BEGIN:VCALENDAR
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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20250309T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20251102T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20250916T170000Z
DTEND:20250916T180000Z
DTSTAMP:20260417T204538
CREATED:20250905T130039Z
LAST-MODIFIED:20250905T130039Z
UID:37154-1758024000-1758027600@hdpusergroup.org
SUMMARY:Proposed HDP Cleaning Project
DESCRIPTION:Component sizes are climbing – 90 x 100\, 100 x 100\, even 165 x 165 mm2.  Current no-clean flux chemistries may not meet the requirements of all OEMs/customers. How is our industry going to deal with this?  In some instances\, cleaner raw materials for fluxes\, etc. will be sufficient\, but not in others. That inevitably leaves companies with the task of cleaning. What chemistries\, equipment and process parameters are required to clean under a 100 x 100 mm2 component with\, for example\, a 0.4 mm pitch and minimal standoff?  \nDo we have custom-made glass components (expensive) manufactured\, use traditional dummy components\, use FR4 “sandwiches”\, or transparent plastic held on with glue only? The latter begs the question; do we go for BGA/CSP or QFN/LGA standoffs? Traditional aqueous\, semi-aqueous\, solvent-based and/or something like super critical fluid cleaning?   The project will NOT compare chemistries or equipment types to determine which is “best”.  The team will strive to develop a focused plan that can be executed by team member companies in a reasonable time period. \nIf interested\, please join a Webex meeting where the possibility of an HDPUG-lead project will be discussed. All in the electronics industry are invited to participate for at least the planning portion of the project.   \n  
URL:https://hdpusergroup.org/event/proposed-hdp-cleaning-project/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250911T140000Z
DTEND:20250911T150000Z
DTSTAMP:20260417T204538
CREATED:20250827T162132Z
LAST-MODIFIED:20250827T162132Z
UID:37026-1757581200-1757584800@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-37/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250910T160000Z
DTEND:20250910T170000Z
DTSTAMP:20260417T204538
CREATED:20250826T171636Z
LAST-MODIFIED:20250826T171636Z
UID:36311-1757502000-1757505600@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing 2
DESCRIPTION:Project goal is to develop a CAD translator utility that will provide analysis of local copper distribution to identify risk areas for core deformation and backdrill stub variation\, surface topography variation\, and local areas of glass stop. 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-2-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250910T150000Z
DTEND:20250910T160000Z
DTSTAMP:20260417T204538
CREATED:20250820T155309Z
LAST-MODIFIED:20250820T155309Z
UID:36834-1757498400-1757502000@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-ups
DESCRIPTION:Update in build 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-11/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250910T140000Z
DTEND:20250910T150000Z
DTSTAMP:20260417T204538
CREATED:20250821T134501Z
LAST-MODIFIED:20250821T134501Z
UID:36873-1757494800-1757498400@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing
DESCRIPTION:D-Coupon IST CITC Reliability Testing - Standard test method vs Actual PCBA reflow profiles 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-5/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250909T150000Z
DTEND:20250909T160000Z
DTSTAMP:20260417T204538
CREATED:20250814T143604Z
LAST-MODIFIED:20250814T143604Z
UID:36684-1757412000-1757415600@hdpusergroup.org
SUMMARY:Stacked Vs. Staggered Microvias
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-vs-staggered-microvias-8/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250909T140000Z
DTEND:20250909T150000Z
DTSTAMP:20260417T204538
CREATED:20250904T144640Z
LAST-MODIFIED:20250904T144640Z
UID:36886-1757408400-1757412000@hdpusergroup.org
SUMMARY:ECM-4
DESCRIPTION:Develop a test method which can measure the propensity of poor soldermask coverage to corrosion. 
