BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20200308T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20201101T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20200611T160000Z
DTEND:20200611T170000Z
DTSTAMP:20261018T231725
CREATED:20200602T191832Z
LAST-MODIFIED:20200602T191832Z
UID:17490-1591873200-1591876800@hdpusergroup.org
SUMMARY:Cu Peel Strength June 11\, 2020 project meeting
DESCRIPTION:Cu Peel Strength June 11\, 2020 project meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-june-11-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200610T170000Z
DTEND:20200610T180000Z
DTSTAMP:20261018T231725
CREATED:20200602T181338Z
LAST-MODIFIED:20200602T181338Z
UID:17486-1591790400-1591794000@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste June 10\, 2020 project meeting
DESCRIPTION:Low Ag Alloy Solderpaste June 10\, 2020 project meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-june-10-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200610T160000Z
DTEND:20200610T170000Z
DTSTAMP:20261018T231725
CREATED:20200606T222039Z
LAST-MODIFIED:20200606T222039Z
UID:17498-1591786800-1591790400@hdpusergroup.org
SUMMARY:Cu Surface Treatment VS. Loss June 10\, 2020 project meeting
DESCRIPTION:Cu Surface Treatment VS. Loss June 10\, 2020 project meeting 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-june-10-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200528T170000Z
DTEND:20200528T180000Z
DTSTAMP:20261018T231725
CREATED:20200518T195138Z
LAST-MODIFIED:20200518T195138Z
UID:17399-1590667200-1590670800@hdpusergroup.org
SUMMARY:VeCS Technology Evaluation project meeting of May 28\, 2020
DESCRIPTION:VeCS Technology Evaluation project meeting of May 28\, 2020 
URL:https://hdpusergroup.org/event/vecs-technology-evaluation-project-meeting-of-may-28-2020/
LOCATION:WebEx
CATEGORIES:VeCS Technology Evaluation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200527T180000Z
DTEND:20200527T190000Z
DTSTAMP:20261018T231725
CREATED:20200518T195422Z
LAST-MODIFIED:20200518T195422Z
UID:17400-1590584400-1590588000@hdpusergroup.org
SUMMARY:Glass Type Comparison May 27\, 2020 project meeting
DESCRIPTION:Glass Type Comparison May 27\, 2020 project meeting 
URL:https://hdpusergroup.org/event/glass-type-comparison-may-27-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200527T170000Z
DTEND:20200527T180000Z
DTSTAMP:20261018T231725
CREATED:20200518T200146Z
LAST-MODIFIED:20200518T200146Z
UID:17403-1590580800-1590584400@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste May 27\, 2020 project meeting
DESCRIPTION:Low Ag Alloy Solderpaste May 27\, 2020 project meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-may-27-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200527T160000Z
DTEND:20200527T170000Z
DTSTAMP:20261018T231725
CREATED:20200518T195932Z
LAST-MODIFIED:20200518T195932Z
UID:17402-1590577200-1590580800@hdpusergroup.org
SUMMARY:Cu Surface Treatment VS Loss May 27\, 2020 project meeting
DESCRIPTION:Cu Surface Treatment VS Loss May 27\, 2020 project meeting 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-may-27-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200514T170000Z
DTEND:20200514T180000Z
DTSTAMP:20261018T231725
CREATED:20200512T170133Z
LAST-MODIFIED:20200512T170133Z
UID:17382-1589457600-1589461200@hdpusergroup.org
SUMMARY:VeCS Technology Evaluation May 14\, 2020 project meeting
DESCRIPTION:VeCS Technology Evaluation May 14\, 2020 project meeting 
URL:https://hdpusergroup.org/event/vecs-technology-evaluation-may-14-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:VeCS Technology Evaluation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200514T160000Z
DTEND:20200514T170000Z
DTSTAMP:20261018T231725
CREATED:20200512T165414Z
LAST-MODIFIED:20200512T165414Z
UID:17381-1589454000-1589457600@hdpusergroup.org
SUMMARY:Cu Peel Strength May 14\, 2020 project meeting
DESCRIPTION:Cu Peel Strength May 14\, 2020 project meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-may-14-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200513T180000Z
DTEND:20200513T190000Z
DTSTAMP:20261018T231725
CREATED:20200512T164602Z
LAST-MODIFIED:20200512T164602Z
UID:17380-1589374800-1589378400@hdpusergroup.org
SUMMARY:Glass Type Comparison May 13\, 2020 Project meeting
DESCRIPTION:Glass Type Comparison May 13\, 2020 Project meeting 
URL:https://hdpusergroup.org/event/glass-type-comparison-may-13-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200513T170000Z
