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Latest Project Activity

February 20, 2025

Inner Layer Copper Balancing 2

Phase 1 quantified the sensitivity of void size & density stacking on core deformation, surface topography for assembly and recommended design approaches focused on Low Loss and Ultra Low-Loss laminates.…

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HDP User Group is a project-oriented industry consortium addressing the integration of new electronics component packaging and interconnect technologies into member company supply chains.

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