URL:https://hdpusergroup.org/event/ecm-4-11/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250908T150000Z
DTEND:20250908T160000Z
DTSTAMP:20260417T204538
CREATED:20250818T160513Z
LAST-MODIFIED:20250818T160513Z
UID:36739-1757325600-1757329200@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-70/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250904T160000Z
DTEND:20250904T170000Z
DTSTAMP:20260417T204538
CREATED:20250814T165214Z
LAST-MODIFIED:20250814T165214Z
UID:36696-1756983600-1756987200@hdpusergroup.org
SUMMARY:TCE Materials x-Y test method validation
DESCRIPTION:Review test parameters. \nfinalize particpants \nRequest implementation 
URL:https://hdpusergroup.org/event/tce-materials-x-y-test-method-validation/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250904T150000Z
DTEND:20250904T160000Z
DTSTAMP:20260417T204538
CREATED:20250821T161200Z
LAST-MODIFIED:20250821T161200Z
UID:36888-1756980000-1756983600@hdpusergroup.org
SUMMARY:Single Surface Finish 2
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-15/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250904T140000Z
DTEND:20250904T150000Z
DTSTAMP:20260417T204538
CREATED:20250821T141943Z
LAST-MODIFIED:20250821T141943Z
UID:36876-1756976400-1756980000@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact SMTAi Paper Review
DESCRIPTION:Reflow Cycle Via Reliability Impact SMTAi Paper Review 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-smtai-paper-review-3/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250904T010000Z
DTEND:20250904T020000Z
DTSTAMP:20260417T204538
CREATED:20250821T011708Z
LAST-MODIFIED:20250821T011708Z
UID:36865-1756929600-1756933200@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-24/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250903T160000Z
DTEND:20250903T170000Z
DTSTAMP:20260417T204538
CREATED:20250820T164504Z
LAST-MODIFIED:20250820T164504Z
UID:36837-1756897200-1756900800@hdpusergroup.org
SUMMARY:Sequential Lamination Project Call
DESCRIPTION:Sequential Lamination Project Call 
URL:https://hdpusergroup.org/event/sequential-lamination-project-call/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250903T150000Z
DTEND:20250903T160000Z
DTSTAMP:20260417T204538
CREATED:20250820T164134Z
LAST-MODIFIED:20250820T164134Z
UID:36836-1756893600-1756897200@hdpusergroup.org
SUMMARY:Pb Free Materials 7  Project Call
DESCRIPTION:Pb Free Materials 7  Project call 
URL:https://hdpusergroup.org/event/pb-free-materials-7-project-call/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250903T140000Z
DTEND:20250903T150000Z
DTSTAMP:20260417T204538
CREATED:20250813T150543Z
LAST-MODIFIED:20250813T150543Z
UID:36646-1756890000-1756893600@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project Kickoff
DESCRIPTION:Thin Dielectric Skew Project Kickoff 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-kickoff-5/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250902T170000Z
DTEND:20250902T180000Z
DTSTAMP:20260417T204538
CREATED:20250806T170657Z
LAST-MODIFIED:20250806T170657Z
UID:36464-1756814400-1756818000@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluation Projects
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluation-projects/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250902T150000Z
DTEND:20250902T160000Z
DTSTAMP:20260417T204538
CREATED:20250811T120717Z
LAST-MODIFIED:20250811T120717Z
UID:36553-1756807200-1756810800@hdpusergroup.org
SUMMARY:Microvia Electrical Performance
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/microvia-electrical-performance-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250902T070000Z
DTEND:20250902T080000Z
DTSTAMP:20260417T204538
CREATED:20250830T044719Z
LAST-MODIFIED:20250830T044719Z
UID:37115-1756778400-1756782000@hdpusergroup.org
SUMMARY:HDP Call with ASKPCB
DESCRIPTION:Call with ASKPCB 
URL:https://hdpusergroup.org/event/hdp-call-with-askpcb/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250829T170000Z
DTEND:20250829T180000Z
DTSTAMP:20260417T204538
CREATED:20250826T154843Z
LAST-MODIFIED:20250826T154843Z
UID:36943-1756468800-1756472400@hdpusergroup.org
