Latest Project Activity
August 07, 2020
The High Density Packaging User Group is starting a project to evaluate Vertical Conductive Structures – VeCS. VeCS is a relatively new patented technology by NextGIn Technology for creating a…
Most Recent News
June 24, 2020
Cave Creek, AZ, USA, June 24, 2020 – IPC and High Density Package Users Group (HDP), a trade organization representing companies involved in the supply chain […]
