BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20250309T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20251102T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20250821T010000Z
DTEND:20250821T020000Z
DTSTAMP:20260420T105707
CREATED:20250731T010920Z
LAST-MODIFIED:20250731T010920Z
UID:36364-1755720000-1755723600@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-23/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250820T160000Z
DTEND:20250820T170000Z
DTSTAMP:20260420T105707
CREATED:20250709T161853Z
LAST-MODIFIED:20250709T161853Z
UID:36256-1755687600-1755691200@hdpusergroup.org
SUMMARY:Sequential Lamination
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-23/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250820T150000Z
DTEND:20250820T160000Z
DTSTAMP:20260420T105707
CREATED:20250813T160614Z
LAST-MODIFIED:20250813T160614Z
UID:36647-1755684000-1755687600@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-ups
DESCRIPTION:Update on build 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-10/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250820T140000Z
DTEND:20250820T150000Z
DTSTAMP:20260420T105707
CREATED:20250807T151947Z
LAST-MODIFIED:20250807T151947Z
UID:36497-1755680400-1755684000@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-47/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250818T150000Z
DTEND:20250818T160000Z
DTSTAMP:20260420T105707
CREATED:20250804T160220Z
LAST-MODIFIED:20250804T160220Z
UID:36375-1755511200-1755514800@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-69/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250814T170000Z
DTEND:20250814T180000Z
DTSTAMP:20260420T105707
CREATED:20250804T215448Z
LAST-MODIFIED:20250804T215448Z
UID:36356-1755172800-1755176400@hdpusergroup.org
SUMMARY:Kick off Meeting for PCB Flatness at Large Package Attach Locations
DESCRIPTION:Kick off Meeting for PCB Flatness at Large Package Attach Locations 
URL:https://hdpusergroup.org/event/kick-off-meeting-for-pcb-flatness-at-large-package-attach-locations/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250814T160000Z
DTEND:20250814T170000Z
DTSTAMP:20260420T105707
CREATED:20250731T162634Z
LAST-MODIFIED:20250731T162634Z
UID:36372-1755169200-1755172800@hdpusergroup.org
SUMMARY:TCE Materials -test method validation
DESCRIPTION:Validating CTE measurements. Continued defining the test plan. 
URL:https://hdpusergroup.org/event/tce-materials-test-method-validation-2/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250814T000000Z
DTEND:20250814T010000Z
DTSTAMP:20260420T105707
CREATED:20250724T003418Z
LAST-MODIFIED:20250724T003418Z
UID:36335-1755111600-1755115200@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-6/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250813T200000Z
DTEND:20250813T210000Z
DTSTAMP:20260420T105707
CREATED:20250723T130351Z
LAST-MODIFIED:20250723T130351Z
UID:36329-1755097200-1755100800@hdpusergroup.org
SUMMARY:Cu Trace Adhesion
DESCRIPTION:Up date on build 
URL:https://hdpusergroup.org/event/cu-trace-adhesion/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250813T140000Z
DTEND:20250813T150000Z
DTSTAMP:20260420T105707
CREATED:20250730T155831Z
LAST-MODIFIED:20250730T155831Z
UID:36359-1755075600-1755079200@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project Kickoff
DESCRIPTION:New HDP project investigating the impact of thin dielectrics on electric skew 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-kickoff-4/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250812T160000Z
DTEND:20250812T170000Z
DTSTAMP:20260420T105707
CREATED:20250805T192328Z
LAST-MODIFIED:20250805T192328Z
UID:36306-1754996400-1755000000@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-35/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250812T150000Z
DTEND:20250812T160000Z
DTSTAMP:20260420T105707
CREATED:20250722T171025Z
LAST-MODIFIED:20250722T171025Z
UID:36327-1754992800-1754996400@hdpusergroup.org
SUMMARY:Stacked vs. Staggered Microvias
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-vs-staggered-microvias-7/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250807T210000Z
DTEND:20250807T220000Z
DTSTAMP:20260420T105707
CREATED:20250717T215625Z
LAST-MODIFIED:20250717T215625Z
UID:36315-1754582400-1754586000@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysi 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-21/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250807T160000Z
DTEND:20250807T170000Z
DTSTAMP:20260420T105707
CREATED:20250724T191957Z
LAST-MODIFIED:20250724T191957Z
UID:36349-1754564400-1754568000@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Roughness Model for signal integrity. 
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-20/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250807T160000Z
DTEND:20250807T160000Z
DTSTAMP:20260420T105707
CREATED:20250724T191936Z
LAST-MODIFIED:20250724T191936Z
UID:36348-1754564400-1754564400@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Roughness Model for signal integrity. 
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-19/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250807T160000Z
DTEND:20250807T160000Z
DTSTAMP:20260420T105707
CREATED:20250724T191926Z
LAST-MODIFIED:20250724T191926Z
UID:36347-1754564400-1754564400@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Roughness Model for signal integrity. 