SUMMARY:AV Test For Nov 2025 Member Meeting at The Hub Murray Hill
DESCRIPTION:Member Meeting Prep. \nI plan to arrive at the hotel at 1 PM. I should be on-line by 1:10 PM. I need a couple of remote attendees to fully test the setup. Please join if you can.  \nThanks\, \nMadan  
URL:https://hdpusergroup.org/event/av-test-for-nov-2025-member-meeting-at-the-hub-murray-hill/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250828T160000Z
DTEND:20250828T170000Z
DTSTAMP:20260417T204538
CREATED:20250807T170453Z
LAST-MODIFIED:20250807T170453Z
UID:36505-1756378800-1756382400@hdpusergroup.org
SUMMARY:Copper Surface Model
DESCRIPTION:Move  to closeout 
URL:https://hdpusergroup.org/event/copper-surface-model/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250828T150000Z
DTEND:20250828T160000Z
DTSTAMP:20260417T204538
CREATED:20250814T202313Z
LAST-MODIFIED:20250814T202313Z
UID:36702-1756375200-1756378800@hdpusergroup.org
SUMMARY:PCB Flatness at Large Package Attach Locations
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pcb-flatness-at-large-package-attach-locations/
CATEGORIES:PCB Flatness for LG Mod Attach
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250828T140000Z
DTEND:20250828T150000Z
DTSTAMP:20260417T204538
CREATED:20250806T142754Z
LAST-MODIFIED:20250806T142754Z
UID:36460-1756371600-1756375200@hdpusergroup.org
SUMMARY:CAF eq
DESCRIPTION:Progress on writing final report 
URL:https://hdpusergroup.org/event/caf-eq-7/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250828T000000Z
DTEND:20250828T010000Z
DTSTAMP:20260417T204538
CREATED:20250814T004025Z
LAST-MODIFIED:20250814T004025Z
UID:36673-1756321200-1756324800@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-7/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250827T230000Z
DTEND:20250828T000000Z
DTSTAMP:20260417T204538
CREATED:20250730T233722Z
LAST-MODIFIED:20250730T233722Z
UID:36363-1756317600-1756321200@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Updates from JPC and GCE 
URL:https://hdpusergroup.org/event/porosity-24/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250827T160000Z
DTEND:20250827T170000Z
DTSTAMP:20260417T204538
CREATED:20250812T162444Z
LAST-MODIFIED:20250812T162444Z
UID:36580-1756292400-1756296000@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-36/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250826T190000Z
DTEND:20250826T200000Z
DTSTAMP:20260417T204538
CREATED:20250825T213615Z
LAST-MODIFIED:20250825T213615Z
UID:36939-1756216800-1756220400@hdpusergroup.org
SUMMARY:Discussion with Neil
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/discussion-with-neil/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250825T140000Z
DTEND:20250825T150000Z
DTSTAMP:20260417T204538
CREATED:20250822T143437Z
LAST-MODIFIED:20250822T143437Z
UID:36909-1756112400-1756116000@hdpusergroup.org
SUMMARY:Call with Mike to discuss close out
DESCRIPTION:Discuss Cu Surface Roughness close out 
URL:https://hdpusergroup.org/event/call-with-mike-to-discuss-close-out/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250823T130000Z
DTEND:20250822T140000Z
DTSTAMP:20260417T204538
CREATED:20250819T160822Z
LAST-MODIFIED:20250819T160822Z
UID:36764-1755936000-1755936000@hdpusergroup.org
SUMMARY:Testing Kevin Notices
DESCRIPTION:Testing meeting notices with Kevin Knadle 
URL:https://hdpusergroup.org/event/testing-kevin-notices/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250823T020000Z
DTEND:20250822T030000Z
DTSTAMP:20260417T204538
CREATED:20250819T160920Z
LAST-MODIFIED:20250819T160920Z
UID:36765-1755896400-1755896400@hdpusergroup.org
SUMMARY:Testing Kevin Notices
DESCRIPTION:Testing meeting notices with Kevin Knadle 
URL:https://hdpusergroup.org/event/testing-kevin-notices-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250822T020000Z
DTEND:20250822T030000Z
DTSTAMP:20260417T204538
CREATED:20250821T195447Z
LAST-MODIFIED:20250821T195447Z
UID:36892-1755810000-1755813600@hdpusergroup.org
SUMMARY:Test meeting
DESCRIPTION:Looking for the two notices 
URL:https://hdpusergroup.org/event/test-meeting-4/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR