Investigate New Test Methods for Copper Foil Adhesion Project Call
Investigate New Test Methods for Copper Foil Adhesion Project Call
- Have any questions?
- info@hdpug.org
4 events found.
HDP User Group
Events from this organizer
TCE Materials -test method validation
Validating CTE measurements. Continued defining the test plan.
Kick off Meeting for PCB Flatness at Large Package Attach Locations
Kick off Meeting for PCB Flatness at Large Package Attach Locations
Final Finish Layer Deposits for High Frequency
Final Finish Layer Deposits for High Frequency