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7 events found.
Week of Events
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Thin Dielectric Skew Project Kickoff
Thin Dielectric Skew Project Kickoff
New HDP project investigating the impact of thin dielectrics on electric skew
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Cu Trace Adhesion
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Investigate New Test Methods for Copper Foil Adhesion Project Call
Investigate New Test Methods for Copper Foil Adhesion Project Call
Investigate New Test Methods for Copper Foil Adhesion Project Call
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TCE Materials -test method validation
TCE Materials -test method validation
Validating CTE measurements. Continued defining the test plan.
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Kick off Meeting for PCB Flatness at Large Package Attach Locations
Kick off Meeting for PCB Flatness at Large Package Attach Locations
Kick off Meeting for PCB Flatness at Large Package Attach Locations