BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20190310T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20191103T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20190711T160000Z
DTEND:20190711T170000Z
DTSTAMP:20261019T162137
CREATED:20190625T165640Z
LAST-MODIFIED:20190625T165640Z
UID:14153-1562842800-1562846400@hdpusergroup.org
SUMMARY:Cu Peel Strength project July 11\, 2019 project meeting
DESCRIPTION:Cu Peel Strength project July 11\, 2019 project meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-project-july-11-2019-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20190710T170000Z
DTEND:20190710T180000Z
DTSTAMP:20261019T162137
CREATED:20190702T180815Z
LAST-MODIFIED:20190702T180815Z
UID:14190-1562760000-1562763600@hdpusergroup.org
SUMMARY:Low Ag Alloy July 10\, 2019 project meeting
DESCRIPTION:Low Ag Project meeting of July 10th 
URL:https://hdpusergroup.org/event/low-ag-alloy-july-10-2019-project-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20190710T160000Z
DTEND:20190710T170000Z
DTSTAMP:20261019T162137
CREATED:20190702T175243Z
LAST-MODIFIED:20190702T175243Z
UID:14185-1562756400-1562760000@hdpusergroup.org
SUMMARY:Cu Grain Structure vs Loss project meeting
DESCRIPTION:July 10th project meeting 
URL:https://hdpusergroup.org/event/cu-grain-structure-vs-loss-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20190627T170000Z
DTEND:20190627T180000Z
DTSTAMP:20261019T162137
CREATED:20190620T165528Z
LAST-MODIFIED:20190620T165528Z
UID:14118-1561636800-1561640400@hdpusergroup.org
SUMMARY:VeCS Project meeting of June 27\, 2019
DESCRIPTION:VeCS Project meeting of June 27\, 2019 
URL:https://hdpusergroup.org/event/vecs-project-meeting-of-june-27-2019/
LOCATION:WebEx
CATEGORIES:VeCS Technology Evaluation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20190626T170000Z
DTEND:20190626T180000Z
DTSTAMP:20261019T162137
CREATED:20190620T164918Z
LAST-MODIFIED:20190620T164918Z
UID:14117-1561550400-1561554000@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste project meeting June 26\, 2019
DESCRIPTION:Low Ag Alloy Solderpaste project meeting June 26\, 2019 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-project-meeting-june-26-2019/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20190626T160000Z
DTEND:20190626T170000Z
DTSTAMP:20261019T162137
CREATED:20190621T171355Z
LAST-MODIFIED:20190621T171355Z
UID:14132-1561546800-1561550400@hdpusergroup.org
SUMMARY:Cu Grain Structure Project meeting of June 26\, 2019
DESCRIPTION:Cu Grain Structure Project meeting of June 26\, 2019 
URL:https://hdpusergroup.org/event/cu-grain-structure-project-meeting-of-june-26-2019/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20190624T160000Z
DTEND:20190624T170000Z
DTSTAMP:20261019T162137
CREATED:20190621T170549Z
LAST-MODIFIED:20190621T170549Z
UID:14107-1561374000-1561377600@hdpusergroup.org
SUMMARY:Special Session Cu Peel Strength project meeting
DESCRIPTION:Special session to review Sanmina TV for project. NOTE: This notice was originally sent out as a Cu Grain Structure meeting by mistake\, it is the Cu Peel Strength project. 
URL:https://hdpusergroup.org/event/special-session-cu-grain-structure-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20190613T170000Z
DTEND:20190613T180000Z
DTSTAMP:20261019T162137
CREATED:20190607T173152Z
LAST-MODIFIED:20190607T173152Z
UID:13990-1560427200-1560430800@hdpusergroup.org
SUMMARY:VeCS project meeting of June 13\, 2019
DESCRIPTION:VeCS project meeting of June 13\, 2019 
URL:https://hdpusergroup.org/event/vecs-project-meeting-of-june-13-2019/
LOCATION:WebEx
CATEGORIES:VeCS Technology Evaluation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20190613T160000Z
DTEND:20190613T170000Z
DTSTAMP:20261019T162137
CREATED:20190607T175724Z
LAST-MODIFIED:20190607T175724Z
UID:13991-1560423600-1560427200@hdpusergroup.org
SUMMARY:Cu Peel Strength project meeting
DESCRIPTION:Cu Peel Strength project meeting of June 13th 2019 
URL:https://hdpusergroup.org/event/cu-peel-strength-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20190612T170000Z
DTEND:20190612T180000Z
DTSTAMP:20261019T162137
CREATED:20190603T214341Z
LAST-MODIFIED:20190603T214341Z
UID:13799-1560340800-1560344400@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste project meeting
DESCRIPTION:June 12\, 2019 Project meeting for Low Ag Alloy Solderpaste BGA leg 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-project-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20190612T160000Z
DTEND:20190612T170000Z
DTSTAMP:20261019T162137
CREATED:20190607T180743Z
LAST-MODIFIED:20190607T180743Z
UID:13992-1560337200-1560340800@hdpusergroup.org
SUMMARY:Cu Grain Structure Project Meeting of June 12\, 2019
DESCRIPTION:Cu Grain Structure Project Meeting of June 12\, 2019 
URL:https://hdpusergroup.org/event/cu-grain-structure-project-meeting-of-june-12-2019/
LOCATION:WebEx
CATEGORIES:Cu Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20190612T160000Z
DTEND:20190612T170000Z
DTSTAMP:20261019T162137
CREATED:20190603T215806Z
LAST-MODIFIED:20190603T215806Z
UID:13800-1560337200-1560340800@hdpusergroup.org
SUMMARY:Cu Grain Structure vs Loss Placeholder
DESCRIPTION:  \n  \n  \nPlaceholder for Cu Grain Structure Vs Loss project
URL:https://hdpusergroup.org/event/cu-grain-structure-vs-loss/2019-06-12/
LOCATION:WebEx
CATEGORIES:Cu Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20190530T170000Z
DTEND:20190530T180000Z
DTSTAMP:20261019T162137
CREATED:20190506T191445Z
LAST-MODIFIED:20190506T191445Z
UID:13682-1559217600-1559221200@hdpusergroup.org
SUMMARY:VeCS Tech Eval Project Meeting of May 30\, 2019
DESCRIPTION:VeCS project meeting of May 30\, 2019 
URL:https://hdpusergroup.org/event/vecs-tech-eval-project-meeting-of-may-30-2019/
LOCATION:WebEx
CATEGORIES:VeCS Technology Evaluation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20190530T160000Z
DTEND:20190530T170000Z
DTSTAMP:20261019T162137
CREATED:20190516T174305Z
LAST-MODIFIED:20190516T174305Z
UID:13741-1559214000-1559217600@hdpusergroup.org
SUMMARY:Cu Peel Strength project meeting of May 30\, 2019
DESCRIPTION:Cu Peel Strength project meeting of May 30\, 2019 
URL:https://hdpusergroup.org/event/cu-peel-strength-project-meeting-of-may-30-2019/
LOCATION:WebEx
CATEGORIES:Cu Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20190529T170000Z
DTEND:20190529T180000Z
DTSTAMP:20261019T162137
CREATED:20190506T195857Z
LAST-MODIFIED:20190506T195857Z
UID:13689-1559131200-1559134800@hdpusergroup.org
SUMMARY:Low Ag Alloy Project meeting of May 29\, 2019
DESCRIPTION:May 29\, 2019 Project Meeting of Low Ag Alloy Solderpaste 
URL:https://hdpusergroup.org/event/low-ag-alloy-project-meeting-of-may-29-2019/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20190529T160000Z
DTEND:20190529T170000Z
DTSTAMP:20261019T162137
CREATED:20190516T173820Z
LAST-MODIFIED:20190516T173820Z
UID:13740-1559127600-1559131200@hdpusergroup.org
SUMMARY:Cu Grain Structure vs. Loss Project Placeholder
DESCRIPTION:Kick-off meeting for Cu Grain Structure vs. Loss project 
URL:https://hdpusergroup.org/event/cu-grain-structure-vs-loss-project-placeholder/
LOCATION:WebEx
CATEGORIES:Cu Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20190516T160000Z
DTEND:20190516T170000Z
DTSTAMP:20261019T162137
CREATED:20190502T184428Z
LAST-MODIFIED:20190502T184428Z
UID:13657-1558004400-1558008000@hdpusergroup.org
SUMMARY:Cu Peel Strength Project meeting of May 16\, 2019
DESCRIPTION:Cu Peel Strength project meeting of May 16\, 2019 
URL:https://hdpusergroup.org/event/cu-peel-strength-project-meeting-of-may-16-2019/
LOCATION:WebEx
CATEGORIES:Cu Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20190502T160000Z
DTEND:20190502T170000Z
DTSTAMP:20261019T162137
CREATED:20190422T172426Z
LAST-MODIFIED:20190422T172426Z
UID:13572-1556794800-1556798400@hdpusergroup.org
SUMMARY:Copper Peel Strength Evaluation project meeting of May 2\, 2019
DESCRIPTION:Project meeting for Copper Peel Strength evaluation for innerlayer copper adhesion on May 2\, 2019 
URL:https://hdpusergroup.org/event/copper-peel-strength-evaluation-project-meeting-of-may-2-2019/
LOCATION:WebEx
CATEGORIES:Cu Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20190501T170000Z
DTEND:20190501T180000Z
DTSTAMP:20261019T162137
CREATED:20190422T164829Z
LAST-MODIFIED:20190422T164829Z
UID:13570-1556712000-1556715600@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderepaste BGA Leg
DESCRIPTION:Low Ag Alloy Project Meeting of May 1\, 2019 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderepaste-bga-leg/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20190418T160000Z
DTEND:20190418T170000Z
DTSTAMP:20261019T162137
CREATED:20190405T202032Z
LAST-MODIFIED:20190405T202032Z
UID:13393-1555585200-1555588800@hdpusergroup.org
SUMMARY:Cu Properties project – Idea Phase meeting
DESCRIPTION:Initial meeting test 
URL:https://hdpusergroup.org/event/cu-properties-project-idea-phase-meeting/
LOCATION:WebEx
CATEGORIES:Cu Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20190321T190000Z
DTEND:20190321T200000Z
DTSTAMP:20261019T162137
CREATED:20190311T191808Z
LAST-MODIFIED:20190311T191808Z
UID:13178-1553176800-1553180400@hdpusergroup.org
SUMMARY:High Density BGA project
DESCRIPTION:HD BGA project meeting on March 221 @ 2 PM CDT 
URL:https://hdpusergroup.org/event/high-density-bga-project/
LOCATION:WebEx
CATEGORIES:High Density BGA
END:VEVENT
BEGIN:VEVENT
DTSTART:20190306T160000Z
DTEND:20190306T170000Z
DTSTAMP:20261019T162137
CREATED:20190206T174341Z
LAST-MODIFIED:20190206T174341Z
UID:12539-1551866400-1551870000@hdpusergroup.org
SUMMARY:LF Materials #5 Project call
DESCRIPTION:Project call
URL:https://hdpusergroup.org/event/lf-materials-5-project-call/
LOCATION:WebEx
CATEGORIES:Lead Free PWB Materials Reliability Phase 5
END:VEVENT
END:VCALENDAR