BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20260308T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20261101T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20260514T010000Z
DTEND:20260514T020000Z
DTSTAMP:20260609T230441
CREATED:20260427T003911Z
LAST-MODIFIED:20260427T003911Z
UID:39980-1778702400-1778706000@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-35/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260513T150000Z
DTEND:20260513T160000Z
DTSTAMP:20260609T230441
CREATED:20260429T153211Z
LAST-MODIFIED:20260429T153211Z
UID:40097-1778666400-1778670000@hdpusergroup.org
SUMMARY:Pb Free Materials 7 Project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pb-free-materials-7-project-call-14/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260513T140000Z
DTEND:20260513T150000Z
DTSTAMP:20260609T230441
CREATED:20260513T143032Z
LAST-MODIFIED:20260513T143032Z
UID:40224-1778662800-1778666400@hdpusergroup.org
SUMMARY:ECM-4
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/ecm-4-23/
CATEGORIES:Electro-Chemical Migration 4
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260513T030000Z
DTEND:20260513T040000Z
DTSTAMP:20260609T230441
CREATED:20260506T140936Z
LAST-MODIFIED:20260506T140936Z
UID:40126-1778623200-1778626800@hdpusergroup.org
SUMMARY:Call with BW Wanda Plus Grand Hotel on AV setup
DESCRIPTION:Call with BW Wanda Plus Grand Hotel on AV setup 
URL:https://hdpusergroup.org/event/call-with-bw-wanda-plus-grand-hotel-on-av-setup/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260512T150000Z
DTEND:20260512T160000Z
DTSTAMP:20260609T230441
CREATED:20260505T110754Z
LAST-MODIFIED:20260505T110754Z
UID:40119-1778580000-1778583600@hdpusergroup.org
SUMMARY:Stacked Microvia Capability Improvement
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-microvia-capability-improvement-14/
CATEGORIES:Stacked vs. Staggered Microvias
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260507T210000Z
DTEND:20260507T220000Z
DTSTAMP:20260609T230441
CREATED:20260423T220009Z
LAST-MODIFIED:20260423T220009Z
UID:40081-1778169600-1778173200@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-35/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260507T150000Z
DTEND:20260507T160000Z
DTSTAMP:20260609T230441
CREATED:20260427T161325Z
LAST-MODIFIED:20260427T161325Z
UID:40092-1778148000-1778151600@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing
DESCRIPTION:Project WebEx Meeting Call 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-16/
CATEGORIES:D-Coupon IST CITC Reliability Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260506T150000Z
DTEND:20260506T160000Z
DTSTAMP:20260609T230441
CREATED:20260422T152119Z
LAST-MODIFIED:20260422T152119Z
UID:40049-1778061600-1778065200@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-45/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260505T190000Z
DTEND:20260505T200000Z
DTSTAMP:20260609T230441
CREATED:20260427T014729Z
LAST-MODIFIED:20260427T014729Z
UID:40030-1777989600-1777993200@hdpusergroup.org
SUMMARY:Effect of Metal Additions on Solder Joint Reliability Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/effect-of-metal-additions-on-solder-joint-reliability-project-call/
CATEGORIES:Effect of Metal Additions from Final Finishes on Solder Joint Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260505T170000Z
DTEND:20260505T180000Z
DTSTAMP:20260609T230441
CREATED:20260408T192022Z
LAST-MODIFIED:20260408T192022Z
UID:40019-1777982400-1777986000@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluations-project-call-11/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260504T150000Z
DTEND:20260504T160000Z
DTSTAMP:20260609T230441
CREATED:20260413T160020Z
LAST-MODIFIED:20260413T160020Z
UID:40027-1777888800-1777892400@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency Phase 2 and 3
DESCRIPTION:Final Finish Layer Deposits for High Frequency Phase 2 and 3 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-phase-2-and-3-5/
CATEGORIES:Final Finish Layer Deposits for High Frequency Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260430T200000Z
DTEND:20260430T210000Z
DTSTAMP:20260609T230441
CREATED:20260415T205225Z
LAST-MODIFIED:20260415T205225Z
UID:40031-1777561200-1777564800@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Talk about a phase 2 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-28/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260430T160000Z
DTEND:20260430T170000Z
DTSTAMP:20260609T230441
CREATED:20260402T155556Z
LAST-MODIFIED:20260402T155556Z
UID:39803-1777546800-1777550400@hdpusergroup.org
SUMMARY:Sequential Lamination Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-meeting-5/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260430T150000Z
DTEND:20260430T160000Z
DTSTAMP:20260609T230441
CREATED:20260408T161949Z
LAST-MODIFIED:20260408T161949Z
UID:40016-1777543200-1777546800@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-6/
CATEGORIES:Thin Dielectric Skew
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260430T140000Z
DTEND:20260430T150000Z
DTSTAMP:20260609T230441
CREATED:20260416T142607Z
LAST-MODIFIED:20260416T142607Z
UID:40033-1777539600-1777543200@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-19/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260429T150000Z
DTEND:20260429T160000Z
DTSTAMP:20260609T230441
CREATED:20260408T155235Z
LAST-MODIFIED:20260408T155235Z
UID:40015-1777456800-1777460400@hdpusergroup.org
SUMMARY:Pb Free Materials 7 Project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pb-free-materials-7-project-call-13/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260428T194500Z
DTEND:20260428T204500Z
DTSTAMP:20260609T230441
CREATED:20260428T193033Z
LAST-MODIFIED:20260428T193033Z
UID:40094-1777387500-1777391100@hdpusergroup.org
SUMMARY:Kim Testing WebEx settings
DESCRIPTION:Kim messing with WebEx settings to – force company name and display next f2f meeting info.  Feel free to join and test. 
