Name: Back Drill Under BGA
Start: 2019-12-12T10:00:00-06:00
End: 2019-12-12T11:00:00-06:00

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Back Drill Under BGA

December 12, 2019 @ 10:00 am - 11:00 am CST

« Low Ag Alloy Solderpaste meeting of Dec 11, 2019
Cu Peel Strength project meeting of Dec 12, 2019 »

The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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