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-18/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250807T150000Z
DTEND:20250807T160000Z
DTSTAMP:20260420T105707
CREATED:20250710T153203Z
LAST-MODIFIED:20250710T153203Z
UID:36261-1754560800-1754564400@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-46/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250807T140000Z
DTEND:20250807T150000Z
DTSTAMP:20260420T105707
CREATED:20250716T142419Z
LAST-MODIFIED:20250716T142419Z
UID:36278-1754557200-1754560800@hdpusergroup.org
SUMMARY:ECM-4
DESCRIPTION:Develop a test vehicle design and test method for determining whether printed board soldermask application is sufficient protection against corrosion. 
URL:https://hdpusergroup.org/event/ecm-4-9/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250806T150000Z
DTEND:20250806T160000Z
DTSTAMP:20260420T105707
CREATED:20250805T194228Z
LAST-MODIFIED:20250805T194228Z
UID:36402-1754474400-1754478000@hdpusergroup.org
SUMMARY:Project discussion
DESCRIPTION:meeting discussion 
URL:https://hdpusergroup.org/event/project-discussion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250806T140000Z
DTEND:20250806T150000Z
DTSTAMP:20260420T105707
CREATED:20250709T141833Z
LAST-MODIFIED:20250709T141833Z
UID:36255-1754470800-1754474400@hdpusergroup.org
SUMMARY:CAF Eq
DESCRIPTION:Updates on: \nFA \nData analysis \nProject report 
URL:https://hdpusergroup.org/event/caf-eq-6/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250805T170000Z
DTEND:20250805T180000Z
DTSTAMP:20260420T105707
CREATED:20250708T134203Z
LAST-MODIFIED:20250708T134203Z
UID:36254-1754395200-1754398800@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-project-call-13/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250804T150000Z
DTEND:20250804T160000Z
DTSTAMP:20260420T105707
CREATED:20250721T152607Z
LAST-MODIFIED:20250721T152607Z
UID:36320-1754301600-1754305200@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-68/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250731T160000Z
DTEND:20250731T170000Z
DTSTAMP:20260420T105707
CREATED:20250720T160847Z
LAST-MODIFIED:20250720T160847Z
UID:36318-1753959600-1753963200@hdpusergroup.org
SUMMARY:TCE Materials-TM validation
DESCRIPTION:Finalize test plan to validate TM for CTE measurements 
URL:https://hdpusergroup.org/event/tce-materials-tm-validation/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250731T130000Z
DTEND:20250731T140000Z
DTSTAMP:20260420T105707
CREATED:20250730T223025Z
LAST-MODIFIED:20250730T223025Z
UID:36259-1753948800-1753952400@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing
DESCRIPTION:Project to measure and compare sensitivity of each test method to preconditioning/assembly reflow profile difference(s) that significantly impact long term reliability. 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-4/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250731T010000Z
DTEND:20250731T020000Z
DTSTAMP:20260420T105707
CREATED:20250717T010744Z
LAST-MODIFIED:20250717T010744Z
UID:36303-1753905600-1753909200@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-22/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250730T230000Z
DTEND:20250731T000000Z
DTSTAMP:20260420T105707
CREATED:20250724T162924Z
LAST-MODIFIED:20250724T162924Z
UID:36345-1753898400-1753902000@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Project progress 
URL:https://hdpusergroup.org/event/porosity-23/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250730T150000Z
DTEND:20250730T160000Z
DTSTAMP:20260420T105707
CREATED:20250627T200914Z
LAST-MODIFIED:20250627T200914Z
UID:36217-1753869600-1753873200@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project Kickoff
DESCRIPTION:This new HDP project seeks to determine the worst case electrical skew that is now possible when using thinner dielectrics\, and how much electrical skew can be mitigated by changing the orientation / alignment of traces with the glass weave bundles that reinforce most laminate materials. 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-kickoff-3/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250729T150000Z
DTEND:20250729T160000Z
DTSTAMP:20260420T105707
CREATED:20250715T151604Z
LAST-MODIFIED:20250715T151604Z
UID:36275-1753783200-1753786800@hdpusergroup.org
SUMMARY:Microvia Electrical Performance
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/microvia-electrical-performance/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250725T030000Z
DTEND:20250725T033000Z
DTSTAMP:20260420T105707
CREATED:20250724T153437Z
LAST-MODIFIED:20250724T153437Z
UID:36343-1753394400-1753396200@hdpusergroup.org
SUMMARY:Testing Again
DESCRIPTION:Still testing.... 
URL:https://hdpusergroup.org/event/testing-again-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250724T190000Z
DTEND:20250724T200000Z
DTSTAMP:20260420T105707
CREATED:20250724T134244Z
LAST-MODIFIED:20250724T134244Z
UID:36336-1753365600-1753369200@hdpusergroup.org
SUMMARY:Meeting with Neil Hubble
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/meeting-with-neil-hubble/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR