BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20250309T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20251102T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20251002T140000Z
DTEND:20251002T150000Z
DTSTAMP:20260417T112918
CREATED:20251002T150606Z
LAST-MODIFIED:20251002T150606Z
UID:37566-1759395600-1759399200@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing Project
DESCRIPTION:Evaluate how typical D-Coupon\, IST and CITC reliability test results can vary in relationship to the actual board assembly reflow profile used. 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-project/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251002T140000Z
DTEND:20251002T150000Z
DTSTAMP:20260417T112918
CREATED:20250910T153008Z
LAST-MODIFIED:20250910T153008Z
UID:37287-1759395600-1759399200@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing
DESCRIPTION:D-Coupon IST CITC Reliability Testing Project meeting 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-6/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251001T150000Z
DTEND:20251001T160000Z
DTSTAMP:20260417T112918
CREATED:20250904T174357Z
LAST-MODIFIED:20250904T174357Z
UID:37151-1759312800-1759316400@hdpusergroup.org
SUMMARY:Single Surface Finish 2
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-16/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251001T140000Z
DTEND:20251001T150000Z
DTSTAMP:20260417T112918
CREATED:20250909T143916Z
LAST-MODIFIED:20250909T143916Z
UID:37245-1759309200-1759312800@hdpusergroup.org
SUMMARY:ECM-4
DESCRIPTION:Develop test vehicle and test method for effectively measuring simulated environmental corrosion on assembled boards during shipment. 
URL:https://hdpusergroup.org/event/ecm-4-12/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251001T034500Z
DTEND:20251001T044500Z
DTSTAMP:20260417T112918
CREATED:20250930T142720Z
LAST-MODIFIED:20250930T142720Z
UID:37459-1759272300-1759275900@hdpusergroup.org
SUMMARY:Final Confirmation from Dan
DESCRIPTION:Need confirmation from Dan that these settings work. 
URL:https://hdpusergroup.org/event/final-confirmation-from-dan/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250930T150000Z
DTEND:20250930T160000Z
DTSTAMP:20260417T112918
CREATED:20250912T174346Z
LAST-MODIFIED:20250912T174346Z
UID:37342-1759226400-1759230000@hdpusergroup.org
SUMMARY:Microvia Electrical Performance Characterization
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/microvia-electrical-performance-characterization/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250929T150000Z
DTEND:20250929T160000Z
DTSTAMP:20260417T112918
CREATED:20250908T160708Z
LAST-MODIFIED:20250908T160708Z
UID:37169-1759140000-1759143600@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-71/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250927T030000Z
DTEND:20250927T040000Z
DTSTAMP:20260417T112918
CREATED:20250926T153627Z
LAST-MODIFIED:20250926T153627Z
UID:37389-1758924000-1758927600@hdpusergroup.org
SUMMARY:Testing Distribution List w Dan
DESCRIPTION:Testing distribution list w 5 emails. 
URL:https://hdpusergroup.org/event/testing-distribution-list-w-dan/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250926T170000Z
DTEND:20250926T180000Z
DTSTAMP:20260417T112918
CREATED:20250923T124402Z
LAST-MODIFIED:20250923T124402Z
UID:37360-1758888000-1758891600@hdpusergroup.org
SUMMARY:Cleaning Project Discussion
DESCRIPTION:Glass "components" \nNon-members who should be invited \nTeam leader 
URL:https://hdpusergroup.org/event/cleaning-project-discussion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250925T210000Z
DTEND:20250925T220000Z
DTSTAMP:20260417T112918
CREATED:20250908T224444Z
LAST-MODIFIED:20250908T224444Z
UID:36933-1758816000-1758819600@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:* Apologies – Two-Week Delay Due to Project Leader’s Urgent Matter *
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-23/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250925T160000Z
DTEND:20250925T170000Z
DTSTAMP:20260417T112918
CREATED:20250903T161600Z
LAST-MODIFIED:20250903T161600Z
UID:37137-1758798000-1758801600@hdpusergroup.org
SUMMARY:Sequential Lamination Project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-project-call-2/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250925T150000Z
DTEND:20250925T160000Z
DTSTAMP:20260417T112918
CREATED:20250910T151454Z
LAST-MODIFIED:20250910T151454Z
UID:37286-1758794400-1758798000@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-ups
DESCRIPTION:Build completed? \nCoupons sent? 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-12/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250925T031500Z
DTEND:20250925T041500Z
DTSTAMP:20260417T112918
CREATED:20250924T133450Z
LAST-MODIFIED:20250924T133450Z
UID:37370-1758752100-1758755700@hdpusergroup.org
SUMMARY:Test New Outlook with Jim
DESCRIPTION:Testing New Outlook ics file issue with Jim. 
