Latest Project Activity

June 06, 2020

VeCS Technology Evaluation

The High Density Packaging User Group is starting a project to evaluate Vertical Conductive Structures – VeCS.  VeCS is a relatively new patented technology by NextGIn Technology for creating a…

Member Meetings

October 7 @ 8:00 am - October 8 @ 7:00 pm

HDP Fall Member Meeting

hosted by IBM

Most Recent News

June 24, 2020

HDP User Group and IPC Sign MoU Strengthening Collaboration and Value to Membership

Cave Creek, AZ, USA, June 24, 2020 – IPC and High Density Package Users Group (HDP), a trade organization representing companies involved in the supply chain […]