BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20250309T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20251102T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20250904T160000Z
DTEND:20250904T170000Z
DTSTAMP:20260418T003945
CREATED:20250814T165214Z
LAST-MODIFIED:20250814T165214Z
UID:36696-1756983600-1756987200@hdpusergroup.org
SUMMARY:TCE Materials x-Y test method validation
DESCRIPTION:Review test parameters. \nfinalize particpants \nRequest implementation 
URL:https://hdpusergroup.org/event/tce-materials-x-y-test-method-validation/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250904T150000Z
DTEND:20250904T160000Z
DTSTAMP:20260418T003945
CREATED:20250821T161200Z
LAST-MODIFIED:20250821T161200Z
UID:36888-1756980000-1756983600@hdpusergroup.org
SUMMARY:Single Surface Finish 2
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-15/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250904T140000Z
DTEND:20250904T150000Z
DTSTAMP:20260418T003945
CREATED:20250821T141943Z
LAST-MODIFIED:20250821T141943Z
UID:36876-1756976400-1756980000@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact SMTAi Paper Review
DESCRIPTION:Reflow Cycle Via Reliability Impact SMTAi Paper Review 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-smtai-paper-review-3/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250904T010000Z
DTEND:20250904T020000Z
DTSTAMP:20260418T003945
CREATED:20250821T011708Z
LAST-MODIFIED:20250821T011708Z
UID:36865-1756929600-1756933200@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-24/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250903T160000Z
DTEND:20250903T170000Z
DTSTAMP:20260418T003945
CREATED:20250820T164504Z
LAST-MODIFIED:20250820T164504Z
UID:36837-1756897200-1756900800@hdpusergroup.org
SUMMARY:Sequential Lamination Project Call
DESCRIPTION:Sequential Lamination Project Call 
URL:https://hdpusergroup.org/event/sequential-lamination-project-call/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250903T150000Z
DTEND:20250903T160000Z
DTSTAMP:20260418T003945
CREATED:20250820T164134Z
LAST-MODIFIED:20250820T164134Z
UID:36836-1756893600-1756897200@hdpusergroup.org
SUMMARY:Pb Free Materials 7  Project Call
DESCRIPTION:Pb Free Materials 7  Project call 
URL:https://hdpusergroup.org/event/pb-free-materials-7-project-call/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250903T140000Z
DTEND:20250903T150000Z
DTSTAMP:20260418T003945
CREATED:20250813T150543Z
LAST-MODIFIED:20250813T150543Z
UID:36646-1756890000-1756893600@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project Kickoff
DESCRIPTION:Thin Dielectric Skew Project Kickoff 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-kickoff-5/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250902T170000Z
DTEND:20250902T180000Z
DTSTAMP:20260418T003945
CREATED:20250806T170657Z
LAST-MODIFIED:20250806T170657Z
UID:36464-1756814400-1756818000@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluation Projects
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluation-projects/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250902T150000Z
DTEND:20250902T160000Z
DTSTAMP:20260418T003945
CREATED:20250811T120717Z
LAST-MODIFIED:20250811T120717Z
UID:36553-1756807200-1756810800@hdpusergroup.org
SUMMARY:Microvia Electrical Performance
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/microvia-electrical-performance-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250902T070000Z
DTEND:20250902T080000Z
DTSTAMP:20260418T003945
CREATED:20250830T044719Z
LAST-MODIFIED:20250830T044719Z
UID:37115-1756778400-1756782000@hdpusergroup.org
SUMMARY:HDP Call with ASKPCB
DESCRIPTION:Call with ASKPCB 
URL:https://hdpusergroup.org/event/hdp-call-with-askpcb/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250829T170000Z
DTEND:20250829T180000Z
DTSTAMP:20260418T003945
CREATED:20250826T154843Z
LAST-MODIFIED:20250826T154843Z
UID:36943-1756468800-1756472400@hdpusergroup.org
SUMMARY:AV Test For Nov 2025 Member Meeting at The Hub Murray Hill
DESCRIPTION:Member Meeting Prep. \nI plan to arrive at the hotel at 1 PM. I should be on-line by 1:10 PM. I need a couple of remote attendees to fully test the setup. Please join if you can.  \nThanks\, \nMadan  
URL:https://hdpusergroup.org/event/av-test-for-nov-2025-member-meeting-at-the-hub-murray-hill/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250828T160000Z
DTEND:20250828T170000Z
DTSTAMP:20260418T003945
CREATED:20250807T170453Z
LAST-MODIFIED:20250807T170453Z
UID:36505-1756378800-1756382400@hdpusergroup.org
SUMMARY:Copper Surface Model
DESCRIPTION:Move  to closeout 
URL:https://hdpusergroup.org/event/copper-surface-model/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250828T150000Z
DTEND:20250828T160000Z
DTSTAMP:20260418T003945
CREATED:20250814T202313Z
LAST-MODIFIED:20250814T202313Z
UID:36702-1756375200-1756378800@hdpusergroup.org
SUMMARY:PCB Flatness at Large Package Attach Locations
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pcb-flatness-at-large-package-attach-locations/
CATEGORIES:PCB Flatness for LG Mod Attach
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250828T140000Z
DTEND:20250828T150000Z
DTSTAMP:20260418T003945
CREATED:20250806T142754Z
LAST-MODIFIED:20250806T142754Z
UID:36460-1756371600-1756375200@hdpusergroup.org
SUMMARY:CAF eq
DESCRIPTION:Progress on writing final report 
URL:https://hdpusergroup.org/event/caf-eq-7/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250828T000000Z
DTEND:20250828T010000Z
DTSTAMP:20260418T003945
CREATED:20250814T004025Z
LAST-MODIFIED:20250814T004025Z
UID:36673-1756321200-1756324800@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-7/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250827T230000Z
DTEND:20250828T000000Z
DTSTAMP:20260418T003945
CREATED:20250730T233722Z
LAST-MODIFIED:20250730T233722Z
UID:36363-1756317600-1756321200@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Updates from JPC and GCE 
URL:https://hdpusergroup.org/event/porosity-24/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250827T160000Z
DTEND:20250827T170000Z
DTSTAMP:20260418T003945
CREATED:20250812T162444Z
LAST-MODIFIED:20250812T162444Z
UID:36580-1756292400-1756296000@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-36/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250826T190000Z
DTEND:20250826T200000Z
DTSTAMP:20260418T003945
CREATED:20250825T213615Z
LAST-MODIFIED:20250825T213615Z
UID:36939-1756216800-1756220400@hdpusergroup.org
SUMMARY:Discussion with Neil
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/discussion-with-neil/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250825T140000Z
DTEND:20250825T150000Z
DTSTAMP:20260418T003945
CREATED:20250822T143437Z
LAST-MODIFIED:20250822T143437Z
UID:36909-1756112400-1756116000@hdpusergroup.org
SUMMARY:Call with Mike to discuss close out
DESCRIPTION:Discuss Cu Surface Roughness close out 
URL:https://hdpusergroup.org/event/call-with-mike-to-discuss-close-out/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250823T130000Z
DTEND:20250822T140000Z
DTSTAMP:20260418T003945
CREATED:20250819T160822Z
LAST-MODIFIED:20250819T160822Z
UID:36764-1755936000-1755936000@hdpusergroup.org
SUMMARY:Testing Kevin Notices
DESCRIPTION:Testing meeting notices with Kevin Knadle 
URL:https://hdpusergroup.org/event/testing-kevin-notices/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250823T020000Z
DTEND:20250822T030000Z
DTSTAMP:20260418T003945
CREATED:20250819T160920Z
LAST-MODIFIED:20250819T160920Z
UID:36765-1755896400-1755896400@hdpusergroup.org
SUMMARY:Testing Kevin Notices
DESCRIPTION:Testing meeting notices with Kevin Knadle 
URL:https://hdpusergroup.org/event/testing-kevin-notices-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250822T020000Z
DTEND:20250822T030000Z
DTSTAMP:20260418T003945
CREATED:20250821T195447Z
LAST-MODIFIED:20250821T195447Z
UID:36892-1755810000-1755813600@hdpusergroup.org
SUMMARY:Test meeting
DESCRIPTION:Looking for the two notices 
URL:https://hdpusergroup.org/event/test-meeting-4/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250821T210000Z
DTEND:20250821T220000Z
DTSTAMP:20260418T003945
CREATED:20250807T231217Z
LAST-MODIFIED:20250807T231217Z
UID:36518-1755792000-1755795600@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-22/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250821T193000Z
DTEND:20250821T203000Z
DTSTAMP:20260418T003945
CREATED:20250821T175908Z
LAST-MODIFIED:20250821T175908Z
UID:36890-1755786600-1755790200@hdpusergroup.org
SUMMARY:Meeting ics problem
DESCRIPTION:Call to record Jim's screen. Attend if you can. 
URL:https://hdpusergroup.org/event/meeting-ics-problem/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250821T160000Z
DTEND:20250821T170000Z
DTSTAMP:20260418T003945
CREATED:20250724T162327Z
LAST-MODIFIED:20250724T162327Z
UID:36344-1755774000-1755777600@hdpusergroup.org
SUMMARY:Single Surface Finish 2
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-13/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250821T150000Z
DTEND:20250821T160000Z
DTSTAMP:20260418T003945
CREATED:20250807T142849Z
LAST-MODIFIED:20250807T142849Z
UID:36496-1755770400-1755774000@hdpusergroup.org
SUMMARY:ECM-4
DESCRIPTION:ECM Phase 4 Project Meeting 
URL:https://hdpusergroup.org/event/ecm-4-10/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250821T140000Z
DTEND:20250821T150000Z
DTSTAMP:20260418T003945
CREATED:20250731T014639Z
LAST-MODIFIED:20250731T014639Z
UID:36260-1755766800-1755770400@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact SMTAi Paper Review
DESCRIPTION:Reflow Cycle Via Reliability Impact SMTAi Paper Review 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-smtai-paper-review-2/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250821T130000Z
DTEND:20250821T140000Z
DTSTAMP:20260418T003945
CREATED:20250812T171408Z
LAST-MODIFIED:20250812T171408Z
UID:36367-1755763200-1755766800@hdpusergroup.org
SUMMARY:HDP D-Coupon IST CITC Reliability Testing
DESCRIPTION:D-Coupon IST CITC Reliability Testing project meeting 
URL:https://hdpusergroup.org/event/hdp-d-coupon-ist-citc-reliability-testing/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250821T010000Z
DTEND:20250821T020000Z
DTSTAMP:20260418T003945
CREATED:20250731T010920Z
LAST-MODIFIED:20250731T010920Z
UID:36364-1755720000-1755723600@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-23/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250820T160000Z
DTEND:20250820T170000Z
DTSTAMP:20260418T003945
CREATED:20250709T161853Z
LAST-MODIFIED:20250709T161853Z
UID:36256-1755687600-1755691200@hdpusergroup.org
SUMMARY:Sequential Lamination
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-23/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR