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Latest Project Activity
December 07, 2021
Back drill to Primary via Transition
The project proposal is to investigate the defects and anomalies found in back drilled vias including “resin pull away/non-adhesion”, “no epoxy bond in the bottom of the back drill”, “…
Most Recent News
November 1, 2021
High Density Packaging User Group Announces Co-Tech Membership
High Density Packaging (HDP) User Group is pleased to announce that Co-Tech Development (Co-Tech) has become a member. “Listening to the Voice of the Customer, uncovering
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