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D Coupon/IST/CITC Reliability Testing

Printed circuit board through-hole via and microvia reliability are continuing concerns in the electronics industry. The industry is using smaller and higher aspect ratio vias and […]

TCE materials-validating test methods for X-Y CTE

There has been multiple studies related to the TCE of laminate materials as related to the Z-axis. However, the hypothesis is that better dimensional properties of […]

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