April 5, 2023 @ 11:00 am - 12:00 pm HDP Large Footprint BGA Warpage Project Call Project Planning Call
April 6, 2023 @ 10:00 am - 11:00 am Kick-Off meeting for Sequential Lamination – Stress Factors and Failure Modes Kick Off
April 6, 2023 @ 11:00 am - 12:00 pm Microvia Rel More discussion on coupons, subpanels and panel layouts.
April 11, 2023 @ 11:00 am - 12:00 pm Cu Surface Roughness Model Copper surface roughness modeling valiadation.