Cave Creek, Arizona September 9, 2020. High-Density Packaging (HDP) User Group is pleased to announce it is hosting a free webinar that will provide its members and others in the electronic industry the latest information on issues facing Aerospace electronics.  Worldwide Experts in the field will share their knowledge and concerns during the 3-hour Webinar, which is open to all interested parties.

“Aerospace electronics pose the most severe use environment in all of the electronics world. This, coupled with the mission-critical aspect of aerospace applications, make it a reliability and performance challenge that can provide valuable insight to all of our members and anyone involved in electronics”, said Marshall Andrews, Executive Director of HDP User Group.

The Webinar will be held on November 12, 2020, starting at 8 AM USA Central Time.

Agenda 8:00 AM – 11:00 AM US Central Time

Welcome – Larry Marcanti, HDP

Opening of the Webinar by the Moderator

  • Martin Cotton – Martin joined HDP in 2018 as European representative. He holds eight patents in PCB design and has held senior positions in OEM, PCB, and materials companies. He is a Fellow of the Institute of Circuit Technology and is active in seminars and educational forums regarding PCB design.

Reliability of HDI PCBs for European Space Agency (ESA) Projects

  • Stan Heltzel – ESA

An Overview of Printed Circuit Board Risks and Supplier Capability

An Investigation into the Tin Pest Phenomena: Ten Years of

            Testing Chasing Myths

  • David Hillman – Collins Aerospace

The Promise of Heterogeneous Integration

  • Jan Vardaman – Tech Search Inc.          

How to give the fabricator the best chance at success for creating reliable microvia connections

  • Kevin KusiakLockheed Martin

Round Table & Questions

Webinar Close

The Webinar is in the English language.

Please register for webinar log-in and call details by emailing your contact info (name, Company Info, Email) to one of the following people.

About HDP User Group

HDP User Group ( is a global research and development organization based in Cave Creek, Arizona, which is dedicated to “reducing the costs and risks for the Electronics Manufacturing industry when using advanced electronic packaging and assembly.”  This international industry-led group organizes and conducts R&D programs to address the technical issues facing the industry, including design, printed circuit board manufacturing, electronics assembly, and environmental compliance.  HDP User Group maintains additional offices in Austin, Texas, and Singapore.

For more information, visit HDP User Group on the Internet at  or contact Darryl Reiner at, phone number +1 480-951-1963