BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20200308T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20201101T070000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20210314T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20211107T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20210310T180000Z
DTEND:20210310T190000Z
DTSTAMP:20261017T154400
CREATED:20210215T212428Z
LAST-MODIFIED:20210215T212428Z
UID:19273-1615377600-1615381200@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste BGA Leg March 10\, 2021 project meeting
DESCRIPTION:Low Ag Alloy Solderpaste BGA Leg March 10\, 2021 project meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-bga-leg-march-10-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210211T190000Z
DTEND:20210211T200000Z
DTSTAMP:20261017T154400
CREATED:20210131T221244Z
LAST-MODIFIED:20210131T221244Z
UID:19178-1613048400-1613052000@hdpusergroup.org
SUMMARY:Cu Peel Strength Phase 2 Feb 11\, 2021 meeting
DESCRIPTION:\nContinue defining the project\n
URL:https://hdpusergroup.org/event/cu-peel-strength-phase-2-feb-11-2021-meeting/
LOCATION:WebEx
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210210T180000Z
DTEND:20210210T190000Z
DTSTAMP:20261017T154400
CREATED:20210120T193257Z
LAST-MODIFIED:20210120T193257Z
UID:19135-1612958400-1612962000@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste BGA Feb 10\, 2021 meeting
DESCRIPTION:Low Ag Alloy Solderpaste BGA Feb 10\, 2021 meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-bga-feb-10-2021-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210128T190000Z
DTEND:20210128T200000Z
DTSTAMP:20261017T154400
CREATED:20210120T192708Z
LAST-MODIFIED:20210120T192708Z
UID:19132-1611838800-1611842400@hdpusergroup.org
SUMMARY:Cu Peel Strength Phase 2 Jan 28\, 2021 meeting
DESCRIPTION:Cu Peel Strength Phase 2 Jan 28\, 2021 meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-phase-2-jan-28-2021-meeting/
LOCATION:WebEx
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210128T180000Z
DTEND:20210128T190000Z
DTSTAMP:20261017T154400
CREATED:20210113T194214Z
LAST-MODIFIED:20210113T194214Z
UID:19012-1611835200-1611838800@hdpusergroup.org
SUMMARY:Glass Type Comparison Jan 28\, 2021 project meeting
DESCRIPTION:Glass Type Comparison Jan 28\, 2021 project meeting. (NOTE: Off our regular schedule day and time due to BoD meeting on Jan 27th. 
URL:https://hdpusergroup.org/event/glass-type-comparison-jan-28-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210128T170000Z
DTEND:20210128T180000Z
DTSTAMP:20261017T154400
CREATED:20210120T191016Z
LAST-MODIFIED:20210120T191016Z
UID:19129-1611831600-1611835200@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss Jan 28\, 2021 meeting
DESCRIPTION:Cu Surface Treatment vs Loss Jan 28\, 2021 meeting 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-jan-28-2021-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210114T190000Z
DTEND:20210114T200000Z
DTSTAMP:20261017T154400
CREATED:20210107T192921Z
LAST-MODIFIED:20210107T192921Z
UID:18963-1610629200-1610632800@hdpusergroup.org
SUMMARY:Cu Peel Strength Phase 2 Jan 14\, 2021 project meeting
DESCRIPTION:Cu Peel Strength Phase 2 Jan 14\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-phase-2-jan-14-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210114T180000Z
DTEND:20210114T190000Z
DTSTAMP:20261017T154400
CREATED:20210113T195815Z
LAST-MODIFIED:20210113T195815Z
UID:19013-1610625600-1610629200@hdpusergroup.org
SUMMARY:Introductory discussions with HDP and Chemours
DESCRIPTION:Introductory discussions with HDP and Chemours 
URL:https://hdpusergroup.org/event/introductory-discussions-with-hdp-and-chemours/
LOCATION:WebEx
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210114T170000Z
DTEND:20210114T180000Z
DTSTAMP:20261017T154400
CREATED:20210110T190834Z
LAST-MODIFIED:20210110T190834Z
UID:19006-1610622000-1610625600@hdpusergroup.org
SUMMARY:Cu Surface Treatment Vs Loss Jan 14\, 2021 project meeting
DESCRIPTION:Cu Surface Treatment Vs Loss Jan 14\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-jan-14-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210113T190000Z
DTEND:20210113T200000Z
DTSTAMP:20261017T154400
CREATED:20201228T233523Z
LAST-MODIFIED:20201228T233523Z
UID:18930-1610542800-1610546400@hdpusergroup.org
SUMMARY:Glass Type Composition Jan 13\, 2021 project meeting
DESCRIPTION:Glass Type Composition Jan 13\, 2021 project meeting 
URL:https://hdpusergroup.org/event/glass-type-composition-jan-13-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20201007T010000Z
DTEND:20201008T190000Z
DTSTAMP:20261017T154400
CREATED:20201006T130258Z
LAST-MODIFIED:20210825T011948Z
UID:16989-1602014400-1602165600@hdpusergroup.org
SUMMARY:HDP Fall Virtual Member Meeting
DESCRIPTION:\nAs you are aware\, the recent Global COVID-19 outbreak continues to cause many restrictions on travel. It has caused companies to place restrictions on employee’s participation in conferences and external events. Our members’ safety is paramount\, and the logistics requirements continue to make it difficult to hold a safe\, successful meeting. \nWe felt it important to have a virtual meeting to allow members the opportunity to ask questions and suggest new project ideas. The virtual meeting sessions will take place over three days. The first date will cover our Asian centric projects of October 6. The second and third days\, October 7 and 8 will cover the remaining projects. Webex logistics will be posted on our website closer to the meeting dates.\n\nThe meetings are for members only.  Please register for the webinar by contacting a member of the HDP staff\, or using the register button on the meeting webpage.  Upon registration you will receive the call-in information for each session.\n\nCALL-IN INFORMATION\nHDP October 2020 Virtual Meeting Evening Session\nTuesday\, October 6\, 2020\n8:00 pm  |  (UTC-05:00) Central Time (US & Canada)  |  3 hrs\nGlobal call-in numbers\nMeeting number (access code): 126 850 0676\nMeeting password: HDP102020 \nWhen it’s time\, join the meeting. \n  \nJoin by phone\n1-650-479-3208 Call-in toll number (US/Canada)\nGlobal call-in numbers \n\n\n\n\n\nAdd to Calendar \n\n\n\n\n  \nHDP October 2020 Virtual Meeting Day 1\nWednesday\, October 7\, 2020\n10:00 am  |  (UTC-05:00) Central Time (US & Canada)  |  4 hrs\nGlobal call-in numbers\nMeeting number (access code): 126 701 6799\nMeeting password: HDP102020 \nWhen it’s time\, join the meeting \nJoin by phone\n1-650-479-3208 Call-in toll number (US/Canada)\nGlobal call-in numbers \n\n\n\n\n\nAdd to Calendar \n\n\n\n\n  \nHDP October 2020 Virtual Meeting Day 2\nThursday\, October 8\, 2020\n10:00 am  |  (UTC-05:00) Central Time (US & Canada)  |  4 hrs\nGlobal call-in numbers\nMeeting number (access code): 126 873 2280\nMeeting password: HDP102020 \nWhen it’s time\, join the meeting \nJoin by phone\n1-650-479-3208 Call-in toll number (US/Canada)\nGlobal call-in numbers \n\n\n\n\n\nAdd to Calendar \n\n\n\n
URL:https://hdpusergroup.org/event/hdp-fall-member-meeting/
LOCATION:WebEx
CATEGORIES:Member Meetings
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200806T170000Z
DTEND:20200806T180000Z
DTSTAMP:20261017T154400
CREATED:20200717T215942Z
LAST-MODIFIED:20200717T215942Z
UID:17698-1596715200-1596718800@hdpusergroup.org
SUMMARY:VeCS Technology evaluation Aug 6\, 2020 project meetings
DESCRIPTION:VeCS Technology evaluation Aug 6\, 2020 project meetings 
URL:https://hdpusergroup.org/event/vecs-technology-evaluation-aug-5-2020-project-meetings/
LOCATION:WebEx
CATEGORIES:VeCS Technology Evaluation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200806T170000Z
DTEND:20200806T180000Z
DTSTAMP:20261017T154400
CREATED:20200717T213750Z
LAST-MODIFIED:20200717T213750Z
UID:17693-1596715200-1596718800@hdpusergroup.org
SUMMARY:Cu Peel Strength meeting of Aug 6\, 2020
DESCRIPTION:Cu Peel Strength meeting of Aug 6\, 2020 
URL:https://hdpusergroup.org/event/cu-peel-strength-meeting-of-aug-6-2020/
LOCATION:WebEx
CATEGORIES:Cu Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200805T180000Z
DTEND:20200805T190000Z
DTSTAMP:20261017T154400
CREATED:20200717T214601Z
LAST-MODIFIED:20200717T214601Z
UID:17695-1596632400-1596636000@hdpusergroup.org
SUMMARY:Glass Type Comparison Aug 5\, 2020 project meeting
DESCRIPTION:Glass Type Comparison Aug 5\, 2020 project meeting 
URL:https://hdpusergroup.org/event/glass-type-comparison-aug-5-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200805T170000Z
DTEND:20200805T180000Z
DTSTAMP:20261017T154400
CREATED:20200717T214919Z
LAST-MODIFIED:20200717T214919Z
UID:17696-1596628800-1596632400@hdpusergroup.org
SUMMARY:Low Ag Alloy Solder Paste Aug 5\, 2020 project meeting
DESCRIPTION:Low Ag Alloy Solder Paste Aug 5\, 2020 project meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solder-paste-aug-5-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200805T160000Z
DTEND:20200805T170000Z
DTSTAMP:20261017T154400
CREATED:20200717T214148Z
LAST-MODIFIED:20200717T214148Z
UID:17694-1596625200-1596628800@hdpusergroup.org
SUMMARY:Cu Surface Treatment Aug 5\, 2020 project meeting
DESCRIPTION:Cu Surface Treatment Aug 5\, 2020 project meeting 
URL:https://hdpusergroup.org/event/cu-surface-treatment-aug-5-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200709T170000Z
DTEND:20200709T180000Z
DTSTAMP:20261017T154400
CREATED:20200618T195708Z
LAST-MODIFIED:20200618T195708Z
UID:17583-1594296000-1594299600@hdpusergroup.org
SUMMARY:VeCS Tech Evaluation July 9\, 2020 project meeting
DESCRIPTION:VeCS Tech Evaluation July 9\, 2020 project meeting 
URL:https://hdpusergroup.org/event/vecs-tech-evaluation-july-9-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:VeCS Technology Evaluation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200709T160000Z
DTEND:20200709T170000Z
DTSTAMP:20261017T154400
CREATED:20200618T195947Z
LAST-MODIFIED:20200618T195947Z
UID:17584-1594292400-1594296000@hdpusergroup.org
SUMMARY:Cu Peel Strength July 9\, 2020 project meeting
DESCRIPTION:Cu Peel Strength July 9\, 2020 project meeting \n \n 
URL:https://hdpusergroup.org/event/cu-peel-strength-july-9-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200708T170000Z
DTEND:20200708T180000Z
DTSTAMP:20261017T154400
CREATED:20200706T190605Z
LAST-MODIFIED:20200706T190605Z
UID:17655-1594209600-1594213200@hdpusergroup.org
SUMMARY:Low Ag Alloy Solder paste July 8\, 2020 meeting
DESCRIPTION:Low Ag Alloy Solder paste July 8\, 2020 meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solder-paste-july-8-2020-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200708T160000Z
DTEND:20200708T170000Z
DTSTAMP:20261017T154400
CREATED:20200701T184601Z
LAST-MODIFIED:20200701T184601Z
UID:17642-1594206000-1594209600@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss July 8\, 2020 meeting
DESCRIPTION:Cu Surface Treatment vs Loss July 8\, 2020 meeting 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-july-8-2020-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200624T180000Z
DTEND:20200624T190000Z
DTSTAMP:20261017T154400
CREATED:20200602T184125Z
LAST-MODIFIED:20200602T184125Z
UID:17488-1593003600-1593007200@hdpusergroup.org
SUMMARY:Glass Type Comparison June 24\, 2020 project meeting
DESCRIPTION:Glass Type Comparison June 24\, 2020 project meeting 
URL:https://hdpusergroup.org/event/glass-type-comparison-june-24-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200624T170000Z
DTEND:20200624T180000Z
DTSTAMP:20261017T154400
