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Latest Project Activity
Survey and New Projects
HDP conducted a survey with our members during the February and May meetings to gauge interest in investigating challenges across a broad set of topics. A few key topics emerged as areas of focus: reliability and performance of stacked versus staggered vias; effects of thin dielectric and quartz on electrical skew; copper foil adhesion; and copper foil roughness and treatment on electrical performance. Based on the results of a survey, HDP has launched ten new project initiatives. Two Idea stage projects have begun so far because of these initiatives and more will be launched as initial investigations progress. Visit the Projects page for information on new projects.
About Us
HDP Fall Member Meeting
Save the date!
After two successful member meetings in February and May, planning for the HDP Fall Member Meeting has begun. The meeting is scheduled for November 5 and 6, 2025, and will be hosted by Nokia Bell Labs in Murray Hill, NJ.
In addition to the usual project updates, including several planned close-out presentations, a keynote address will be delivered by Dr. Jung Yoon, Distinguished Engineer & CTO, Supplier Technology & Quality at IBM.
