BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20210314T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20211107T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20210218T160000Z
DTEND:20210218T170000Z
DTSTAMP:20260512T102257
CREATED:20210128T164113Z
LAST-MODIFIED:20210128T164113Z
UID:19171-1613642400-1613646000@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing telecom
DESCRIPTION:Inner Layer Copper Balancing Telecom 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-telecom-3/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210218T020000Z
DTEND:20210218T030000Z
DTSTAMP:20260512T102257
CREATED:20210215T143516Z
LAST-MODIFIED:20210215T143516Z
UID:19271-1613592000-1613595600@hdpusergroup.org
SUMMARY:Reliability of Wettable Flank in Routable QFN for Automotive - Project call
DESCRIPTION:Call to discuss ATC testing source and member meeting plans 
URL:https://hdpusergroup.org/event/reliability-of-wettable-flank-in-routable-qfn-for-automotive-project-call-11/
CATEGORIES:Reliability of Wettable Flank in Routable QFN for Automotive
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210218T010000Z
DTEND:20210218T020000Z
DTSTAMP:20260512T102257
CREATED:20210825T233344Z
LAST-MODIFIED:20210825T233344Z
UID:18193-1613588400-1613592000@hdpusergroup.org
SUMMARY:LVH Lifetime Predictor for TC Project Call
DESCRIPTION:LVH Lifetime Predictor for TC Project Call 
URL:https://hdpusergroup.org/event/lvh-lifetime-predictor-for-tc-project-call-4/
CATEGORIES:LVH Lifetime Predictor for TC
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210217T160000Z
DTEND:20210217T170000Z
DTSTAMP:20260512T102257
CREATED:20210203T170426Z
LAST-MODIFIED:20210203T170426Z
UID:19195-1613556000-1613559600@hdpusergroup.org
SUMMARY:Materials #6 Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-6-call-16/
CATEGORIES:Lead Free PWB Materials Reliability Phase 6
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210217T150000Z
DTEND:20210217T160000Z
DTSTAMP:20260512T102257
CREATED:20210212T163238Z
LAST-MODIFIED:20210212T163238Z
UID:19248-1613552400-1613556000@hdpusergroup.org
SUMMARY:Better CAF Equation
DESCRIPTION:Members' Meeting Presentation \nAnalysis of data \nNew steps? 
URL:https://hdpusergroup.org/event/better-caf-equation-14/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210216T210000Z
DTEND:20210216T220000Z
DTSTAMP:20260512T102257
CREATED:20210205T212600Z
LAST-MODIFIED:20210205T212600Z
UID:19223-1613487600-1613491200@hdpusergroup.org
SUMMARY:Photonic Soldering
DESCRIPTION:Quarterly presentation and Final report \nIntermetallic thickness \nOther solder pastes? 
URL:https://hdpusergroup.org/event/photonic-soldering-25/
CATEGORIES:Photonic Soldering
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210216T180000Z
DTEND:20210216T190000Z
DTSTAMP:20260512T102257
CREATED:20210120T151658Z
LAST-MODIFIED:20210120T151658Z
UID:19127-1613476800-1613480400@hdpusergroup.org
SUMMARY:Harsh Use Alloy Eval 2 Call
DESCRIPTION:Call to discuss project updates 
URL:https://hdpusergroup.org/event/harsh-use-alloy-eval-2-call/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210216T160000Z
DTEND:20210216T170000Z
DTSTAMP:20260512T102257
CREATED:20210202T163745Z
LAST-MODIFIED:20210202T163745Z
UID:19192-1613469600-1613473200@hdpusergroup.org
SUMMARY:Backdril Under BGA telecom
DESCRIPTION:Backdril Under BGA telecom 
URL:https://hdpusergroup.org/event/backdril-under-bga-telecom/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210215T160000Z
DTEND:20210215T170000Z
DTSTAMP:20260512T102257
CREATED:20210126T134002Z
LAST-MODIFIED:20210126T134002Z
UID:19157-1613383200-1613386800@hdpusergroup.org
SUMMARY:Reliability and Power Cycles Telecom
DESCRIPTION:Reliability and Power Cycles Telecom 
URL:https://hdpusergroup.org/event/reliability-and-power-cycles-telecom-12/
CATEGORIES:Reliability and Power Cycles
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210212T143000Z
DTEND:20210212T153000Z
DTSTAMP:20260512T102257
CREATED:20210206T164354Z
LAST-MODIFIED:20210206T164354Z
UID:19240-1613118600-1613122200@hdpusergroup.org
SUMMARY:NPL QFN Discussion
DESCRIPTION:Discuss update on NPL status 
URL:https://hdpusergroup.org/event/npl-qfn-discussion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210211T190000Z
DTEND:20210211T200000Z
DTSTAMP:20260512T102257
CREATED:20210131T221244Z
LAST-MODIFIED:20210131T221244Z
UID:19178-1613048400-1613052000@hdpusergroup.org
SUMMARY:Cu Peel Strength Phase 2 Feb 11\, 2021 meeting
DESCRIPTION:\nContinue defining the project\n
URL:https://hdpusergroup.org/event/cu-peel-strength-phase-2-feb-11-2021-meeting/
LOCATION:WebEx
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210211T160000Z
DTEND:20210211T170000Z
DTSTAMP:20260512T102257
CREATED:20210121T160702Z
LAST-MODIFIED:20210121T160702Z
UID:19140-1613037600-1613041200@hdpusergroup.org
SUMMARY:DISC2A
DESCRIPTION:Status of negotiations with IMEC. \nThilo and Jason samples to Hua? \nIf so\, any results from Hua? 
URL:https://hdpusergroup.org/event/disc2a-21/
CATEGORIES:Digital Speckle Correlation (DSC) 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210210T180000Z
DTEND:20210210T190000Z
DTSTAMP:20260512T102257
CREATED:20210120T193257Z
LAST-MODIFIED:20210120T193257Z
UID:19135-1612958400-1612962000@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste BGA Feb 10\, 2021 meeting
DESCRIPTION:Low Ag Alloy Solderpaste BGA Feb 10\, 2021 meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-bga-feb-10-2021-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210209T200000Z
DTEND:20210209T210000Z
DTSTAMP:20260512T102257
CREATED:20210128T152904Z
LAST-MODIFIED:20210128T152904Z
UID:19169-1612879200-1612882800@hdpusergroup.org
SUMMARY:PCB Feature Miniaturization
DESCRIPTION:Status of contracts \n2.6.27 possible tester? \nDesign progress 
URL:https://hdpusergroup.org/event/pcb-feature-miniaturization-3/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210208T160000Z
DTEND:20210208T170000Z
DTSTAMP:20260512T102257
CREATED:20210204T231147Z
LAST-MODIFIED:20210204T231147Z
UID:19207-1612778400-1612782000@hdpusergroup.org
SUMMARY:Damaged Materials Discussion
DESCRIPTION:Discussion 
URL:https://hdpusergroup.org/event/1000am-1100am-damaged-materials-discussion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210205T210000Z
DTEND:20210205T220000Z
DTSTAMP:20260512T102257
CREATED:20210201T212341Z
LAST-MODIFIED:20210201T212341Z
UID:19188-1612537200-1612540800@hdpusergroup.org
SUMMARY:Photonic Soldering
DESCRIPTION:Paper finished? 
URL:https://hdpusergroup.org/event/photonic-soldering-24/
CATEGORIES:Photonic Soldering
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210205T160000Z
DTEND:20210205T173000Z
DTSTAMP:20260512T102257
CREATED:20210122T161109Z
LAST-MODIFIED:20210122T161109Z
UID:19144-1612519200-1612524600@hdpusergroup.org
SUMMARY:Ultra Low Dk Glass Analysis Telecom
DESCRIPTION:Ultra Low Dk Glass Analysis Telecom 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-analysis-telecom-6/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210204T160000Z
DTEND:20210204T170000Z
DTSTAMP:20260512T102257
CREATED:20210107T164956Z
LAST-MODIFIED:20210107T164956Z
UID:18962-1612432800-1612436400@hdpusergroup.org
SUMMARY:ECM2 Project call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm2-project-call-21/
CATEGORIES:Electro-Chemical Migration 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210204T140000Z
DTEND:20210204T150000Z
DTSTAMP:20260512T102257
CREATED:20201210T151817Z
LAST-MODIFIED:20201210T151817Z
UID:18887-1612425600-1612429200@hdpusergroup.org
SUMMARY:PFH Technology Phase 2
DESCRIPTION:PFH Technology Phase 2 
URL:https://hdpusergroup.org/event/pfh-technology-phase-2-2/
CATEGORIES:PFH Technology 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210203T160000Z
DTEND:20210203T170000Z
DTSTAMP:20260512T102257
CREATED:20210106T162941Z
LAST-MODIFIED:20210106T162941Z
UID:18957-1612346400-1612350000@hdpusergroup.org
SUMMARY:Materials #6 Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-6-call-15/
CATEGORIES:Lead Free PWB Materials Reliability Phase 6
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210202T160000Z
DTEND:20210202T170000Z
DTSTAMP:20260512T102257
CREATED:20210119T173428Z
LAST-MODIFIED:20210119T173428Z
UID:19123-1612260000-1612263600@hdpusergroup.org
SUMMARY:Backdrill Under BGA
DESCRIPTION:Backdrill Under BGA 
URL:https://hdpusergroup.org/event/backdrill-under-bga-8/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210201T210000Z
DTEND:20210201T220000Z
DTSTAMP:20260512T102257
CREATED:20210201T162036Z
LAST-MODIFIED:20210201T162036Z
UID:19187-1612191600-1612195200@hdpusergroup.org
