Latest Project Activity

March 27, 2023

Large Footprint BGA Warpage

PCB warpage is a common phenomenon due to material CTE mismatch, copper distribution and PCB processes etc.  For large BGA footprints (e.g. >75mm square), extra warpage on PCB surface and package warpage…

Member Meetings

June 6 @ 6:00 pm - June 7 @ 3:00 am

HDP June 2023 Asia Meeting

hosted by Mitsui Kinzoku

Most Recent News

March 9, 2023

High Density Packaging User Group Announces the Jack Fisher Technical Excellence Award

High Density Packaging (HDP) User Group announces the Jack Fisher Technical Excellence Award to honor the memory of Jack, who passed away on January 20, 2023. […]