Name: Board Thickness
Start: 2017-06-28T10:00:00-05:00
End: 2017-06-28T11:00:00-05:00

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Board Thickness

June 28, 2017 @ 10:00 am - 11:00 am CDT

« Military HF Eval
Low Ag Alloy Solderpaste Reliability June 28, 2017 meeting »

The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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