URL:https://hdpusergroup.org/event/kim-testing-webex-settings/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260428T170000Z
DTEND:20260428T180000Z
DTSTAMP:20260609T230441
CREATED:20260414T113100Z
LAST-MODIFIED:20260414T113100Z
UID:40028-1777377600-1777381200@hdpusergroup.org
SUMMARY:Paste Interconnect Exploratory Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/paste-interconnect-exploratory-meeting/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260428T150000Z
DTEND:20260428T160000Z
DTSTAMP:20260609T230441
CREATED:20260409T123300Z
LAST-MODIFIED:20260409T123300Z
UID:40021-1777370400-1777374000@hdpusergroup.org
SUMMARY:Stacked Microvia Capability Improvement
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-microvia-capability-improvement-13/
CATEGORIES:Stacked vs. Staggered Microvias
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260424T000000Z
DTEND:20260424T010000Z
DTSTAMP:20260609T230441
CREATED:20260417T003203Z
LAST-MODIFIED:20260417T003203Z
UID:40035-1776970800-1776974400@hdpusergroup.org
SUMMARY:Porosity Testing
DESCRIPTION:Finish final report? \nWork on presentations for Closeout and Phase 2 
URL:https://hdpusergroup.org/event/porosity-testing-12/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260423T210000Z
DTEND:20260423T220000Z
DTSTAMP:20260609T230441
CREATED:20260402T224006Z
LAST-MODIFIED:20260402T224006Z
UID:40000-1776960000-1776963600@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-34/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260423T150000Z
DTEND:20260423T160000Z
DTSTAMP:20260609T230441
CREATED:20260402T155218Z
LAST-MODIFIED:20260402T155218Z
UID:39995-1776938400-1776942000@hdpusergroup.org
SUMMARY:PCB Flatness at Lg Package Attach
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pcb-flatness-at-lg-package-attach-5/
CATEGORIES:PCB Flatness for LG Mod Attach
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260422T150000Z
DTEND:20260422T160000Z
DTSTAMP:20260609T230441
CREATED:20260331T151724Z
LAST-MODIFIED:20260331T151724Z
UID:39947-1776852000-1776855600@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-43/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260422T140000Z
DTEND:20260422T150000Z
DTSTAMP:20260609T230441
CREATED:20260409T144851Z
LAST-MODIFIED:20260409T144851Z
UID:40022-1776848400-1776852000@hdpusergroup.org
SUMMARY:ECM-4
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/ecm-4-21/
CATEGORIES:Electro-Chemical Migration 4
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260417T000000Z
DTEND:20260417T010000Z
DTSTAMP:20260609T230441
CREATED:20260403T002641Z
LAST-MODIFIED:20260403T002641Z
UID:40002-1776366000-1776369600@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Close to finishing final report \nFinalize prsesentation for BoD for phase 2? 
URL:https://hdpusergroup.org/event/porosity-32/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260416T190000Z
DTEND:20260416T200000Z
DTSTAMP:20260609T230441
CREATED:20260326T204227Z
LAST-MODIFIED:20260326T204227Z
UID:39804-1776348000-1776351600@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-ups
DESCRIPTION:Latest FA results \nWork on final report? 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-19/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260416T150000Z
DTEND:20260416T160000Z
DTSTAMP:20260609T230441
CREATED:20260327T005130Z
LAST-MODIFIED:20260327T005130Z
UID:39809-1776333600-1776337200@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing
DESCRIPTION:Project WebEx Meeting 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-15/
CATEGORIES:D-Coupon IST CITC Reliability Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260416T140000Z
DTEND:20260416T150000Z
DTSTAMP:20260609T230441
CREATED:20260330T160121Z
LAST-MODIFIED:20260330T160121Z
UID:39690-1776330000-1776333600@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-18/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260415T200000Z
DTEND:20260415T210000Z
DTSTAMP:20260609T230441
CREATED:20260401T205730Z
LAST-MODIFIED:20260401T205730Z
UID:39972-1776265200-1776268800@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Work on final report 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-27/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260414T190000Z
DTEND:20260414T200000Z
DTSTAMP:20260609T230441
CREATED:20260402T152744Z
LAST-MODIFIED:20260402T152744Z
UID:39992-1776175200-1776178800@hdpusergroup.org
SUMMARY:Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/effect-of-metal-additions-from-final-finishes-on-solder-joint-reliability-project-call/
CATEGORIES:Effect of Metal Additions from Final Finishes on Solder Joint Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR