Name: Cu Outer Trace Adhesion
Start: 2024-07-10T15:00:00-05:00
End: 2024-07-10T16:00:00-05:00

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7 events found.

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No events scheduled for July 7, 2024.

10:00 am

July 8, 2024 @ 10:00 am - 11:00 am

Final Finish Layer Deposits for High Frequency

11:00 am

July 8, 2024 @ 11:00 am - 12:00 pm

Microvia Rel

No events scheduled for July 9, 2024.

9:00 am

July 10, 2024 @ 9:00 am - 10:00 am

Effects of Plating Thickness on CFT at IST Phase 2 Project Call

10:00 am

July 10, 2024 @ 10:00 am - 11:00 am

SIR Testing meeting

11:00 am

July 10, 2024 @ 11:00 am - 12:00 pm

Sequential Lamination Mtg

3:00 pm

July 10, 2024 @ 3:00 pm - 4:00 pm

Cu Outer Trace Adhesion

10:00 am

July 11, 2024 @ 10:00 am - 11:00 am

Materials #7 meeting

3:00 pm

July 11, 2024 @ 3:00 pm - 4:00 pm

Photonic Soldering II

No events scheduled for July 12, 2024.

No events scheduled for July 13, 2024.

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10:00 am - 11:00 am

Final Finish Layer Deposits for High Frequency

July 8, 2024 @ 10:00 am - 11:00 am

Final Finish Layer Deposits for High Frequency

11:00 am - 12:00 pm

Microvia Rel

July 8, 2024 @ 11:00 am - 12:00 pm

Microvia Rel

Continue working on final report Any ideas/interest in another microvia project?

9:00 am - 10:00 am

Effects of Plating Thickness on CFT at IST Phase 2 Project Call

July 10, 2024 @ 9:00 am - 10:00 am

Effects of Plating Thickness on CFT at IST Phase 2 Project Call

10:00 am - 11:00 am

SIR Testing meeting

July 10, 2024 @ 10:00 am - 11:00 am

Sequential Lamination Mtg

July 10, 2024 @ 11:00 am - 12:00 pm

Cu Outer Trace Adhesion

July 10, 2024 @ 3:00 pm - 4:00 pm

Cu Outer Trace Adhesion

Continue pulling things together to move from Idea to Definition

10:00 am - 11:00 am

Materials #7 meeting

July 11, 2024 @ 10:00 am - 11:00 am

Photonic Soldering II

July 11, 2024 @ 3:00 pm - 4:00 pm

Photonic Soldering II

Starting on final report Status on drop testing

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The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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