Name: Sequential Lamination Mtg
Start: 2024-09-18T10:00:00-05:00
End: 2024-09-18T11:00:00-05:00

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Sequential Lamination Mtg

September 18 @ 10:00 am - 11:00 am CDT

« Effects of Plating Thickness on CTF at IST Phase 2 Project Call
Cu Outer Trace Adhesion »

The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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