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Latest Project Activity
August 09, 2022
Board Thickness Effect on ATC Reliability II
Thermal fatigue requirements have always been a priority for the products of most high-reliability end users. Solder joints age and degrade during service and eventually fail by the common wear-out…
October 12 @ 8:00 am - 5:00 pm
HDP Fall Member Meeting
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Most Recent News
June 23, 2022
High Density Packaging User Group Announces Grace Electron Membership
High Density Packaging (HDP) User Group is pleased to announce that Grace Electron Technology Co., LTD. (Grace Electron) has become a member. “Grace Electron is a
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