Name: Investigate New Test Methods for Copper Foil Adhesion Project Call
Start: 2026-06-11T10:00:00-05:00
End: 2026-06-11T11:00:00-05:00

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Investigate New Test Methods for Copper Foil Adhesion Project Call

June 11 @ 10:00 am - 11:00 am CDT

« ECM-4
TCE Materials-CTE Validation »

The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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