コラボレーション。創造する。解決する。

最新のプロジェクト活動

Survey and New Projects

HDP conducted a survey with our members during the 2月 and 5月 meetings to gauge interest in investigating challenges across a broad set of topics. A few key topics emerged as areas of focus: reliability and performance of stacked versus staggered vias; effects of thin dielectric and quartz on electrical skew; copper foil adhesion; and copper foil roughness and treatment on electrical performance. Based on the results of a survey, HDP has launched ten new project initiatives. Two Idea stage projects have begun so far because of these initiatives and more will be launched as initial investigations progress. Visit the Projects page for information on new projects.

会社概要

HDP Fall Member Meeting

Save the date!

After two successful member meetings in 2月 and 5月, planning for the HDP Fall Member Meeting has begun. The meeting is scheduled for 11月 5 and 6, 2025, and will be hosted by Nokia Bell Labs in Murray Hill, NJ.

In addition to the usual project updates, including several planned close-out presentations, a keynote address will be delivered by Dr. Jung Yoon, Distinguished Engineer & CTO, Supplier Technology & Quality at IBM.

現在の動向