glass Substrate Reliability Analysis
April 23 @ 7:00 pm - 8:00 pm CDT Porosity Testing April 23 @ 7:00 pm - 8:00 pm CDT Porosity Testing Finish final report? Work on presentations for Closeout and Phase 2
April 28 @ 10:00 am - 11:00 am CDT Stacked Microvia Capability Improvement April 28 @ 10:00 am - 11:00 am CDT Stacked Microvia Capability Improvement Meeting
April 28 @ 12:00 pm - 1:00 pm CDT Paste Interconnect Exploratory Meeting April 28 @ 12:00 pm - 1:00 pm CDT Paste Interconnect Exploratory Meeting Meeting
April 28 @ 2:00 pm - 3:00 pm CDT Effect of Metal Additions on Solder Joint Reliability Project Call April 28 @ 2:00 pm - 3:00 pm CDT Effect of Metal Additions on Solder Joint Reliability Project Call Periodic Project Call
April 29 @ 10:00 am - 11:00 am CDT Pb Free Materials 7 Project Call April 29 @ 10:00 am - 11:00 am CDT Pb Free Materials 7 Project Call Meeting
April 30 @ 9:00 am - 10:00 am CDT Investigate New Test Methods for Copper Foil Adhesion Project Call April 30 @ 9:00 am - 10:00 am CDT Investigate New Test Methods for Copper Foil Adhesion Project Call Investigate New Test Methods for Copper Foil Adhesion Project Call
April 30 @ 10:00 am - 11:00 am CDT Thin Dielectric Skew Project April 30 @ 10:00 am - 11:00 am CDT Thin Dielectric Skew Project Project Meeting
April 30 @ 11:00 am - 12:00 pm CDT Sequential Lamination Meeting April 30 @ 11:00 am - 12:00 pm CDT Sequential Lamination Meeting Meeting