• Have any questions?
  • info@hdpug.org
  • Register
  • Login

Investigate New Test Methods for Copper Foil Adhesion Project CallInvestigate New Test Methods for Copper Foil Adhesion Project CallInvestigate New Test Methods for Copper Foil Adhesion Project CallInvestigate New Test Methods for Copper Foil Adhesion Project Call

  • PROJECTS
    • Active Projects
    • Completed Projects
    • Published Papers
  • MEMBERSHIP
  • EVENTS
    • Calendar
    • Member Meetings
✕
4 events found.

Events Search and Views Navigation

Event Views Navigation

Today
View by:
  • Month
  • Week
  • Day
10:00 am
January 11, 2017 @ 10:00 am - 11:00 am CST

Lead Free PWB Materials Reliability Project Call

12:00 pm
January 11, 2017 @ 12:00 pm - 1:00 pm CST

HDP Low Ag Alloy Solderpaste Reliability Placeholder

Placeholder for Low Ag ALloy project meetings every two weeks on Wed at 12:00 Noon Central Time
January 11, 2017 @ 12:00 pm - 1:00 pm CST

HDP Low Ag Alloy Solderpaste Reliability Jan 11 project meeting

First meeting of 2017. We will be holding meetings every 2 weeks on Wed at noon Central Time.
3:00 pm
January 11, 2017 @ 3:00 pm - 4:00 pm CST

Harsh Use Environment Project Call

  • Previous Day
  • Next Day
Export Events

The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

About
  • About Us
  • Staff Directory
  • Annual Reports
Information
  • Member List
  • News Releases
  • FAQs
  • Brand Guide
Policies
  • Operating Procedures
  • Bylaws
  • Terms and Conditions
  • Privacy Policy

© 2018 HDP User Group International, Inc. All Rights Reserved.