BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20250309T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20251102T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20250731T010000Z
DTEND:20250731T020000Z
DTSTAMP:20260420T211959
CREATED:20250717T010744Z
LAST-MODIFIED:20250717T010744Z
UID:36303-1753905600-1753909200@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-22/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250730T230000Z
DTEND:20250731T000000Z
DTSTAMP:20260420T211959
CREATED:20250724T162924Z
LAST-MODIFIED:20250724T162924Z
UID:36345-1753898400-1753902000@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Project progress 
URL:https://hdpusergroup.org/event/porosity-23/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250730T150000Z
DTEND:20250730T160000Z
DTSTAMP:20260420T211959
CREATED:20250627T200914Z
LAST-MODIFIED:20250627T200914Z
UID:36217-1753869600-1753873200@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project Kickoff
DESCRIPTION:This new HDP project seeks to determine the worst case electrical skew that is now possible when using thinner dielectrics\, and how much electrical skew can be mitigated by changing the orientation / alignment of traces with the glass weave bundles that reinforce most laminate materials. 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-kickoff-3/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250729T150000Z
DTEND:20250729T160000Z
DTSTAMP:20260420T211959
CREATED:20250715T151604Z
LAST-MODIFIED:20250715T151604Z
UID:36275-1753783200-1753786800@hdpusergroup.org
SUMMARY:Microvia Electrical Performance
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/microvia-electrical-performance/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250725T030000Z
DTEND:20250725T033000Z
DTSTAMP:20260420T211959
CREATED:20250724T153437Z
LAST-MODIFIED:20250724T153437Z
UID:36343-1753394400-1753396200@hdpusergroup.org
SUMMARY:Testing Again
DESCRIPTION:Still testing.... 
URL:https://hdpusergroup.org/event/testing-again-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250724T190000Z
DTEND:20250724T200000Z
DTSTAMP:20260420T211959
CREATED:20250724T134244Z
LAST-MODIFIED:20250724T134244Z
UID:36336-1753365600-1753369200@hdpusergroup.org
SUMMARY:Meeting with Neil Hubble
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/meeting-with-neil-hubble/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250724T160000Z
DTEND:20250724T170000Z
DTSTAMP:20260420T211959
CREATED:20250626T162822Z
LAST-MODIFIED:20250626T162822Z
UID:36193-1753354800-1753358400@hdpusergroup.org
SUMMARY:Single Surface Finish 2
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-14/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250724T153000Z
DTEND:20250724T160000Z
DTSTAMP:20260420T211959
CREATED:20250724T145700Z
LAST-MODIFIED:20250724T145700Z
UID:36330-1753353000-1753354800@hdpusergroup.org
SUMMARY:Meeting Testing with Dan P – No List
DESCRIPTION:Testing meeting scheduling and notification system with Dan Prezioso\, Juniper.  This test does NOT include a distribution list. 
URL:https://hdpusergroup.org/event/meeting-testing-with-dan-p-no-list/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250724T000000Z
DTEND:20250724T010000Z
DTSTAMP:20260420T211959
CREATED:20250703T003942Z
LAST-MODIFIED:20250703T003942Z
UID:36243-1753297200-1753300800@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-5/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250723T230000Z
DTEND:20250724T000000Z
DTSTAMP:20260420T211959
CREATED:20250709T231949Z
LAST-MODIFIED:20250709T231949Z
UID:36258-1753293600-1753297200@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Several action items need to be completed in the next two weeks! 
