Final Finish Layer Deposits for High Frequency

Weekly Staff Call

Develop a test method which can measure the propensity of poor soldermask coverage to corrosion.

Meeting

D-Coupon IST CITC Reliability Testing - Standard test method vs Actual PCBA reflow profiles

Update in build

Project goal is to develop a CAD translator utility that will provide analysis of local copper distribution to identify risk areas for core deformation and backdrill stub variation, surface topography variat...

Meeting