BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20250309T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20251102T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20250804T150000Z
DTEND:20250804T160000Z
DTSTAMP:20260417T195754
CREATED:20250721T152607Z
LAST-MODIFIED:20250721T152607Z
UID:36320-1754301600-1754305200@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-68/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250805T170000Z
DTEND:20250805T180000Z
DTSTAMP:20260417T195754
CREATED:20250708T134203Z
LAST-MODIFIED:20250708T134203Z
UID:36254-1754395200-1754398800@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-project-call-13/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250806T140000Z
DTEND:20250806T150000Z
DTSTAMP:20260417T195754
CREATED:20250709T141833Z
LAST-MODIFIED:20250709T141833Z
UID:36255-1754470800-1754474400@hdpusergroup.org
SUMMARY:CAF Eq
DESCRIPTION:Updates on: \nFA \nData analysis \nProject report 
URL:https://hdpusergroup.org/event/caf-eq-6/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250806T150000Z
DTEND:20250806T160000Z
DTSTAMP:20260417T195754
CREATED:20250805T194228Z
LAST-MODIFIED:20250805T194228Z
UID:36402-1754474400-1754478000@hdpusergroup.org
SUMMARY:Project discussion
DESCRIPTION:meeting discussion 
URL:https://hdpusergroup.org/event/project-discussion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250807T140000Z
DTEND:20250807T150000Z
DTSTAMP:20260417T195754
CREATED:20250716T142419Z
LAST-MODIFIED:20250716T142419Z
UID:36278-1754557200-1754560800@hdpusergroup.org
SUMMARY:ECM-4
DESCRIPTION:Develop a test vehicle design and test method for determining whether printed board soldermask application is sufficient protection against corrosion. 
URL:https://hdpusergroup.org/event/ecm-4-9/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250807T150000Z
DTEND:20250807T160000Z
DTSTAMP:20260417T195754
CREATED:20250710T153203Z
LAST-MODIFIED:20250710T153203Z
UID:36261-1754560800-1754564400@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-46/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250807T160000Z
DTEND:20250807T160000Z
DTSTAMP:20260417T195754
CREATED:20250724T191926Z
LAST-MODIFIED:20250724T191926Z
UID:36347-1754564400-1754564400@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Roughness Model for signal integrity. 
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-18/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250807T160000Z
DTEND:20250807T160000Z
DTSTAMP:20260417T195754
CREATED:20250724T191936Z
LAST-MODIFIED:20250724T191936Z
UID:36348-1754564400-1754564400@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Roughness Model for signal integrity. 
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-19/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250807T160000Z
DTEND:20250807T170000Z
DTSTAMP:20260417T195754
CREATED:20250724T191957Z
LAST-MODIFIED:20250724T191957Z
UID:36349-1754564400-1754568000@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Roughness Model for signal integrity. 
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-20/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250807T210000Z
DTEND:20250807T220000Z
DTSTAMP:20260417T195754
CREATED:20250717T215625Z
LAST-MODIFIED:20250717T215625Z
UID:36315-1754582400-1754586000@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysi 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-21/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250812T150000Z
DTEND:20250812T160000Z
DTSTAMP:20260417T195754
CREATED:20250722T171025Z
LAST-MODIFIED:20250722T171025Z
UID:36327-1754992800-1754996400@hdpusergroup.org
SUMMARY:Stacked vs. Staggered Microvias
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-vs-staggered-microvias-7/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250812T160000Z
DTEND:20250812T170000Z
DTSTAMP:20260417T195754
CREATED:20250805T192328Z
LAST-MODIFIED:20250805T192328Z
UID:36306-1754996400-1755000000@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-35/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250813T140000Z
DTEND:20250813T150000Z
DTSTAMP:20260417T195754
CREATED:20250730T155831Z
LAST-MODIFIED:20250730T155831Z
UID:36359-1755075600-1755079200@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project Kickoff
DESCRIPTION:New HDP project investigating the impact of thin dielectrics on electric skew 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-kickoff-4/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250813T200000Z
DTEND:20250813T210000Z
DTSTAMP:20260417T195754
CREATED:20250723T130351Z
LAST-MODIFIED:20250723T130351Z
UID:36329-1755097200-1755100800@hdpusergroup.org
SUMMARY:Cu Trace Adhesion
DESCRIPTION:Up date on build 
URL:https://hdpusergroup.org/event/cu-trace-adhesion/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250814T000000Z
DTEND:20250814T010000Z
DTSTAMP:20260417T195754
CREATED:20250724T003418Z
LAST-MODIFIED:20250724T003418Z
UID:36335-1755111600-1755115200@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-6/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250814T160000Z
DTEND:20250814T170000Z
DTSTAMP:20260417T195754
CREATED:20250731T162634Z
LAST-MODIFIED:20250731T162634Z
UID:36372-1755169200-1755172800@hdpusergroup.org
SUMMARY:TCE Materials -test method validation
DESCRIPTION:Validating CTE measurements. Continued defining the test plan. 