URL:https://hdpusergroup.org/event/porosity-22/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250722T150000Z
DTEND:20250722T160000Z
DTSTAMP:20260420T211959
CREATED:20250710T190948Z
LAST-MODIFIED:20250710T190948Z
UID:36264-1753178400-1753182000@hdpusergroup.org
SUMMARY:Stacked vs. Staggered Microvias
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-vs-staggered-microvias-6/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250721T150000Z
DTEND:20250721T160000Z
DTSTAMP:20260420T211959
CREATED:20250630T154748Z
LAST-MODIFIED:20250630T154748Z
UID:36223-1753092000-1753095600@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-67/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250717T210000Z
DTEND:20250717T220000Z
DTSTAMP:20260420T211959
CREATED:20250626T214353Z
LAST-MODIFIED:20250626T214353Z
UID:36196-1752768000-1752771600@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-20/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250717T150000Z
DTEND:20250717T160000Z
DTSTAMP:20260420T211959
CREATED:20250626T144726Z
LAST-MODIFIED:20250626T144726Z
UID:36188-1752746400-1752750000@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing Phase 2
DESCRIPTION:Inner Layer Copper Balancing Phase 2 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-phase-2-7/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250717T140000Z
DTEND:20250717T150000Z
DTSTAMP:20260420T211959
CREATED:20250619T190932Z
LAST-MODIFIED:20250619T190932Z
UID:36124-1752742800-1752746400@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-34/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250717T130000Z
DTEND:20250717T220000Z
DTSTAMP:20260420T211959
CREATED:20250717T154048Z
LAST-MODIFIED:20250717T154048Z
UID:36310-1752739200-1752771600@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing 2
DESCRIPTION:Project goal is to develop a CAD translator utility that will provide analysis of local copper distribution to identify risk areas for core deformation and backdrill stub variation\, surface topography variation\, and local areas of glass stop. 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250717T010000Z
DTEND:20250717T020000Z
DTSTAMP:20260420T211959
CREATED:20250626T012530Z
LAST-MODIFIED:20250626T012530Z
UID:36184-1752696000-1752699600@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-21/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250716T150000Z
DTEND:20250716T160000Z
DTSTAMP:20260420T211959
CREATED:20250609T203551Z
LAST-MODIFIED:20250609T203551Z
UID:34339-1752660000-1752663600@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-ups
DESCRIPTION:Build progress 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-9/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250716T140000Z
DTEND:20250716T150000Z
DTSTAMP:20260420T211959
CREATED:20250626T143334Z
LAST-MODIFIED:20250626T143334Z
UID:36187-1752656400-1752660000@hdpusergroup.org
SUMMARY:ECM-4
DESCRIPTION:Electrochemical Migration Testing Phase 4 
URL:https://hdpusergroup.org/event/ecm-4-8/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250715T150000Z
DTEND:20250715T160000Z
DTSTAMP:20260420T211959
CREATED:20250701T121727Z
LAST-MODIFIED:20250701T121727Z
UID:36225-1752573600-1752577200@hdpusergroup.org
SUMMARY:Microvia Electrical Characterization
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/microvia-electrical-characterization/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250710T160000Z
DTEND:20250710T170000Z
DTSTAMP:20260420T211959
CREATED:20250628T134442Z
LAST-MODIFIED:20250628T134442Z
UID:36219-1752145200-1752148800@hdpusergroup.org
SUMMARY:TCE Materials-Test Method Validation
DESCRIPTION:Validate and recommend new and standard TM for CTE using TMA. 
URL:https://hdpusergroup.org/event/tce-materials-test-method-validation/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250710T150000Z
DTEND:20250710T160000Z
DTSTAMP:20260420T211959
CREATED:20250619T151943Z
LAST-MODIFIED:20250619T151943Z
UID:36162-1752141600-1752145200@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-45/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250710T140000Z
DTEND:20250710T150000Z
DTSTAMP:20260420T211959
CREATED:20250702T154326Z
LAST-MODIFIED:20250702T154326Z
UID:36241-1752138000-1752141600@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact SMTAi Paper Review
DESCRIPTION:Reflow Cycle Via Reliability Impact SMTAi Paper Review 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-smtai-paper-review/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250710T130000Z
DTEND:20250710T140000Z
DTSTAMP:20260420T211959
CREATED:20250626T162122Z
LAST-MODIFIED:20250626T162122Z
UID:36190-1752134400-1752138000@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing
DESCRIPTION:D-Coupon IST CITC Reliability Testing 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-3/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250709T230000Z
DTEND:20250710T000000Z
DTSTAMP:20260420T211959
CREATED:20250610T232331Z
LAST-MODIFIED:20250610T232331Z
UID:36090-1752084000-1752087600@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Progress on action items 
URL:https://hdpusergroup.org/event/porosity-21/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250709T160000Z
DTEND:20250709T170000Z
DTSTAMP:20260420T211959
CREATED:20250702T145722Z
LAST-MODIFIED:20250702T145722Z
UID:36178-1752058800-1752062400@hdpusergroup.org
SUMMARY:Sequential Lamination
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-22/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250709T140000Z
DTEND:20250709T150000Z
DTSTAMP:20260420T211959
CREATED:20250618T141633Z
LAST-MODIFIED:20250618T141633Z
UID:36121-1752051600-1752055200@hdpusergroup.org
SUMMARY:tCAF Eq
DESCRIPTION:Results of limited FA \nData analysis update \nStart of report writing 
URL:https://hdpusergroup.org/event/tcaf-eq/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250708T150000Z
DTEND:20250708T160000Z
DTSTAMP:20260420T211959
CREATED:20250701T121619Z
LAST-MODIFIED:20250701T121619Z
UID:36224-1751968800-1751972400@hdpusergroup.org
SUMMARY:Stacked vs. Staggered Microvias
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-vs-staggered-microvias-5/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250703T000000Z
DTEND:20250703T010000Z
DTSTAMP:20260420T211959
CREATED:20250620T005131Z
LAST-MODIFIED:20250620T005131Z
UID:36170-1751482800-1751486400@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-4/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250701T170000Z
DTEND:20250701T180000Z
DTSTAMP:20260420T211959
CREATED:20250603T172754Z
LAST-MODIFIED:20250603T172754Z
UID:35965-1751371200-1751374800@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluations-project-call-10/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR