Latest Project Activity
March 27, 2023
PCB warpage is a common phenomenon due to material CTE mismatch, copper distribution and PCB processes etc. For large BGA footprints (e.g. >75mm square), extra warpage on PCB surface and package warpage…
Most Recent News
March 9, 2023
High Density Packaging (HDP) User Group announces the Jack Fisher Technical Excellence Award to honor the memory of Jack, who passed away on January 20, 2023. […]