DTEND:20200513T180000Z
DTSTAMP:20261018T231725
CREATED:20200512T164217Z
LAST-MODIFIED:20200512T164217Z
UID:17379-1589371200-1589374800@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste May 13\, 2020 project meeting
DESCRIPTION:Low Ag Alloy Solderpaste May 13\, 2020 project meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-may-13-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200513T160000Z
DTEND:20200513T170000Z
DTSTAMP:20261018T231725
CREATED:20200512T163652Z
LAST-MODIFIED:20200512T163652Z
UID:17378-1589367600-1589371200@hdpusergroup.org
SUMMARY:Cu Foil Surface Treatment May 13\, 2020 project meeting
DESCRIPTION:Cu Foil Surface Treatment May 13\, 2020 project meeting 
URL:https://hdpusergroup.org/event/cu-foil-surface-treatment-may-13-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200430T170000Z
DTEND:20200430T180000Z
DTSTAMP:20261018T231725
CREATED:20200420T233219Z
LAST-MODIFIED:20200420T233219Z
UID:16956-1588248000-1588251600@hdpusergroup.org
SUMMARY:VeCS Technology Evaluation April 30\, 2020 meeting
DESCRIPTION:VeCS Technology Evaluation April 30\, 2020 meeting 
URL:https://hdpusergroup.org/event/vecs-technology-evaluation-april-30-2020-meeting/
LOCATION:WebEx
CATEGORIES:VeCS Technology Evaluation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200429T180000Z
DTEND:20200429T190000Z
DTSTAMP:20261018T231725
CREATED:20200409T173636Z
LAST-MODIFIED:20200409T173636Z
UID:16818-1588165200-1588168800@hdpusergroup.org
SUMMARY:Glass Type Comparison Project meeting of April 29\, 2020
DESCRIPTION:Glass Type Comparison Project meeting of April 29\, 2020 
URL:https://hdpusergroup.org/event/glass-type-comparison-project-meeting-of-april-29-2020/
LOCATION:WebEx
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200429T170000Z
DTEND:20200429T180000Z
DTSTAMP:20261018T231725
CREATED:20200420T231218Z
LAST-MODIFIED:20200420T231218Z
UID:16954-1588161600-1588165200@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste BGA Leg April 29\, 2020 meeting
DESCRIPTION:Low Ag Alloy Solderpaste BGA Leg April 29\, 2020 meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-bga-leg-april-29-2020-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200429T160000Z
DTEND:20200429T170000Z
DTSTAMP:20261018T231725
CREATED:20200420T230742Z
LAST-MODIFIED:20200420T230742Z
UID:16952-1588158000-1588161600@hdpusergroup.org
SUMMARY:Cu Surface Treatment project meeting of April 29\, 2020
DESCRIPTION:Cu Surface Treatment project meeting of April 29\, 2020 
URL:https://hdpusergroup.org/event/cu-surface-treatment-project-meeting-of-april-29-2020/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200416T170000Z
DTEND:20200416T180000Z
DTSTAMP:20261018T231725
CREATED:20200409T174847Z
LAST-MODIFIED:20200409T174847Z
UID:16820-1587038400-1587042000@hdpusergroup.org
SUMMARY:VeCS Technology Evaluation project meeting of April 16\, 2020
DESCRIPTION:VeCS Technology Evaluation project meeting of April 16\, 2020 
URL:https://hdpusergroup.org/event/vecs-technology-evaluation-project-meeting-of-april-16-2020/
LOCATION:WebEx
CATEGORIES:VeCS Technology Evaluation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200416T160000Z
DTEND:20200416T170000Z
DTSTAMP:20261018T231725
CREATED:20200409T173949Z
LAST-MODIFIED:20200409T173949Z
UID:16819-1587034800-1587038400@hdpusergroup.org
SUMMARY:Cu Peel Strength project meeting of April 16\, 2020
DESCRIPTION:Cu Peel Strength project meeting of April 16\, 2020 
URL:https://hdpusergroup.org/event/cu-peel-strength-project-meeting-of-april-16-2020/
LOCATION:WebEx
CATEGORIES:Cu Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200415T170000Z
DTEND:20200415T180000Z
DTSTAMP:20261018T231725
CREATED:20200330T191637Z
LAST-MODIFIED:20200330T191637Z
UID:16495-1586952000-1586955600@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste project meeting of April 15\, 2020
DESCRIPTION:Low Ag Alloy Solderpaste project meeting of April 15\, 2020 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-project-meeting-of-april-15-2020/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200415T160000Z
DTEND:20200415T170000Z
DTSTAMP:20261018T231725
CREATED:20200409T173211Z
LAST-MODIFIED:20200409T173211Z
UID:16817-1586948400-1586952000@hdpusergroup.org
SUMMARY:Cu Grain Structure vs Loss project meeting of April 15\, 2020
DESCRIPTION:Cu Grain Structure vs Loss project meeting of April 15\, 2020 
URL:https://hdpusergroup.org/event/cu-grain-structure-vs-loss-project-meeting-of-april-15-2020/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200402T160000Z
DTEND:20200402T170000Z
DTSTAMP:20261018T231725
CREATED:20200330T192123Z
LAST-MODIFIED:20200330T192123Z
UID:16496-1585825200-1585828800@hdpusergroup.org
SUMMARY:Cu Peel Strength project meeting of April 2\, 2020
DESCRIPTION:Cu Peel Strength project meeting of April 2\, 2020 
URL:https://hdpusergroup.org/event/cu-peel-strength-project-meeting-of-april-2-2020/
LOCATION:WebEx
CATEGORIES:Cu Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200401T180000Z
DTEND:20200401T190000Z
DTSTAMP:20261018T231725
CREATED:20200303T205120Z
LAST-MODIFIED:20200303T205120Z
UID:15889-1585746000-1585749600@hdpusergroup.org
SUMMARY:Glass Type Comparison project meeting on April 1\, 2020
DESCRIPTION:Glass Type Comparison project meeting on April 1\, 2020 
URL:https://hdpusergroup.org/event/glass-type-comparison-project-meeting-on-april-1-2020/
LOCATION:WebEx
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200401T160000Z
DTEND:20200401T170000Z
DTSTAMP:20261018T231725
CREATED:20200330T200459Z
LAST-MODIFIED:20200330T200459Z
UID:16494-1585738800-1585742400@hdpusergroup.org
SUMMARY:Cu Grain Structure vs Loss Project Meeting
DESCRIPTION:Cu Grain Structure vs Loss Project Meeting of April 1\, 2020 
URL:https://hdpusergroup.org/event/cu-grain-structure-vs-loss-project-meeting-3/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200319T160000Z
DTEND:20200319T170000Z
DTSTAMP:20261018T231725
CREATED:20200309T220649Z
LAST-MODIFIED:20200309T220649Z
UID:15969-1584615600-1584619200@hdpusergroup.org
SUMMARY:Cu Peel Strength vs Loss project meeting of March 19\, 2020
DESCRIPTION:Cu Peel Strength vs Loss project meeting of March 19\, 2020 
URL:https://hdpusergroup.org/event/cu-peel-strength-vs-loss-project-meeting-of-march-19-2020/
LOCATION:WebEx
CATEGORIES:Cu Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200318T170000Z
DTEND:20200318T180000Z
DTSTAMP:20261018T231725
CREATED:20200309T221055Z
LAST-MODIFIED:20200309T221055Z
UID:15970-1584532800-1584536400@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste project meeting of March18\, 2020
DESCRIPTION:Low Ag Alloy Solderpaste project meeting of March 18\, 2020 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-project-meeting-of-march18-2020/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200318T160000Z
DTEND:20200318T170000Z
DTSTAMP:20261018T231725
CREATED:20200309T220241Z
LAST-MODIFIED:20200309T220241Z
UID:15968-1584529200-1584532800@hdpusergroup.org
SUMMARY:Cu Grain Sructure Project Meeting of March 18\, 2020
DESCRIPTION:Cu Grain Sructure Project Meeting of March 18\, 2020 
URL:https://hdpusergroup.org/event/cu-grain-sructure-project-meeting-of-march-18-2020/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200305T180000Z
DTEND:20200305T190000Z
DTSTAMP:20261018T231725
CREATED:20200227T002451Z
LAST-MODIFIED:20200227T002451Z
UID:15831-1583409600-1583413200@hdpusergroup.org
SUMMARY:VeCS Technology Evaluation Mar 5th project meeting
DESCRIPTION:VeCS Technology Evaluation Mar 5th project meeting 
URL:https://hdpusergroup.org/event/vecs-technology-evaluation-mar-5th-project-meeting/
LOCATION:WebEx
CATEGORIES:VeCS Technology Evaluation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200305T170000Z
DTEND:20200305T180000Z
DTSTAMP:20261018T231725
CREATED:20200227T001359Z
LAST-MODIFIED:20200227T001359Z
UID:15829-1583406000-1583409600@hdpusergroup.org
SUMMARY:Cu Peel Strength vs Loss Mar 5th project meeting
DESCRIPTION:Cu Peel Strength vs Loss Mar 5th project meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-vs-loss-mar-5th-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200304T180000Z
DTEND:20200304T190000Z
DTSTAMP:20261018T231725
CREATED:20200227T001912Z
LAST-MODIFIED:20200227T001912Z
UID:15830-1583323200-1583326800@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste Mar 4th Project meeting
DESCRIPTION:Low Ag Alloy Solderpaste Mar 4th Project meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-mar-4th-project-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200304T170000Z
DTEND:20200304T180000Z
DTSTAMP:20261018T231725
CREATED:20200227T001026Z
LAST-MODIFIED:20200227T001026Z
UID:15828-1583319600-1583323200@hdpusergroup.org
SUMMARY:Cu Grain Structure Mar 4th project meeting
DESCRIPTION:Cu Grain Structure Mar 4th project meeting 
URL:https://hdpusergroup.org/event/cu-grain-structure-mar-4th-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR