Name: ECM Phase 2 Kick-Off Meeting
Start: 2016-11-01T15:00:00-05:00
End: 2016-11-01T16:00:00-05:00

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ECM Phase 2 Kick-Off Meeting

November 1, 2016 @ 3:00 pm - 4:00 pm CDT

« High Freq. Meas Phase 3
Solder Joint Reliability with New Surface Finishes »

The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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