Collaborate. Create. Solve.
Latest Project Activity
February 20, 2025
Phase 1 quantified the sensitivity of void size & density stacking on core deformation, surface topography for assembly and recommended design approaches focused on Low Loss and Ultra Low-Loss laminates.…
About Us
Our Mission
HDP User Group is a project-oriented industry consortium addressing the integration of new electronics component packaging and interconnect technologies into member company supply chains.
