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35 events found.
Calendar of Events
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Investigate New Test Methods for Copper Foil Adhesion Project Call
Investigate New Test Methods for Copper Foil Adhesion Project Call
Investigate New Test Methods for Copper Foil Adhesion Project Call
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2 events,
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4 events,
Reflow Cycle Via Reliability Impact SMTAi Paper Review
Reflow Cycle Via Reliability Impact SMTAi Paper Review
Reflow Cycle Via Reliability Impact SMTAi Paper Review
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2 events,
3 events,
Correlating CF Profile to Signal Integrity Project Call
Correlating CF Profile to Signal Integrity Project Call
Correlating CF Profile to Signal Integrity Project Call
4 events,
Inner Layer Copper Balancing 2
Inner Layer Copper Balancing 2
Project goal is to develop a CAD translator utility that will provide analysis of local copper distribution to identify risk areas for core deformation and backdrill stub variation, surface topography variat...
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2 events,
2 events,
Investigate New Test Methods for Copper Foil Adhesion Project Call
Investigate New Test Methods for Copper Foil Adhesion Project Call
Investigate New Test Methods for Copper Foil Adhesion Project Call
4 events,
Meeting Testing with Dan P – No List
Meeting Testing with Dan P – No List
Testing meeting scheduling and notification system with Dan Prezioso, Juniper. This test does NOT include a distribution list.
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Thin Dielectric Skew Project Kickoff
Thin Dielectric Skew Project Kickoff
This new HDP project seeks to determine the worst case electrical skew that is now possible when using thinner dielectrics, and how much electrical skew can be mitigated by changing the orientation / alignme...
Correlating CF Profile to Signal Integrity Project Call
Correlating CF Profile to Signal Integrity Project Call
Correlating CF Profile to Signal Integrity Project Call
2 events,
D-Coupon IST CITC Reliability Testing
D-Coupon IST CITC Reliability Testing
Project to measure and compare sensitivity of each test method to preconditioning/assembly reflow profile difference(s) that significantly impact long term reliability.