Name: TCE Materials -test method validation
Start: 2025-08-14T11:00:00-05:00
End: 2025-08-14T12:00:00-05:00

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TCE Materials -test method validation

August 14 @ 11:00 am - 12:00 pm CDT

« Investigate New Test Methods for Copper Foil Adhesion Project Call
Kick off Meeting for PCB Flatness at Large Package Attach Locations »

The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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