BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20200308T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20201101T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20200727T150000Z
DTEND:20200727T160000Z
DTSTAMP:20260610T173824
CREATED:20200714T125033Z
LAST-MODIFIED:20200714T125033Z
UID:17677-1595844000-1595847600@hdpusergroup.org
SUMMARY:Reliability and Power Cycles telecom
DESCRIPTION:Reliability and Power Cycles telecom 
URL:https://hdpusergroup.org/event/reliability-and-power-cycles-telecom-3/
CATEGORIES:Reliability and Power Cycles
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200723T200000Z
DTEND:20200723T210000Z
DTSTAMP:20260610T173824
CREATED:20200714T115931Z
LAST-MODIFIED:20200714T115931Z
UID:17676-1595516400-1595520000@hdpusergroup.org
SUMMARY:Photonic
DESCRIPTION:Talk about detailed Word "how-to" document. 
URL:https://hdpusergroup.org/event/photonic/
CATEGORIES:Photonic Soldering
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200723T150000Z
DTEND:20200723T160000Z
DTSTAMP:20260610T173824
CREATED:20200708T155141Z
LAST-MODIFIED:20200708T155141Z
UID:17666-1595498400-1595502000@hdpusergroup.org
SUMMARY:Materials #6 Call
DESCRIPTION:Meeting \n  
URL:https://hdpusergroup.org/event/materials-6-call-7/
CATEGORIES:Lead Free PWB Materials Reliability Phase 6
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200722T140000Z
DTEND:20200722T150000Z
DTSTAMP:20260610T173824
CREATED:20200721T125420Z
LAST-MODIFIED:20200721T125420Z
UID:17704-1595408400-1595412000@hdpusergroup.org
SUMMARY:Logo Call
DESCRIPTION:Logo usage document call. 
URL:https://hdpusergroup.org/event/logo-call-10/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200721T150000Z
DTEND:20200721T160000Z
DTSTAMP:20260610T173824
CREATED:20200714T125305Z
LAST-MODIFIED:20200714T125305Z
UID:17678-1595325600-1595329200@hdpusergroup.org
SUMMARY:Backdrill Under BGA
DESCRIPTION:Backdrill Under BGA 
URL:https://hdpusergroup.org/event/backdrill-under-bga-5/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200716T160000Z
DTEND:20200716T170000Z
DTSTAMP:20260610T173824
CREATED:20200617T205530Z
LAST-MODIFIED:20200617T205530Z
UID:17557-1594897200-1594900800@hdpusergroup.org
SUMMARY:ECM2 Project call
DESCRIPTION:ECM2 Project callHosted by HDP StaffThursday\, Jul 16\, 2020 11:00 am | 1 hour | (UTC-05:00) Central Time (US & Canada)Meeting number: 126 051 0084Password: MDnCT6MYi55https://hdpug.webex.com/hdpug/j.php?MTID=m15dc711e1d5610a80dd0ad91f8ee4cffJoin by video systemDial 1260510084@hdpug.webex.comYou can also dial 173.243.2.68 and enter your meeting number.Join by phone1-650-479-3208 Call-in toll number (US/Canada)Access code: 126 051 0084 
URL:https://hdpusergroup.org/event/ecm2-project-call-13/
CATEGORIES:Electro-Chemical Migration 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200716T150000Z
DTEND:20200716T160000Z
DTSTAMP:20260610T173824
CREATED:20200617T204406Z
LAST-MODIFIED:20200617T204406Z
UID:17508-1594893600-1594897200@hdpusergroup.org
SUMMARY:SAC Aging 3-84 Meeting
DESCRIPTION:SAC Aging 3-84Hosted by HDP StaffThursday\, Jul 16\, 2020 10:00 am | 1 hour | (UTC-05:00) Central Time (US & Canada)Meeting number: 126 153 4284Password: 333CppKjanPhttps://hdpug.webex.com/hdpug/j.php?MTID=m35445a81e2a6f4e6a0f688d78af971aeJoin by video systemDial 1261534284@hdpug.webex.comYou can also dial 173.243.2.68 and enter your meeting number.Join by phone1-650-479-3208 Call-in toll number (US/Canada)Access code: 126 153 4284 
URL:https://hdpusergroup.org/event/sac-aging-3-84-meeting-7/
CATEGORIES:SAC Aging 3 84
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200715T150000Z
DTEND:20200715T160000Z
DTSTAMP:20260610T173824
CREATED:20200617T204647Z
LAST-MODIFIED:20200617T204647Z
UID:17506-1594807200-1594810800@hdpusergroup.org
SUMMARY:Automotive PWB – kick off meeting
DESCRIPTION:Automotive PWB – kick off meetingHosted by HDP StaffWednesday\, Jul 15\, 2020 10:00 am | 1 hour | (UTC-05:00) Central Time (US & Canada)Meeting number: 126 885 9406Password: jQBEmwfW553https://hdpug.webex.com/hdpug/j.php?MTID=mcbe7dfbf94439165b3ec82097922bc52Join by video systemDial 1268859406@hdpug.webex.comYou can also dial 173.243.2.68 and enter your meeting number.Join by phone1-650-479-3208 Call-in toll number (US/Canada)Access code: 126 885 9406 
URL:https://hdpusergroup.org/event/automotive-pwb-placeholder-july-15-1100-am-100-pm-edt/
CATEGORIES:Automotive PCB – Hi Voltage/Hi Current
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200713T150000Z
DTEND:20200713T160000Z
DTSTAMP:20260610T173824
CREATED:20200630T121853Z
LAST-MODIFIED:20200630T121853Z
UID:17615-1594634400-1594638000@hdpusergroup.org
SUMMARY:Reliability and Power Cycles telecom
DESCRIPTION:Reliability and Power Cycles telecom 
URL:https://hdpusergroup.org/event/reliability-and-power-cycles-telecom-2/
CATEGORIES:Reliability and Power Cycles
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200709T200000Z
DTEND:20200709T210000Z
DTSTAMP:20260610T173824
CREATED:20200628T142907Z
LAST-MODIFIED:20200628T142907Z
UID:17611-1594306800-1594310400@hdpusergroup.org
SUMMARY:Photonics
DESCRIPTION:Next update 
URL:https://hdpusergroup.org/event/photonics/
CATEGORIES:Photonic Soldering
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200709T180000Z
DTEND:20200709T190000Z
DTSTAMP:20260610T173824
CREATED:20200626T173327Z
LAST-MODIFIED:20200626T173327Z
UID:17588-1594299600-1594303200@hdpusergroup.org
SUMMARY:DISC2A
DESCRIPTION:Team leader? \nStatus of Hua’s lab? \nSamples avaiable/need to be built? \nWork on PowerPoit with details 
URL:https://hdpusergroup.org/event/disc2a-7/
CATEGORIES:Digital Speckle Correlation (DSC) 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200709T170000Z
DTEND:20200709T180000Z
DTSTAMP:20260610T173824
CREATED:20200618T195708Z
LAST-MODIFIED:20200618T195708Z
UID:17583-1594296000-1594299600@hdpusergroup.org
SUMMARY:VeCS Tech Evaluation July 9\, 2020 project meeting
DESCRIPTION:VeCS Tech Evaluation July 9\, 2020 project meeting 
URL:https://hdpusergroup.org/event/vecs-tech-evaluation-july-9-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:VeCS Technology Evaluation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200709T160000Z
DTEND:20200709T170000Z
DTSTAMP:20260610T173824
CREATED:20200618T195947Z
LAST-MODIFIED:20200618T195947Z
UID:17584-1594292400-1594296000@hdpusergroup.org
SUMMARY:Cu Peel Strength July 9\, 2020 project meeting
DESCRIPTION:Cu Peel Strength July 9\, 2020 project meeting \n \n 
URL:https://hdpusergroup.org/event/cu-peel-strength-july-9-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200708T170000Z
DTEND:20200708T180000Z
DTSTAMP:20260610T173824
CREATED:20200706T190605Z
LAST-MODIFIED:20200706T190605Z
UID:17655-1594209600-1594213200@hdpusergroup.org
SUMMARY:Low Ag Alloy Solder paste July 8\, 2020 meeting
DESCRIPTION:Low Ag Alloy Solder paste July 8\, 2020 meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solder-paste-july-8-2020-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200708T160000Z
DTEND:20200708T170000Z
DTSTAMP:20260610T173824
CREATED:20200701T184601Z
LAST-MODIFIED:20200701T184601Z
UID:17642-1594206000-1594209600@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss July 8\, 2020 meeting
