High Density Packaging User Group (HDP) and the Global Electronics Association are pleased to announce the release of a new test method, IPC-TM-650-2.2.23, based on the results of HDP’s Non-Contact Copper Foil Profile project.
“This is a significant development as it relates to high-speed, high-performance applications where lower profile copper roughness is necessary,” said Larry Marcanti, Executive Director of HDP User Group. “We thank Tsuyoshi Hiroaki-san of Mitsui-Kinzoku for his leadership of the Non-Contact Copper Foil Profile project and his continued leadership and efforts in the Correlating Copper Foil Profile to Signal Integrity project.”
“The work done by HDP provided us with the empirical data necessary to create this new test method,” said Matt Kelly, CTO, VP Technology Solutions at Global Electronics Association. “We are excited to continue and grow our collaboration with HDP, ensuring standards and test methods keep pace with the latest technology developments and are backed by strong technical data.”
About Global Electronics Association
The Global Electronics Association, formerly known as IPC, is the leading voice of the $6 trillion global electronics industry. Since 1957, we’ve supported the growth and success of more than 3,000 member companies across the electronics supply chain, from design and printed boards to advanced packaging, assembly, and testing.
As a member-driven organization, we deliver internationally recognized standards, trusted certification programs, workforce education, market intelligence, and public policy advocacy to strengthen and advance the global electronics ecosystem. Our mission is to enable better electronics for a better world through smarter collaboration, resilient supply chains, and shared innovation.
With global headquarters in Bannockburn, Illinois, the Global Electronics Association has operations in Belgium, China, Germany, India, Japan, Korea, Malaysia, Mexico, Taiwan, and the United States and a presence across dozens more countries to support its members.