Latest Project Activity

December 07, 2021

Back drill to Primary via Transition

The project proposal is to investigate the defects and anomalies found in back drilled vias including “resin pull away/non-adhesion”, “no epoxy bond in the bottom of the back drill”, “…

Member Meetings

Most Recent News

November 1, 2021

High Density Packaging User Group Announces Co-Tech Membership

High Density Packaging (HDP) User Group is pleased to announce that Co-Tech Development (Co-Tech) has become a member. “Listening to the Voice of the Customer, uncovering […]