DESCRIPTION:Cu Surface Treatment vs Loss July 8\, 2020 meeting 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-july-8-2020-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200708T150000Z
DTEND:20200708T160000Z
DTSTAMP:20260610T173824
CREATED:20200624T160734Z
LAST-MODIFIED:20200624T160734Z
UID:17595-1594202400-1594206000@hdpusergroup.org
SUMMARY:Materials #6 Call
DESCRIPTION:Meeting \n  
URL:https://hdpusergroup.org/event/materials-6-call-6/
CATEGORIES:Lead Free PWB Materials Reliability Phase 6
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200708T010000Z
DTEND:20200708T020000Z
DTSTAMP:20260610T173824
CREATED:20200707T023652Z
LAST-MODIFIED:20200707T023652Z
UID:17505-1594152000-1594155600@hdpusergroup.org
SUMMARY:High Speed Hybrid PWB Project Call
DESCRIPTION:High Speed Hybrid PWB Project Call 
URL:https://hdpusergroup.org/event/high-speed-hybrid-pwb-project-call-19/
CATEGORIES:High Speed Hybrid PWB
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200707T170000Z
DTEND:20200707T180000Z
DTSTAMP:20260610T173824
CREATED:20200626T160003Z
LAST-MODIFIED:20200626T160003Z
UID:17606-1594123200-1594126800@hdpusergroup.org
SUMMARY:Semi-add
DESCRIPTION:Kick-off meeting! 
URL:https://hdpusergroup.org/event/semi-add/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200707T150000Z
DTEND:20200707T160000Z
DTSTAMP:20260610T173824
CREATED:20200626T145322Z
LAST-MODIFIED:20200626T145322Z
UID:17600-1594116000-1594119600@hdpusergroup.org
SUMMARY:Backdrill Under BGA telecom
DESCRIPTION:Backdrill Under BGA telecom 
URL:https://hdpusergroup.org/event/backdrill-under-bga-telecom-7/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200703T130000Z
DTEND:20200703T140000Z
DTSTAMP:20260610T173824
CREATED:20200702T144421Z
LAST-MODIFIED:20200702T144421Z
UID:17650-1593763200-1593766800@hdpusergroup.org
SUMMARY:Logo Call
DESCRIPTION:Martin\, Smitty\, Kim logo call 
URL:https://hdpusergroup.org/event/logo-call-9/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200702T140000Z
DTEND:20200702T150000Z
DTSTAMP:20260610T173824
CREATED:20200630T150224Z
LAST-MODIFIED:20200630T150224Z
UID:17621-1593680400-1593684000@hdpusergroup.org
SUMMARY:Call with NPL - Martin W
DESCRIPTION:Discuss HDP membership  
URL:https://hdpusergroup.org/event/call-with-npl-martin-w/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200701T060000Z
DTEND:20200701T070000Z
DTSTAMP:20260610T173824
CREATED:20200504T072925Z
LAST-MODIFIED:20200504T072925Z
UID:17352-1593565200-1593568800@hdpusergroup.org
SUMMARY:LVH Lifetime Predictor for TC Project Call
DESCRIPTION:LVH Lifetime Predictor for TC Project Call 
URL:https://hdpusergroup.org/event/lvh-lifetime-predictor-for-tc-project-call/
CATEGORIES:LVH Lifetime Predictor for TC
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200629T200000Z
DTEND:20200629T210000Z
DTSTAMP:20260610T173824
CREATED:20200626T211341Z
LAST-MODIFIED:20200626T211341Z
UID:17610-1593442800-1593446400@hdpusergroup.org
SUMMARY:Call with Karl to discuss budget vie
DESCRIPTION:Call with Karl 
URL:https://hdpusergroup.org/event/call-with-karl-to-discuss-budget-vie/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200629T150000Z
DTEND:20200629T160000Z
DTSTAMP:20260610T173824
CREATED:20200616T140301Z
LAST-MODIFIED:20200616T140301Z
UID:17548-1593424800-1593428400@hdpusergroup.org
SUMMARY:Reliability and Power Cycles Telecom
DESCRIPTION:Reliability and Power Cycles 
URL:https://hdpusergroup.org/event/reliability-and-power-cycles-telecom/
CATEGORIES:Reliability and Power Cycles
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200629T140000Z
DTEND:20200629T150000Z
DTSTAMP:20260610T173824
CREATED:20200623T151744Z
LAST-MODIFIED:20200623T151744Z
