Collaborate. Create. Solve.
Latest Project Activity
April 25, 2024
The previous project “Non-Contact Copper Foil (CF) Profile” collected 62 types of RTF and HVLP CF samples, and provided a good set of Sa roughness data which was presented to…
About Us
Our Mission
HDP User Group is a project-oriented industry consortium addressing the integration of new electronics component packaging and interconnect technologies into member company supply chains.
