Low Ag Alloy Solderpaste Reliability June 28, 2017 meeting - HDP User Group

Have any questions?
info@hdpug.org

Register
Login

PROJECTS
MEMBERSHIP
EVENTS
- Calendar
- Member Meetings

✕

This event has passed.

Low Ag Alloy Solderpaste Reliability June 28, 2017 meeting

June 28, 2017 @ 12:00 pm - 1:00 pm CDT

« Board Thickness
SAC Aging 3 Project Call »

The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

About

About Us
Staff Directory
Annual Reports

Information

Member List
News Releases
FAQs
Brand Guide

Policies

Operating Procedures
Bylaws
Terms and Conditions
Privacy Policy

© 2018 HDP User Group International, Inc. All Rights Reserved.