URL:https://hdpusergroup.org/event/test-new-outlook-with-jim/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250925T000000Z
DTEND:20250925T010000Z
DTSTAMP:20260417T112918
CREATED:20250908T034744Z
LAST-MODIFIED:20250908T034744Z
UID:37044-1758740400-1758744000@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-8/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250924T150000Z
DTEND:20250924T160000Z
DTSTAMP:20260417T112918
CREATED:20250903T152848Z
LAST-MODIFIED:20250903T152848Z
UID:37135-1758708000-1758711600@hdpusergroup.org
SUMMARY:Pb Free Materials 7 Project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pb-free-materials-7-project-call-2/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250924T140000Z
DTEND:20250924T150000Z
DTSTAMP:20260417T112918
CREATED:20250917T225323Z
LAST-MODIFIED:20250917T225323Z
UID:37351-1758704400-1758708000@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Any updates on data analysis 
URL:https://hdpusergroup.org/event/better-caf-eq-50/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250924T023000Z
DTEND:20250924T033000Z
DTSTAMP:20260417T112918
CREATED:20250923T155913Z
LAST-MODIFIED:20250923T155913Z
UID:37369-1758663000-1758666600@hdpusergroup.org
SUMMARY:Test New Outlook w Larry
DESCRIPTION:Testing New Outlook and ics files with Larry 
URL:https://hdpusergroup.org/event/test-new-outlook-w-larry/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250923T150000Z
DTEND:20250923T160000Z
DTSTAMP:20260417T112918
CREATED:20250912T174102Z
LAST-MODIFIED:20250912T174102Z
UID:37341-1758621600-1758625200@hdpusergroup.org
SUMMARY:Stacked Microvia Capability Improvement
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-microvia-capability-improvement/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250918T200000Z
DTEND:20250918T210000Z
DTSTAMP:20260417T112918
CREATED:20250901T124112Z
LAST-MODIFIED:20250901T124112Z
UID:37120-1758207600-1758211200@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Status of build 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-17/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250918T160000Z
DTEND:20250918T170000Z
DTSTAMP:20260417T112918
CREATED:20250908T192332Z
LAST-MODIFIED:20250908T192332Z
UID:37180-1758193200-1758196800@hdpusergroup.org
SUMMARY:TCE Materials Test Method Validation x-y
DESCRIPTION:TCE x-y CTE method validation 
URL:https://hdpusergroup.org/event/tce-materials-test-method-validation-x-y/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250918T150000Z
DTEND:20250918T160000Z
DTSTAMP:20260417T112918
CREATED:20250828T160223Z
LAST-MODIFIED:20250828T160223Z
UID:37064-1758189600-1758193200@hdpusergroup.org
SUMMARY:PCB Flatness at Large Package Attach Locations
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pcb-flatness-at-large-package-attach-locations-2/
CATEGORIES:PCB Flatness for LG Mod Attach
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250918T130000Z
DTEND:20250918T140000Z
DTSTAMP:20260417T112918
CREATED:20250909T162757Z
LAST-MODIFIED:20250909T162757Z
UID:37246-1758182400-1758186000@hdpusergroup.org
SUMMARY:Introductory Call with Circuit Foil
DESCRIPTION:Introductory Call with Circuitfoil  
URL:https://hdpusergroup.org/event/introductory-call-with-circuit-foil/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250918T010000Z
DTEND:20250918T020000Z
DTSTAMP:20260417T112918
CREATED:20250904T012421Z
LAST-MODIFIED:20250904T012421Z
UID:37148-1758139200-1758142800@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-25/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250917T230000Z
DTEND:20250918T000000Z
DTSTAMP:20260417T112918
CREATED:20250827T233032Z
LAST-MODIFIED:20250827T233032Z
UID:37036-1758132000-1758135600@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Combining GCE and JPC results 
