Name: Solder Joint Reliability with Surface Finishes Project Meeting
Start: 2017-03-30T20:00:00-05:00
End: 2017-03-30T21:00:00-05:00

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No events scheduled for March 26, 2017.

10:00 am

March 27, 2017 @ 10:00 am - 11:00 pm

High Freq Meas Phase 3

12:00 pm

March 28, 2017 @ 12:00 pm - 1:00 pm

HUE Project Call

9:00 am

March 29, 2017 @ 9:00 am - 10:00 am

Warpage Meeting

8:00 am

March 30, 2017 @ 8:00 am - 9:00 am

HDI Tv Meeting

10:00 am

March 30, 2017 @ 10:00 am - 11:00 am

Opto phase 2

1:00 pm

March 30, 2017 @ 1:00 pm - 2:00 pm

Multi Lam and Future HDI

8:00 pm

March 30, 2017 @ 8:00 pm - 9:00 pm

Solder Joint Reliability with Surface Finishes Project Meeting

8:00 am

March 31, 2017 @ 8:30 am - 9:00 am

Warpage Discussion

9:00 am

March 31, 2017 @ 9:00 am - 10:00 am

Board Thickness Effect on ATC

No events scheduled for April 1, 2017.

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10:00 am - 11:00 pm

High Freq Meas Phase 3

March 27, 2017 @ 10:00 am - 11:00 pm

HUE Project Call

March 28, 2017 @ 12:00 pm - 1:00 pm

Warpage Meeting

March 29, 2017 @ 9:00 am - 10:00 am

HDI Tv Meeting

March 30, 2017 @ 8:00 am - 9:00 am

Opto phase 2

March 30, 2017 @ 10:00 am - 11:00 am

Multi Lam and Future HDI

March 30, 2017 @ 1:00 pm - 2:00 pm

Solder Joint Reliability with Surface Finishes Project Meeting

March 30, 2017 @ 8:00 pm - 9:00 pm

Solder Joint Reliability with Surface Finishes Project Meeting

Solder Joint Reliability with Surface Finishes Project MeetingThursday, March 30, 2017 8:00 pm | Central Daylight Time (Chicago, GMT-05:00) | 1 hr Global call-in n...

8:30 am - 9:00 am

Warpage Discussion

March 31, 2017 @ 8:30 am - 9:00 am

Board Thickness Effect on ATC

March 31, 2017 @ 9:00 am - 10:00 am

The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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