UID:17592-1593421200-1593424800@hdpusergroup.org
SUMMARY:LOGO Meeting
DESCRIPTION:meeting 
URL:https://hdpusergroup.org/event/logo-meeting/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200626T170000Z
DTEND:20200626T180000Z
DTSTAMP:20260610T173824
CREATED:20200622T154844Z
LAST-MODIFIED:20200622T154844Z
UID:17589-1593172800-1593176400@hdpusergroup.org
SUMMARY:Ultra Low Dk Glass telecom
DESCRIPTION:Ultra Low Dk Glass 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-telecom-4/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200626T170000Z
DTEND:20200626T180000Z
DTSTAMP:20260610T173824
CREATED:20200608T202502Z
LAST-MODIFIED:20200608T202502Z
UID:17500-1593172800-1593176400@hdpusergroup.org
SUMMARY:Ultra Low Dk Glass Analysis
DESCRIPTION:Ultra Low Dk Glass Analysis 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-analysis-7/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200625T130000Z
DTEND:20200625T180000Z
DTSTAMP:20260610T173824
CREATED:20210825T135521Z
LAST-MODIFIED:20210825T135521Z
UID:17387-1593072000-1593090000@hdpusergroup.org
SUMMARY:HDP June 2020 Automotive Technology Webinar
DESCRIPTION:To download presentations click here – https://hdpusergroup.org/published-papers/ \nPlease use the registration button on this page\, or send an email to kima77@hdpug.org with the information below to register for June 25\, 2020\, at 8:00 AM US CST HDP sponsored Automotive Electronics Technology Webinar. \nRequired registration information: \nName – \nCompany –  \nEmail – \nOptional registration information: \nTitle – \nPhone- \n \nThis no-charge Webinar is open to the public and will be an opportunity to gain information on Automotive standards and technology. \nSpeakers will include: \nJan Vardaman – TechSearch International – Moderator \nDr. Stefan Gutschling – ZVEI – Mobility Trends and their Impact on the Automotive Supply Chain \nAlun Morgan – Ventec International – Power PCB requirements for Automotive Applications \nThorsten Meyer – Infineon – Automotive Packaging Trends – Challenges and Solutions \nArthur Creidler – U.L. – Regulatory landscape for vehicle electronics and primary evaluation tools for PCB reliability demands in the new e-mobility market. \nRaj Kumar – TTM Technologies – Considerations for Automotive PCB Manufacturing \nThere will be an opportunity for questions using the chat function of Webex. Questions will be collated during the session and speakers will address as many as time permits at the end of the talks.  \nAfter registration\, you will be sent a confirmation email with Webex logistics for the call and a few weeks before the call\, a calendar reminder for the call.  \n 
URL:https://hdpusergroup.org/event/hdp-june-2020-automotive-technology-webinar/2020-06-25/
CATEGORIES:Member Meetings
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200624T180000Z
DTEND:20200624T190000Z
DTSTAMP:20260610T173824
CREATED:20200602T184125Z
LAST-MODIFIED:20200602T184125Z
UID:17488-1593003600-1593007200@hdpusergroup.org
SUMMARY:Glass Type Comparison June 24\, 2020 project meeting
DESCRIPTION:Glass Type Comparison June 24\, 2020 project meeting 
URL:https://hdpusergroup.org/event/glass-type-comparison-june-24-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200624T170000Z
DTEND:20200624T180000Z
DTSTAMP:20260610T173824
CREATED:20200618T195328Z
LAST-MODIFIED:20200618T195328Z
UID:17582-1593000000-1593003600@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste June 24\, 2020 project meeting
DESCRIPTION:Low Ag Alloy Solderpaste June 24\, 2020 project meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-june-24-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR