Latest Project Activity
March 21, 2020
The High Density Packaging User Group is starting a project to evaluate Vertical Conductive Structures – VeCS. VeCS is a relatively new patented technology by NextGIn Technology for creating a…
Member Meetings
Most Recent News
August 27, 2019
Cave Creek, Arizona July 25, 2019. High Density Packaging (HDP) User Group is pleased to announce that Gen3 has become our newest member. “We are very […]
