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7 events found.
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2024-06
June 23
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June 29
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No events scheduled for June 23, 2024.
11:00 am
June 24, 2024 @ 11:00 am
-
12:00 pm
Copper surface roughness model
3:00 pm
June 25, 2024 @ 3:00 pm
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4:00 pm
Cu Outer Trace Adhesion
10:00 am
June 26, 2024 @ 10:00 am
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11:00 am
Sequential Lamination Mtg
10:00 am
June 27, 2024 @ 10:00 am
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11:00 am
Single Surface Finish 2 meeting
4:00 pm
June 27, 2024 @ 4:00 pm
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5:00 pm
Idea discussion: Glass Substrates for IC Packages
6:00 pm
June 27, 2024 @ 6:00 pm
-
7:00 pm
Porosity
No events scheduled for June 28, 2024.
No events scheduled for June 29, 2024.
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11:00 pm
12:00 am
11:00 am
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12:00 pm
Copper surface roughness model
June 24, 2024 @ 11:00 am
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12:00 pm
Copper surface roughness model
REview SEM and roughness model numbers. Update on Hurray Model.
3:00 pm
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4:00 pm
Cu Outer Trace Adhesion
June 25, 2024 @ 3:00 pm
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4:00 pm
Cu Outer Trace Adhesion
Continue scoping put the project
10:00 am
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11:00 am
Sequential Lamination Mtg
June 26, 2024 @ 10:00 am
-
11:00 am
Sequential Lamination Mtg
Meeting
10:00 am
-
11:00 am
Single Surface Finish 2 meeting
June 27, 2024 @ 10:00 am
-
11:00 am
Single Surface Finish 2 meeting
Meeting
4:00 pm
-
5:00 pm
Idea discussion: Glass Substrates for IC Packages
June 27, 2024 @ 4:00 pm
-
5:00 pm
Idea discussion: Glass Substrates for IC Packages
Idea discussion: Glass Substrates for IC Packages
6:00 pm
-
7:00 pm
Porosity
June 27, 2024 @ 6:00 pm
-
7:00 pm
Porosity
Coninue working on project definition
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