URL:https://hdpusergroup.org/event/porosity-25/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250916T170000Z
DTEND:20250916T180000Z
DTSTAMP:20260417T112918
CREATED:20250905T130039Z
LAST-MODIFIED:20250905T130039Z
UID:37154-1758024000-1758027600@hdpusergroup.org
SUMMARY:Proposed HDP Cleaning Project
DESCRIPTION:Component sizes are climbing – 90 x 100\, 100 x 100\, even 165 x 165 mm2.  Current no-clean flux chemistries may not meet the requirements of all OEMs/customers. How is our industry going to deal with this?  In some instances\, cleaner raw materials for fluxes\, etc. will be sufficient\, but not in others. That inevitably leaves companies with the task of cleaning. What chemistries\, equipment and process parameters are required to clean under a 100 x 100 mm2 component with\, for example\, a 0.4 mm pitch and minimal standoff?  \nDo we have custom-made glass components (expensive) manufactured\, use traditional dummy components\, use FR4 “sandwiches”\, or transparent plastic held on with glue only? The latter begs the question; do we go for BGA/CSP or QFN/LGA standoffs? Traditional aqueous\, semi-aqueous\, solvent-based and/or something like super critical fluid cleaning?   The project will NOT compare chemistries or equipment types to determine which is “best”.  The team will strive to develop a focused plan that can be executed by team member companies in a reasonable time period. \nIf interested\, please join a Webex meeting where the possibility of an HDPUG-lead project will be discussed. All in the electronics industry are invited to participate for at least the planning portion of the project.   \n  
URL:https://hdpusergroup.org/event/proposed-hdp-cleaning-project/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250911T140000Z
DTEND:20250911T150000Z
DTSTAMP:20260417T112918
CREATED:20250827T162132Z
LAST-MODIFIED:20250827T162132Z
UID:37026-1757581200-1757584800@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-37/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250910T160000Z
DTEND:20250910T170000Z
DTSTAMP:20260417T112918
CREATED:20250826T171636Z
LAST-MODIFIED:20250826T171636Z
UID:36311-1757502000-1757505600@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing 2
DESCRIPTION:Project goal is to develop a CAD translator utility that will provide analysis of local copper distribution to identify risk areas for core deformation and backdrill stub variation\, surface topography variation\, and local areas of glass stop. 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-2-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250910T150000Z
DTEND:20250910T160000Z
DTSTAMP:20260417T112918
CREATED:20250820T155309Z
LAST-MODIFIED:20250820T155309Z
UID:36834-1757498400-1757502000@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-ups
DESCRIPTION:Update in build 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-11/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250910T140000Z
DTEND:20250910T150000Z
DTSTAMP:20260417T112918
CREATED:20250821T134501Z
LAST-MODIFIED:20250821T134501Z
UID:36873-1757494800-1757498400@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing
DESCRIPTION:D-Coupon IST CITC Reliability Testing - Standard test method vs Actual PCBA reflow profiles 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-5/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250909T150000Z
DTEND:20250909T160000Z
DTSTAMP:20260417T112918
CREATED:20250814T143604Z
LAST-MODIFIED:20250814T143604Z
UID:36684-1757412000-1757415600@hdpusergroup.org
SUMMARY:Stacked Vs. Staggered Microvias
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-vs-staggered-microvias-8/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR