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42 events found.
Calendar of Events
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Thin Dielectric Skew Project Kickoff
Thin Dielectric Skew Project Kickoff
This new HDP project seeks to determine the worst case electrical skew that is now possible when using thinner dielectrics, and how much electrical skew can be mitigated by changing the orientation / alignme...
Correlating CF Profile to Signal Integrity Project Call
Correlating CF Profile to Signal Integrity Project Call
Correlating CF Profile to Signal Integrity Project Call
2 events,
D-Coupon IST CITC Reliability Testing
D-Coupon IST CITC Reliability Testing
Project to measure and compare sensitivity of each test method to preconditioning/assembly reflow profile difference(s) that significantly impact long term reliability.
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Thin Dielectric Skew Project Kickoff
Thin Dielectric Skew Project Kickoff
New HDP project investigating the impact of thin dielectrics on electric skew
Investigate New Test Methods for Copper Foil Adhesion Project Call
Investigate New Test Methods for Copper Foil Adhesion Project Call
Investigate New Test Methods for Copper Foil Adhesion Project Call
2 events,
TCE Materials -test method validation
TCE Materials -test method validation
Validating CTE measurements. Continued defining the test plan.
Kick off Meeting for PCB Flatness at Large Package Attach Locations
Kick off Meeting for PCB Flatness at Large Package Attach Locations
Kick off Meeting for PCB Flatness at Large Package Attach Locations
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Reflow Cycle Via Reliability Impact SMTAi Paper Review
Reflow Cycle Via Reliability Impact SMTAi Paper Review
Reflow Cycle Via Reliability Impact SMTAi Paper Review
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Investigate New Test Methods for Copper Foil Adhesion Project Call
Investigate New Test Methods for Copper Foil Adhesion Project Call
Investigate New Test Methods for Copper Foil Adhesion Project Call
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AV Test For Nov 2025 Member Meeting at The Hub Murray Hill
AV Test For Nov 2025 Member Meeting at The Hub Murray Hill
Member Meeting Prep.
I plan to arrive at the hotel at 1 PM. I should be on-line by 1:10 PM. I need a couple of remote attendees to fully test the setup. Please join if you can.
Thanks,
Madan
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Reflow Cycle Via Reliability Impact SMTAi Paper Review
Reflow Cycle Via Reliability Impact SMTAi Paper Review
Reflow Cycle Via Reliability Impact SMTAi Paper Review
TCE Materials x-Y test method validation
TCE Materials x-Y test method validation
Review test parameters.
finalize particpants
Request implementation