Name: High Aspect Ratio Plating Limitations
Start: 2026-06-11T13:00:00-05:00
End: 2026-06-11T14:00:00-05:00

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High Aspect Ratio Plating Limitations

June 11 @ 1:00 pm - 2:00 pm CDT

« Paste Interconnect Exploratory Meeting
Final Finish Layer Deposits for High Frequency, Phase 2 and 3 »

The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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