SUMMARY:Photonic Soldering
DESCRIPTION:Latest on x-sectioning and paper 
URL:https://hdpusergroup.org/event/photonic-soldering-23/
CATEGORIES:Photonic Soldering
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210201T150000Z
DTEND:20210201T160000Z
DTSTAMP:20260512T102257
CREATED:20210201T131310Z
LAST-MODIFIED:20210201T131310Z
UID:19180-1612170000-1612173600@hdpusergroup.org
SUMMARY:Damaged Materials Discussion
DESCRIPTION:Discussion 
URL:https://hdpusergroup.org/event/damaged-materials-discussion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210128T210000Z
DTEND:20210128T220000Z
DTSTAMP:20260512T102257
CREATED:20210121T221913Z
LAST-MODIFIED:20210121T221913Z
UID:19141-1611846000-1611849600@hdpusergroup.org
SUMMARY:Photonic Soldering
DESCRIPTION:Update on experimental work and paper 
URL:https://hdpusergroup.org/event/photonic-soldering-22/
CATEGORIES:Photonic Soldering
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210128T200000Z
DTEND:20210128T210000Z
DTSTAMP:20260512T102257
CREATED:20210114T204550Z
LAST-MODIFIED:20210114T204550Z
UID:19026-1611842400-1611846000@hdpusergroup.org
SUMMARY:Board Thickness II
DESCRIPTION:Answers from BT Han and Hua Lu on what they would do for free - or not. \nOmar's initial investigation on modeling our 4 thicknesses of board and can he get CTE of a componet as an OUTPUT rather than needing it as a fundamental parameter input of his modedling program. 
URL:https://hdpusergroup.org/event/board-thickness-ii-12/
CATEGORIES:Board Thickness Effect on ATC Reliability II
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210128T190000Z
DTEND:20210128T200000Z
DTSTAMP:20260512T102257
CREATED:20210120T192708Z
LAST-MODIFIED:20210120T192708Z
UID:19132-1611838800-1611842400@hdpusergroup.org
SUMMARY:Cu Peel Strength Phase 2 Jan 28\, 2021 meeting
DESCRIPTION:Cu Peel Strength Phase 2 Jan 28\, 2021 meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-phase-2-jan-28-2021-meeting/
LOCATION:WebEx
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210128T180000Z
DTEND:20210128T190000Z
DTSTAMP:20260512T102257
CREATED:20210113T194214Z
LAST-MODIFIED:20210113T194214Z
UID:19012-1611835200-1611838800@hdpusergroup.org
SUMMARY:Glass Type Comparison Jan 28\, 2021 project meeting
DESCRIPTION:Glass Type Comparison Jan 28\, 2021 project meeting. (NOTE: Off our regular schedule day and time due to BoD meeting on Jan 27th. 
URL:https://hdpusergroup.org/event/glass-type-comparison-jan-28-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210128T170000Z
DTEND:20210128T180000Z
DTSTAMP:20260512T102257
CREATED:20210120T191016Z
LAST-MODIFIED:20210120T191016Z
UID:19129-1611831600-1611835200@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss Jan 28\, 2021 meeting
DESCRIPTION:Cu Surface Treatment vs Loss Jan 28\, 2021 meeting 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-jan-28-2021-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210128T160000Z
DTEND:20210128T170000Z
DTSTAMP:20260512T102257
CREATED:20210112T141014Z
LAST-MODIFIED:20210112T141014Z
UID:18917-1611828000-1611831600@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing telecom
DESCRIPTION:Innerlayer Copper Balancing telecom 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-telecom-2/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210128T150000Z
DTEND:20210128T160000Z
DTSTAMP:20260512T102257
CREATED:20210112T205408Z
LAST-MODIFIED:20210112T205408Z
UID:19010-1611824400-1611828000@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Where we are wrt Implementation 
URL:https://hdpusergroup.org/event/pcb-feature-min-2/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR