High Density Packaging User Group (HDP) is pleased to announce that Nittobo has become a member.
“We are honored to join HDP User Group and collaborate with world-leading companies in the electronics packaging industry,” said Ken Fukui, Product Development Group Manager, Technical Development Department, Electronic Materials Business Division at Nittobo. “As a pioneer in high-performance glass fiber technologies, including our low-dielectric NE/NER™-Glass and low-thermal-expansion T-Glass, Nittobo is committed to driving advancements in next-generation semiconductor packages and high-speed infrastructure. We look forward to contributing our material expertise to HDP’s collaborative projects to address key industry challenges together.”
“I am delighted to extend a warm welcome to Nittobo to the HDP community, joining the esteemed membership dedicated to the evaluation of advanced electronic and material technologies,” said Larry Marcanti, Executive Director of HDP User Group. “HDP fosters a distinctive environment where industry leaders can collaborate to address shared challenges and propel innovation. We eagerly anticipate partnering with Nittobo and contributing to the development of practical solutions that fortify the electronics ecosystem and supply chain, particularly for high-speed, high-frequency applications.”
About Nittobo
Founded in 1923, Nittobo is a pioneer that successfully commercialized glass fiber for the first time in the world. Through its Electronic Materials Business Division, the company manufactures advanced glass fibers leveraging proprietary composition technologies—including T-Glass with low thermal expansion and high elasticity, as well as NE-Glass and NER™-Glass with superior low-dielectric properties. Commandingly holding a top global market share, Nittobo’s materials play a vital role in curbing substrate warp and enhancing high-speed signal transmission for advanced semiconductor packages and AI infrastructure. As an indispensable industry partner, Nittobo’s membership in HDP will undoubtedly reinforce the consortium’s foundation for collaborative innovation.