Name: Inner layer Cu Balance Project Call
Start: 2023-06-01T13:00:00-05:00
End: 2023-06-01T14:00:00-05:00

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Inner layer Cu Balance Project Call

June 1 @ 1:00 pm - 2:00 pm CDT

« HDP Backdrill Transition Project
Effects of Plating Thickness on CTF at IST Project Call »

The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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