Call to brainstorm HDP logo design.

Special session to review Sanmina TV for project. NOTE: This notice was originally sent out as a Cu Grain Structure meeting by mistake, it is the Cu Peel Strength project.

Review progress on final report

Project meeting

Project call

Project call 

Project Call

Cu Grain Structure Project meeting of June 26, 2019

Low Ag Alloy Solderpaste project meeting June 26, 2019

Telecom

PFH Technology Project Call

HDP Telecom

VeCS Project meeting of June 27, 2019

Review of ATC data

High Speed Hybrid PWB Project Call

Paul will give an update and we will look at the flow chart.

NEw project idea discussion

Re timed telecom