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HDP User Group

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May 2026

Thu 14
May 14 @ 2:00 pm - 3:00 pm

Non-Glass Microvia Build-ups

Look at last round of FA Work on final report

Thu 14
May 14 @ 3:00 pm - 4:00 pm

Cu Outer Layer Trace Adhesion

Review final report and DATA

Mon 18
May 18 @ 10:00 am - 11:00 am

Final Finish Layer Deposits for High Frequency, Phase 2 and 3

Final Finish Layer Deposits for High Frequency, Phase 2 and 3

Tue 19
May 19 @ 2:00 pm - 3:00 pm

Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call

Periodic Project Call

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The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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