CREATED:20200618T195328Z
LAST-MODIFIED:20200618T195328Z
UID:17582-1593000000-1593003600@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste June 24\, 2020 project meeting
DESCRIPTION:Low Ag Alloy Solderpaste June 24\, 2020 project meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-june-24-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200624T160000Z
DTEND:20200624T170000Z
DTSTAMP:20261017T154400
CREATED:20200618T194953Z
LAST-MODIFIED:20200618T194953Z
UID:17581-1592996400-1593000000@hdpusergroup.org
SUMMARY:Cu Surface Treatment June 24\, 2020 project meeting
DESCRIPTION:Cu Surface Treatment June 24\, 2020 project meeting 
URL:https://hdpusergroup.org/event/cu-surface-treatment-june-24-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200611T170000Z
DTEND:20200611T180000Z
DTSTAMP:20261017T154400
CREATED:20200606T214540Z
LAST-MODIFIED:20200606T214540Z
UID:17497-1591876800-1591880400@hdpusergroup.org
SUMMARY:VeCS Technology Evaluation June 11\, 2020 project meeting
DESCRIPTION:VeCS Technology Evaluation June 11\, 2020 project meeting 
URL:https://hdpusergroup.org/event/vecs-technology-evaluation-june-11-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:VeCS Technology Evaluation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200611T160000Z
DTEND:20200611T170000Z
DTSTAMP:20261017T154400
CREATED:20200602T191832Z
LAST-MODIFIED:20200602T191832Z
UID:17490-1591873200-1591876800@hdpusergroup.org
SUMMARY:Cu Peel Strength June 11\, 2020 project meeting
DESCRIPTION:Cu Peel Strength June 11\, 2020 project meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-june-11-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200610T170000Z
DTEND:20200610T180000Z
DTSTAMP:20261017T154400
CREATED:20200602T181338Z
LAST-MODIFIED:20200602T181338Z
UID:17486-1591790400-1591794000@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste June 10\, 2020 project meeting
DESCRIPTION:Low Ag Alloy Solderpaste June 10\, 2020 project meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-june-10-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200610T160000Z
DTEND:20200610T170000Z
DTSTAMP:20261017T154400
CREATED:20200606T222039Z
LAST-MODIFIED:20200606T222039Z
UID:17498-1591786800-1591790400@hdpusergroup.org
SUMMARY:Cu Surface Treatment VS. Loss June 10\, 2020 project meeting
DESCRIPTION:Cu Surface Treatment VS. Loss June 10\, 2020 project meeting 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-june-10-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200528T170000Z
DTEND:20200528T180000Z
DTSTAMP:20261017T154400
CREATED:20200518T195138Z
LAST-MODIFIED:20200518T195138Z
UID:17399-1590667200-1590670800@hdpusergroup.org
SUMMARY:VeCS Technology Evaluation project meeting of May 28\, 2020
DESCRIPTION:VeCS Technology Evaluation project meeting of May 28\, 2020 
URL:https://hdpusergroup.org/event/vecs-technology-evaluation-project-meeting-of-may-28-2020/
LOCATION:WebEx
CATEGORIES:VeCS Technology Evaluation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200527T180000Z
DTEND:20200527T190000Z
DTSTAMP:20261017T154400
CREATED:20200518T195422Z
LAST-MODIFIED:20200518T195422Z
UID:17400-1590584400-1590588000@hdpusergroup.org
SUMMARY:Glass Type Comparison May 27\, 2020 project meeting
DESCRIPTION:Glass Type Comparison May 27\, 2020 project meeting 
URL:https://hdpusergroup.org/event/glass-type-comparison-may-27-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200527T170000Z
DTEND:20200527T180000Z
DTSTAMP:20261017T154400
CREATED:20200518T200146Z
LAST-MODIFIED:20200518T200146Z
UID:17403-1590580800-1590584400@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste May 27\, 2020 project meeting
DESCRIPTION:Low Ag Alloy Solderpaste May 27\, 2020 project meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-may-27-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR