HDP conducted a survey with our members during the 2月 and 5月 meetings to gauge interest in investigating challenges across a broad set of topics. A few key topics emerged as areas of focus: reliability and performance of stacked versus staggered vias; effects of thin dielectric and quartz on electrical skew; copper foil adhesion; and copper foil roughness and treatment on electrical performance. Based on the results of a survey, HDP has launched ten new project initiatives. Two Idea stage projects have begun so far because of these initiatives and more will be launched as initial investigations progress. Visit the Projects page for information on new projects.