URL:https://hdpusergroup.org/event/tce-materials-test-method-validation-2/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250814T170000Z
DTEND:20250814T180000Z
DTSTAMP:20260417T195754
CREATED:20250804T215448Z
LAST-MODIFIED:20250804T215448Z
UID:36356-1755172800-1755176400@hdpusergroup.org
SUMMARY:Kick off Meeting for PCB Flatness at Large Package Attach Locations
DESCRIPTION:Kick off Meeting for PCB Flatness at Large Package Attach Locations 
URL:https://hdpusergroup.org/event/kick-off-meeting-for-pcb-flatness-at-large-package-attach-locations/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250818T150000Z
DTEND:20250818T160000Z
DTSTAMP:20260417T195754
CREATED:20250804T160220Z
LAST-MODIFIED:20250804T160220Z
UID:36375-1755511200-1755514800@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-69/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250820T140000Z
DTEND:20250820T150000Z
DTSTAMP:20260417T195754
CREATED:20250807T151947Z
LAST-MODIFIED:20250807T151947Z
UID:36497-1755680400-1755684000@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-47/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250820T150000Z
DTEND:20250820T160000Z
DTSTAMP:20260417T195754
CREATED:20250813T160614Z
LAST-MODIFIED:20250813T160614Z
UID:36647-1755684000-1755687600@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-ups
DESCRIPTION:Update on build 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-10/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250820T160000Z
DTEND:20250820T170000Z
DTSTAMP:20260417T195754
CREATED:20250709T161853Z
LAST-MODIFIED:20250709T161853Z
UID:36256-1755687600-1755691200@hdpusergroup.org
SUMMARY:Sequential Lamination
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-23/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250821T010000Z
DTEND:20250821T020000Z
DTSTAMP:20260417T195754
CREATED:20250731T010920Z
LAST-MODIFIED:20250731T010920Z
UID:36364-1755720000-1755723600@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-23/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250821T130000Z
DTEND:20250821T140000Z
DTSTAMP:20260417T195754
CREATED:20250812T171408Z
LAST-MODIFIED:20250812T171408Z
UID:36367-1755763200-1755766800@hdpusergroup.org
SUMMARY:HDP D-Coupon IST CITC Reliability Testing
DESCRIPTION:D-Coupon IST CITC Reliability Testing project meeting 
URL:https://hdpusergroup.org/event/hdp-d-coupon-ist-citc-reliability-testing/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250821T140000Z
DTEND:20250821T150000Z
DTSTAMP:20260417T195754
CREATED:20250731T014639Z
LAST-MODIFIED:20250731T014639Z
UID:36260-1755766800-1755770400@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact SMTAi Paper Review
DESCRIPTION:Reflow Cycle Via Reliability Impact SMTAi Paper Review 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-smtai-paper-review-2/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250821T150000Z
DTEND:20250821T160000Z
DTSTAMP:20260417T195754
CREATED:20250807T142849Z
LAST-MODIFIED:20250807T142849Z
UID:36496-1755770400-1755774000@hdpusergroup.org
SUMMARY:ECM-4
DESCRIPTION:ECM Phase 4 Project Meeting 
URL:https://hdpusergroup.org/event/ecm-4-10/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250821T160000Z
DTEND:20250821T170000Z
DTSTAMP:20260417T195754
CREATED:20250724T162327Z
LAST-MODIFIED:20250724T162327Z
UID:36344-1755774000-1755777600@hdpusergroup.org
SUMMARY:Single Surface Finish 2
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-13/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250821T193000Z
DTEND:20250821T203000Z
DTSTAMP:20260417T195754
CREATED:20250821T175908Z
LAST-MODIFIED:20250821T175908Z
UID:36890-1755786600-1755790200@hdpusergroup.org
SUMMARY:Meeting ics problem
DESCRIPTION:Call to record Jim's screen. Attend if you can. 
URL:https://hdpusergroup.org/event/meeting-ics-problem/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250821T210000Z
DTEND:20250821T220000Z
DTSTAMP:20260417T195754
CREATED:20250807T231217Z
LAST-MODIFIED:20250807T231217Z
UID:36518-1755792000-1755795600@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-22/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250822T020000Z
DTEND:20250822T030000Z
DTSTAMP:20260417T195754
CREATED:20250821T195447Z
LAST-MODIFIED:20250821T195447Z
UID:36892-1755810000-1755813600@hdpusergroup.org
SUMMARY:Test meeting
DESCRIPTION:Looking for the two notices 
URL:https://hdpusergroup.org/event/test-meeting-4/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250823T020000Z
DTEND:20250822T030000Z
DTSTAMP:20260417T195754
CREATED:20250819T160920Z
LAST-MODIFIED:20250819T160920Z
UID:36765-1755896400-1755896400@hdpusergroup.org
SUMMARY:Testing Kevin Notices
DESCRIPTION:Testing meeting notices with Kevin Knadle 
URL:https://hdpusergroup.org/event/testing-kevin-notices-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR