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7 events found.
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2024-06
June 9
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June 15
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No events scheduled for June 9, 2024.
10:00 am
June 10, 2024 @ 10:00 am
-
11:00 am
Final Finish Layer Deposits for High Frequency
8:00 pm
June 11, 2024 @ 8:00 pm
-
9:00 pm
Correlating CF Profile to SI Project Call
1:00 am
June 12, 2024 @ 1:00 am
-
1:30 am
Caption function check
9:00 am
June 12, 2024 @ 9:00 am
-
10:00 am
Reflow Cycle Via Reliability Impact Project Call
10:00 am
June 12, 2024 @ 10:00 am
-
11:00 am
Sequential Lamination Mtg
3:00 am
June 13, 2024 @ 3:00 am
-
3:30 am
Caption Function Check in detail
11:00 am
June 13, 2024 @ 11:00 am
-
12:00 pm
Backdrill Via Transition
4:00 pm
June 13, 2024 @ 4:00 pm
-
5:00 pm
Idea discussion: Glass Substrates for IC Packages
No events scheduled for June 14, 2024.
No events scheduled for June 15, 2024.
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12:00 am
10:00 am
-
11:00 am
Final Finish Layer Deposits for High Frequency
June 10, 2024 @ 10:00 am
-
11:00 am
Final Finish Layer Deposits for High Frequency
Final Finish Layer Deposits for High Frequency
8:00 pm
-
9:00 pm
Correlating CF Profile to SI Project Call
June 11, 2024 @ 8:00 pm
-
9:00 pm
Correlating CF Profile to SI Project Call
Correlating CF Profile to SI Project Call
1:00 am
-
1:30 am
Caption function check
June 12, 2024 @ 1:00 am
-
1:30 am
Caption function check
Checking menu buttons
9:00 am
-
10:00 am
Reflow Cycle Via Reliability Impact Project Call
June 12, 2024 @ 9:00 am
-
10:00 am
Reflow Cycle Via Reliability Impact Project Call
Reflow Cycle Via Reliability Impact Project Call
10:00 am
-
11:00 am
Sequential Lamination Mtg
June 12, 2024 @ 10:00 am
-
11:00 am
Sequential Lamination Mtg
Meeting
3:00 am
-
3:30 am
Caption Function Check in detail
June 13, 2024 @ 3:00 am
-
3:30 am
Caption Function Check in detail
Transciption
11:00 am
-
12:00 pm
Backdrill Via Transition
June 13, 2024 @ 11:00 am
-
12:00 pm
Backdrill Via Transition
Backdrill Transition Project Meeting
4:00 pm
-
5:00 pm
Idea discussion: Glass Substrates for IC Packages
June 13, 2024 @ 4:00 pm
-
5:00 pm
Idea discussion: Glass Substrates for IC Packages
Idea discussion: Glass Substrates for IC Packages
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