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September 2026

Wed 9
September 9 @ 9:00 am - 10:00 am

Investigate New Test Methods For Copper Foil Adhesion Project Call

Investigate New Test Methods For Copper Foil Adhesion Project Call

Wed 9
September 9 @ 10:00 am - 11:00 am

PCB Flatness at Lg Package Attach

Meeting

Wed 9
September 9 @ 11:00 am - 12:00 pm

TCE Materials-method validation

continue discussion on the validation measurements and next steps.

Thu 10
September 10 @ 9:00 am - 10:00 am

Electrochemical Migration Phase 4

Project Meeting

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The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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