Name: Sequential Lamination Meeting
Start: 2026-07-14T11:00:00-05:00
End: 2026-07-14T12:00:00-05:00

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Sequential Lamination Meeting

July 14 @ 11:00 am - 12:00 pm CDT

« Stacked Microvia Capability Improvement
Large Component PWB Warpage Project Call »

The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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