BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20210314T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20211107T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20211213T160000Z
DTEND:20211213T170000Z
DTSTAMP:20261016T210327
CREATED:20211115T202045Z
LAST-MODIFIED:20211115T202045Z
UID:21415-1639389600-1639393200@hdpusergroup.org
SUMMARY:Cu Surface Roughness Model project continuation #2
DESCRIPTION:Continuation of discussions on project proposal for Cu Roughness Model 
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-project-continuation-2/
LOCATION:WebEx
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211115T180000Z
DTEND:20211115T190000Z
DTSTAMP:20261016T210327
CREATED:20211111T201738Z
LAST-MODIFIED:20211111T201738Z
UID:21404-1636977600-1636981200@hdpusergroup.org
SUMMARY:Cu Surface Roughness Model preliminary discussions
DESCRIPTION:Initial new project discussion withon Cu Surface Roughness Model 
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-preliminary-discussions/
LOCATION:WebEx
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211006T170000Z
DTEND:20211006T180000Z
DTSTAMP:20261016T210327
CREATED:20210908T200732Z
LAST-MODIFIED:20210908T200732Z
UID:20568-1633521600-1633525200@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste BGA leg Oct 6 2021 project meeting
DESCRIPTION:Low Ag Alloy Solderpaste BGA leg Oct 6 2021 project meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-bga-leg-oct-6-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210922T180000Z
DTEND:20210922T190000Z
DTSTAMP:20261016T210327
CREATED:20210903T031009Z
LAST-MODIFIED:20210903T031009Z
UID:20323-1632315600-1632319200@hdpusergroup.org
SUMMARY:Glass Type Comparison project meeting of Sept 22 \, 2021
DESCRIPTION:Glass Type Comparison project meeting of Sept 22 \, 2021 
URL:https://hdpusergroup.org/event/glass-type-comparison-project-meeting-of-sept-22-2021/
LOCATION:WebEx
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210909T180000Z
DTEND:20210909T190000Z
DTSTAMP:20261016T210327
CREATED:20210901T183842Z
LAST-MODIFIED:20210901T183842Z
UID:20495-1631192400-1631196000@hdpusergroup.org
SUMMARY:Cu Peel Strength Phase 2 Sept 9\, 2021 project meeting
DESCRIPTION:Cu Peel Strength Phase 2 Sept 9\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-phase-2-sept-9-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210909T160000Z
DTEND:20210909T170000Z
DTSTAMP:20261016T210327
CREATED:20210903T030914Z
LAST-MODIFIED:20210903T030914Z
UID:20322-1631185200-1631188800@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss Sept 9\, 2021 project meeting
DESCRIPTION:Cu Surface Treatment vs Loss Sept 9\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-sept-9-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210908T170000Z
DTEND:20210908T180000Z
DTSTAMP:20261016T210327
CREATED:20210903T031831Z
LAST-MODIFIED:20210903T031831Z
UID:20324-1631102400-1631106000@hdpusergroup.org
SUMMARY:Low Ag Alloy Solder paste BGA leg project meeting of Sept 8\, 2021
DESCRIPTION:Low Ag Alloy Solder paste BGA leg project meeting of Sept 8\, 2021 
URL:https://hdpusergroup.org/event/low-ag-alloy-solder-paste-bga-leg-project-meeting-of-sept-8-2021/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210908T160000Z
DTEND:20210908T170000Z
DTSTAMP:20261016T210327
CREATED:20210901T202008Z
LAST-MODIFIED:20210901T202008Z
UID:20496-1631098800-1631102400@hdpusergroup.org
SUMMARY:Thermal Methodology Analysis Sept 8\, 2021 project meeting
DESCRIPTION:Thermal Methodology Analysis Sept 8\, 2021 project meeting 
URL:https://hdpusergroup.org/event/thermal-methodology-analysis-sept-8-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210825T160000Z
DTEND:20210825T170000Z
DTSTAMP:20261016T210327
CREATED:20210813T183142Z
LAST-MODIFIED:20210813T183142Z
UID:20325-1629889200-1629892800@hdpusergroup.org
SUMMARY:Thermal Analysis Methodology Assessment Aug 25\, 2021 meeting
DESCRIPTION:Thermal Analysis Methodology Assessment Aug 25\, 2021 meeting 
URL:https://hdpusergroup.org/event/thermal-analysis-methodology-assessment-aug-25-2021-meeting/
LOCATION:WebEx
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210811T180000Z
DTEND:20210811T190000Z
DTSTAMP:20261016T210327
CREATED:20210715T223535Z
LAST-MODIFIED:20210715T223535Z
UID:20225-1628686800-1628690400@hdpusergroup.org
SUMMARY:Glass Type Comparison project meeting of Aug 11\, 2021
DESCRIPTION:Glass Type Comparison project meeting of Aug 11\, 2021 
URL:https://hdpusergroup.org/event/glass-type-comparison-project-meeting-of-aug-11-2021/
LOCATION:WebEx
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210811T170000Z
DTEND:20210811T180000Z
DTSTAMP:20261016T210327
CREATED:20210730T200740Z
LAST-MODIFIED:20210730T200740Z
UID:20289-1628683200-1628686800@hdpusergroup.org
SUMMARY:Low Ag Alloy Solder paste BGA leg project meeting of Aug 11\, 2021
DESCRIPTION:Low Ag Alloy Solder paste BGA leg project meeting of Aug 11\, 2021 
URL:https://hdpusergroup.org/event/low-ag-alloy-solder-paste-bga-leg-project-meeting-of-aug-11-2021/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210811T160000Z
DTEND:20210811T170000Z
DTSTAMP:20261016T210327
CREATED:20210810T194812Z
LAST-MODIFIED:20210810T194812Z
UID:20292-1628679600-1628683200@hdpusergroup.org
SUMMARY:Thermal Analysis Methodology Assessment Aug 11\, 2021 meeting
DESCRIPTION:Thermal Analysis Methodology Assessment Aug 11\, 2021 meeting 
URL:https://hdpusergroup.org/event/thermal-analysis-methodology-assessment-aug-11-2021-meeting/
LOCATION:WebEx
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210729T180000Z
DTEND:20210729T190000Z
DTSTAMP:20261016T210327
CREATED:20210715T205022Z
LAST-MODIFIED:20210715T205022Z
UID:20211-1627563600-1627567200@hdpusergroup.org
SUMMARY:Cu Peel Strength July 29\, 2021 project meeting
DESCRIPTION:Cu Peel Strength July 29\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-july-29-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210729T160000Z
DTEND:20210729T170000Z
DTSTAMP:20261016T210327
CREATED:20210715T221453Z
LAST-MODIFIED:20210715T221453Z
UID:20222-1627556400-1627560000@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss July 29\, 2021 project meeting
DESCRIPTION:Cu Surface Treatment vs Loss July 29\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-july-29-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210728T170000Z
DTEND:20210728T180000Z
DTSTAMP:20261016T210327
CREATED:20210719T204925Z
LAST-MODIFIED:20210719T204925Z
UID:20249-1627473600-1627477200@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste July 28\, 2021 project meeting
DESCRIPTION:Low Ag Alloy Solderpaste July 28\, 2021 project meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-july-28-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210728T160000Z
DTEND:20210728T170000Z
DTSTAMP:20261016T210327
CREATED:20210719T205927Z
LAST-MODIFIED:20210719T205927Z
UID:20251-1627470000-1627473600@hdpusergroup.org
SUMMARY:Thermal Analysis Methodology Assessment July 28\, 2021 project meeting
DESCRIPTION:Thermal Analysis Methodology Assessment July 28\, 2021 project meeting 
URL:https://hdpusergroup.org/event/thermal-analysis-methodology-assessment-july-28-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210715T180000Z
DTEND:20210715T190000Z
DTSTAMP:20261016T210327
CREATED:20210701T204626Z
LAST-MODIFIED:20210701T204626Z
UID:20162-1626354000-1626357600@hdpusergroup.org
SUMMARY:Cu Peel Strength Phase 2 July 15\, 2021 project meeting
DESCRIPTION:Cu Peel Strength Phase 2 July 15\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-phase-2-july-15-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210715T160000Z
DTEND:20210715T170000Z
DTSTAMP:20261016T210327
CREATED:20210701T203604Z
LAST-MODIFIED:20210701T203604Z
UID:20157-1626346800-1626350400@hdpusergroup.org
SUMMARY:Cu Foil Surface Treatment vs Loss July 15\, 2021 project meeting
DESCRIPTION:Cu Foil Surface Treatment vs Loss July 15\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-foil-surface-treatment-vs-loss-july-15-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210714T180000Z
DTEND:20210714T190000Z
DTSTAMP:20261016T210327
CREATED:20210621T165659Z
LAST-MODIFIED:20210621T165659Z
UID:20106-1626267600-1626271200@hdpusergroup.org
SUMMARY:Glass Type Composition July 14\, 2021 project meeting
DESCRIPTION:Glass Type Composition July 14\, 2021 project meeting 
URL:https://hdpusergroup.org/event/glass-type-composition-july-14-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210714T170000Z
DTEND:20210714T180000Z
DTSTAMP:20261016T210327
CREATED:20210701T210131Z
LAST-MODIFIED:20210701T210131Z
UID:20167-1626264000-1626267600@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste July 14\, 2021 project meeting
DESCRIPTION:Low Ag Alloy Solderpaste July 14\, 2021 project meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-july-14-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210714T160000Z
DTEND:20210714T170000Z
DTSTAMP:20261016T210327
CREATED:20210701T210650Z
LAST-MODIFIED:20210701T210650Z
UID:20169-1626260400-1626264000@hdpusergroup.org
SUMMARY:Thermal Analysis Methodology Assessment July 14\, 2021 meeting
DESCRIPTION:Thermal Analysis Methodology Assessment July 14\, 2021 meeting 
URL:https://hdpusergroup.org/event/thermal-analysis-methodology-assessment-july-14-2021-meeting/
LOCATION:WebEx
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210701T180000Z
DTEND:20210701T190000Z
DTSTAMP:20261016T210327
CREATED:20210621T164952Z
LAST-MODIFIED:20210621T164952Z
UID:20105-1625144400-1625148000@hdpusergroup.org
SUMMARY:Cu Peel Strength July 1\, 2021 project meeting
DESCRIPTION:Cu Peel Strength July 1\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-july-1-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210701T160000Z
DTEND:20210701T170000Z
DTSTAMP:20261016T210327
CREATED:20210621T164614Z
LAST-MODIFIED:20210621T164614Z
UID:20104-1625137200-1625140800@hdpusergroup.org
SUMMARY:Cu Surface Treatment Vs Loss July 1\, 2021 project meeting
DESCRIPTION:Cu Surface Treatment Vs Loss July 1\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-july-1-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210630T170000Z
DTEND:20210630T180000Z
DTSTAMP:20261016T210327
CREATED:20210524T192101Z
LAST-MODIFIED:20210524T192101Z
UID:19962-1625054400-1625058000@hdpusergroup.org
SUMMARY:Low Ag Alloy Solder paste BGA leg project meeting of June 30\, 2021
DESCRIPTION: Low Ag Alloy Solder paste BGA leg project meeting of June 30\, 2021
URL:https://hdpusergroup.org/event/low-ag-alloy-solder-paste-bga-leg-project-meeting-of-june-30-2021/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210630T160000Z
DTEND:20210630T170000Z
DTSTAMP:20261016T210327
CREATED:20210621T170522Z
LAST-MODIFIED:20210621T170522Z
UID:20107-1625050800-1625054400@hdpusergroup.org
SUMMARY:Thermal Analysis Methodology Evaluation June 30\, 2021 project meeting
DESCRIPTION:Thermal Analysis Methodology Evaluation June 30\, 2021 project meeting 
URL:https://hdpusergroup.org/event/thermal-analysis-methodology-evaluation-june-30-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210616T180000Z
DTEND:20210616T190000Z
DTSTAMP:20261016T210327
CREATED:20210609T165509Z
LAST-MODIFIED:20210609T165509Z
UID:20055-1623848400-1623852000@hdpusergroup.org
SUMMARY:Glass Type Composition June 16\, 2021 meeting
DESCRIPTION:Glass Type Composition June 16\, 2021 meeting 
URL:https://hdpusergroup.org/event/glass-type-composition-june-16-2021-meeting/
LOCATION:WebEx
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210616T160000Z
DTEND:20210616T170000Z
DTSTAMP:20261016T210327
CREATED:20210608T191535Z
LAST-MODIFIED:20210608T191535Z
UID:20042-1623841200-1623844800@hdpusergroup.org
SUMMARY:Thermal Analysis Mehthodology Evaluation June 16\, 2021 meeting
DESCRIPTION:Thermal Analysis Mehthodology Evaluation June 16\, 2021 meeting 
URL:https://hdpusergroup.org/event/thermal-analysis-mehthodology-evaluation-june-16-2021-meeting/
LOCATION:WebEx
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210603T180000Z
DTEND:20210603T190000Z
DTSTAMP:20261016T210327
CREATED:20210521T192624Z
LAST-MODIFIED:20210521T192624Z
UID:19946-1622725200-1622728800@hdpusergroup.org
SUMMARY:Cu Peel Strength June 3\, 2021 project meeting
DESCRIPTION:Cu Peel Strength June 3\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-june-3-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210603T170000Z
DTEND:20210603T180000Z
DTSTAMP:20261016T210327
CREATED:20210520T143906Z
LAST-MODIFIED:20210520T143906Z
UID:19941-1622721600-1622725200@hdpusergroup.org
SUMMARY:Thermal Analysis Methodology Eval June 3\, 2021 meeting
DESCRIPTION:Thermal Analysis Methodology Eval June 3\, 2021 meeting. \nNOTE we will be going back to Wednesdays at 11AM CST on June 16th 
URL:https://hdpusergroup.org/event/thermal-analysis-methodology-eval-june-3-2021-meeting/
LOCATION:WebEx
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210603T160000Z
DTEND:20210603T170000Z
DTSTAMP:20261016T210327
CREATED:20210521T192952Z
LAST-MODIFIED:20210521T192952Z
UID:19947-1622718000-1622721600@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss June 3\, 2021 meeting
DESCRIPTION:Cu Surface Treatment vs Loss June 3\, 2021 meeting 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-june-3-2021-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR