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Latest Project Activity

November 30, 2023

Innerlayer Copper Balancing

“OEMs are requiring tighter backdrill stub length control at higher signal frequencies with Backdrill targeted under BGA, connectors, and DDR memory modules. Due to changes in localized copper density across…

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HDP User Group is a project-oriented industry consortium addressing the integration of new electronics component packaging and interconnect technologies into member company supply chains.

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